Patents by Inventor Sung Yeol Park

Sung Yeol Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240364021
    Abstract: According to one embodiment of the present disclosure, an antenna device comprising: a plate; a first dielectric plate coupled to one surface of the plate; a plurality of radiation elements arranged along a first direction on the first dielectric plate; and a plurality of first feed lines configured to supply power to the plurality of radiation elements and having an air-strip line structure, wherein the first dielectric plate includes a first groove penetrating upper and lower surfaces of the first dielectric plate and configured to allow the first feed line to float therein, and the first feed line is configured to float in the first groove.
    Type: Application
    Filed: July 5, 2024
    Publication date: October 31, 2024
    Applicant: KMW INC.
    Inventors: Sung Hwan SO, Oh Seog CHOI, Yong Won SEO, Seong Man KANG, Hyoung Seok YANG, Eui Seong CHOI, Hwa Yeol JANG, Myung Hwa KIM, Jang Soon PARK, Yong Sang LEE
  • Publication number: 20240312765
    Abstract: A substrate processing apparatus including the controller are provided. The controller includes: a signal analyzer configured to detect at least one of an amplitude, phase, and frequency of a first signal, which is provided to a chamber; a radio frequency (RF) signal generator configured to generate an RF signal with a natural frequency based on a power of the first signal; a harmonic controller configured to generate a second signal based on the power of the first signal and at least one of the amplitude, phase, and frequency of the first signal, the second signal having a different amplitude, a different phase, and/or a different frequency from the RF signal; an operator configured to perform an operation on the RF signal and the second signal; and a filter configured to generate an RF control signal by filtering an output signal of the operator.
    Type: Application
    Filed: March 8, 2024
    Publication date: September 19, 2024
    Applicants: Samsung Electronics Co., Ltd., NEW POWER PLASMA CO.,LTD.
    Inventors: Kyung Min LEE, Myung Jae YOO, Sung-Yeol KIM, Sang Yeol PARK, Sung Yong LIM, Eun Suk LIM, Min Ju JEONG, Yong Won CHO
  • Publication number: 20240284030
    Abstract: The present embodiment relates to a light-emitting module comprising: a substrate; a light source which is arranged on the substrate and emits laser light; a holder arranged on the substrate; a diffuser lens arranged in the holder and over the light source; and a diffuser ring for supporting the diffuser lens, wherein the diffuser lens comprises a plurality of microlenses, and the holder comprises an opening formed above the diffuser lens and a stopping protrusion for inhibiting the diffuser lens from being separated through the opening.
    Type: Application
    Filed: April 30, 2024
    Publication date: August 22, 2024
    Inventors: Kang Yeol PARK, Hee Se LEE, Sung Phil KIM
  • Patent number: 12043148
    Abstract: An embodiment is a seat height gear system including a monopost apparatus configured to be mounted under a seat, the monopost apparatus comprising a lower post and an upper post, and a direct drive motor apparatus within the monopost apparatus, the direct drive motor apparatus including a motor and a gear unit, the gear unit including a pinion and a rack bar, the rack bar being configured to be engaged with the pinion, the motor being fixed to the lower post of the monopost apparatus, the pinion being coupled to the motor, the rack bar being fixed to an upper post of the monopost apparatus, the motor being configured to rotate the pinion, and the rack bar being configured to convert the rotation of the pinion into the linear motion.
    Type: Grant
    Filed: September 20, 2022
    Date of Patent: July 23, 2024
    Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION, DAS CO., LTD
    Inventors: Hyung-Jin Park, Gil-Ju Kim, Soo-Hyun Moon, Ju-Yeol Kong, Sung-Hak Hong, Sang-Do Park, Ga-Be Nam, Seong-Hwan Song, Yong-Tak Han, Duck-Yeol Kim
  • Patent number: 9955614
    Abstract: A sheet for shielding against electromagnetic waves and a wireless power charging device are provided. The sheet for shielding against electromagnetic waves includes a plurality of magnetic layers and an adhesive layer interposed between the plurality of magnetic layers and forming chemical bonds with an adjacent magnetic layer.
