Patents by Inventor Sung Yong

Sung Yong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Full-body modeling method and apparatus based on model predictive control with visuomotor system
    Patent number: 11282254
    Abstract: Provided is a full-body modeling method and apparatus based on new model predictive control (MPC) with a visuomotor system in which visual perception and full-body motion control are integrated. The full-body modeling method includes determining a partial observation value associated with a state of an object based on a point of sight of a character, estimating the state of the object using the determined partial observation value based on a partially observable Markov decision process (POMDP), controlling a state of the character based on the estimated state of the object, and visualizing a motion of the character.
    Type: Grant
    Filed: July 28, 2020
    Date of Patent: March 22, 2022
    Assignee: Korea Advanced Institute of Science and Technology
    Inventors: Junyong Noh, Haegwang Eom, Daseong Han, Sung Yong Shin
  • Air-cooled heat exchanger
    Patent number: 11280502
    Abstract: An air-cooled heat exchanger is provided. A reinforcement beam is laterally attached to an upper surface of a guide housing which is formed to have a dome shape having an area gradually increasing in a downward direction from the stack to guide air discharged to the stack. In another aspect, an air-cooled heat exchanger may further include an enclosure surrounding a power transmission part configured to transmit a rotation force of a motor to the fan to rotate the fan.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: March 22, 2022
    Assignee: DTS Inc.
    Inventors: Sung Yong Kim, Min Ho Jung, Ok Ki Kim
  • CHIP ANTENNA
    Publication number: 20220085485
    Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate, a first patch antenna, a second patch antenna, and a feed via. The second ceramic substrate is disposed to oppose the first ceramic substrate. The first