    Type: Grant
    Filed: March 4, 2016
    Date of Patent: April 24, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Doo Ho Park, Jung Young Cho, Jong Ho Chung, Sung Yeol Park, Sung Nam Cho, Seung Min Lee, Seung Hee Oh
  • Patent number: 9813114
    Abstract: A sheet for shielding electromagnetic waves includes a magnetic sheet formed of a metal ribbon. The magnetic sheet includes fractures disposed in a plurality of cracked portions comprising a plurality of metal ribbon fragments.
    Type: Grant
    Filed: April 28, 2016
    Date of Patent: November 7, 2017
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung Hee Oh, Doo Ho Park, Jung Young Cho, Jong Ho Chung, Jung Wook Seo, Sung Yeol Park, Sung Nam Cho, Seung Min Lee
  • Publication number: 20160345472
    Abstract: A sheet for shielding against electromagnetic waves and a wireless power charging device are provided. The sheet for shielding against electromagnetic waves includes a plurality of magnetic layers and an adhesive layer interposed between the plurality of magnetic layers and forming chemical bonds with an adjacent magnetic layer.
    Type: Application
    Filed: March 4, 2016
    Publication date: November 24, 2016
    Inventors: Doo Ho PARK, Jung Young CHO, Jong Ho CHUNG, Sung Yeol PARK, Sung Nam CHO, Seung Min LEE, Seung Hee OH
  • Publication number: 20160345474
    Abstract: A sheet for shielding electromagnetic waves includes a magnetic sheet formed of a metal ribbon. The magnetic sheet includes fractures disposed in a plurality of cracked portions comprising a plurality of metal ribbon fragments.
    Type: Application
    Filed: April 28, 2016
    Publication date: November 24, 2016
    Inventors: Seung Hee OH, Doo Ho PARK, Jung Young CHO, Jong Ho CHUNG, Jung Wook SEO, Sung Yeol PARK, Sung Nam CHO, Seung Min LEE
  • Publication number: 20160183372
    Abstract: A printed circuit board includes: at least one insulating layer; and a pattern layer disposed on at least one surface of the at least one insulating layer, wherein the pattern layer comprises a circuit pattern and a residual pattern which is electrically disconnected from the circuit pattern.
    Type: Application
    Filed: October 16, 2015
    Publication date: June 23, 2016
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Sung Yeol PARK
  • Publication number: 20160133553
    Abstract: A printed circuit board includes: an insulation layer including circuit patterns, the circuit patterns having a groove formed therein; a metal protection layer (disposed in the groove; a solder resist layer disposed on the insulation layer and having an opening exposing the circuit patterns; and a solder bump disposed on the opening.
    Type: Application
    Filed: November 9, 2015
    Publication date: May 12, 2016
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventor: Sung Yeol PARK
  • Patent number: 9192050
    Abstract: Disclosed herein is a method of manufacturing a printed circuit board, including; forming an electronic component including an electrode that is formed on at least one side of a body; forming terminals on an upper portion of the electrode and an upper portion of the body; providing a substrate in which a cavity is formed; mounting the electronic component formed with the terminals in the cavity of the substrate; and forming a buildup layer on an upper portion of the substrate and an upper portion of the electronic component.
    Type: Grant
    Filed: February 12, 2013
    Date of Patent: November 17, 2015
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sung Yeol Park, Suk Jin Ham, Jung Tae Park, Seung Heon Han, Jung Eun Noh
  • Patent number: 9099251
    Abstract: The present invention relates to an energy storage apparatus capable of preventing performance degradation by reducing resistance during movement of charges between layers in a multilayer capacitor with very high capacity includes: a plurality of cathode layers for storing positive charges; a plurality of anode layers for storing negative charges; a plurality of separation layers for electrically separating the cathode layers and the anode layers; a cathode hole for introducing the positive charge into the cathode layer from the outside or discharging the positive charge from the cathode layer to the outside; an anode hole for introducing the negative charge into the anode layer from the outside or discharging the negative charge from the anode layer to the outside; a cathode conducting unit for moving the positive charge; and an anode conducting unit for moving the negative charge.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: August 4, 2015
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sung Yeol Park, Yeong Su Cho
  • Patent number: 9030432
    Abstract: Disclosed herein a touch panel and a producing method for a via electrode. Touch sensitivity may be improved by forming a via hole in a cover glass and then filling a via electrode into the via hole to thereby narrow an interval between a touch point of a user and an electrode layer.
    Type: Grant
    Filed: March 13, 2013
    Date of Patent: May 12, 2015
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sung Yeol Park, Suk Jin Ham, Jung Eun Noh
  • Publication number: 20150042367
    Abstract: Disclosed herein are a thickness measurement device and a method for measuring a thickness. The thickness measurement device includes: a four-terminal probe including a first probe through a fourth probe which are in contact with a metal film; a contact pressure controlling unit each controlling the first probe through the fourth probe so that the metal film and the first probe through the fourth probe have the same contact pressure; a current supplying unit supplying a current to the four-terminal probe; a voltage measuring unit measuring a voltage across the four-terminal probe; and a thickness calculating unit calculating a thickness of the metal film using a current value supplied from the current supplying unit and a voltage value measured by the voltage measuring unit.
    Type: Application
    Filed: July 14, 2014
    Publication date: February 12, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ji Hoon KIM, Sung Yeol Park
  • Publication number: 20140184933
    Abstract: Disclosed herein a touch panel and a producing method for a via electrode. Touch sensitivity may be improved by forming a via hole in a cover glass and then filling a via electrode into the via hole to thereby narrow an interval between a touch point of a user and an electrode layer.
    Type: Application
    Filed: March 13, 2013
    Publication date: July 3, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD
    Inventors: Sung Yeol Park, Suk Jin Ham, Jung Eun Noh
  • Publication number: 20140184953
    Abstract: Disclosed herein is a touch panel including: a transparent substrate and an electrode pattern formed on one surface of the transparent substrate, wherein the transparent substrate has concave-convex portions formed on one surface thereof, and the electrode pattern is formed in a shape corresponding to those of the concave-convex portions on the concave-convex portions. According to the present invention, the concave-convex portions are formed on the transparent substrate to make heights of electrode patterns irregular, thereby making it possible to prevent a moiré phenomenon generated when a mesh pattern is used as the electrode pattern.
    Type: Application
    Filed: December 27, 2013
    Publication date: July 3, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jung Eun Noh, Seung Heon Han, Hee Soo Kim, Jung Tae Park, Sung Yeol Park
  • Publication number: 20140176828
    Abstract: Disclosed herein is a touch panel including a transparent substrate, a plurality of magnets positioned in both sides of the transparent substrate, ferromagnetic cores formed in one surface of the transparent substrate, and electrodes formed in one surface of the transparent substrate such that the electrodes are positioned in an outer side of the ferromagnetic cores, respectively.
    Type: Application
    Filed: December 20, 2013
    Publication date: June 26, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jung Eun Noh, Seung Heon Han, Suk Jin Ham, Jung Tae Park, Sung Yeol Park
  • Publication number: 20140158507
    Abstract: The touch panel according to a preferred embodiment of the present invention includes: a transparent substrate having one surface on which a first groove portion is formed and the other surface on which a second groove portion is formed; a first electrode formed on one surface of the transparent substrate so as to cross the first groove portion; and a second electrode formed on the other surface of the transparent substrate so as to cross the second groove portion.
    Type: Application
    Filed: February 28, 2013
    Publication date: June 12, 2014
    Applicant: Sumsung Electro-Mechanics Co., Ltd.
    Inventors: Sung Yeol Park, Suk Jin Ham, Jung Tae Park, Seung Heon Han, Jung Eun Noh
  • Publication number: 20140138138
    Abstract: Disclosed herein is a printed circuit board having an electronic component embedded therein, the printed circuit board including: the electronic component having an external electrode formed on one side surface or both side surfaces thereof; a base substrate having a cavity into which the electronic component is inserted; and at least one connection member inserted between the external electrode of the electronic component and an inner wall of the cavity to electrically connect the electronic component and the base substrate to each other.
    Type: Application
    Filed: March 14, 2013
    Publication date: May 22, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sung Yeol Park, Suk Jin Ham, Seung Heon Han
  • Publication number: 20140131083
    Abstract: Disclosed herein is a printed circuit board, including: a mounting substrate having a cavity formed therein; an electronic component inserted into the cavity; and a base substrate formed at least one of an upper part and a lower part of the electronic component, inserted into the cavity, and having an upper substrate pad and a lower substrate pad extended outwardly thereof and connected to each other.
    Type: Application
    Filed: March 15, 2013
    Publication date: May 15, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sung Yeol Park, Suk Jin Ham, Jung Eun Noh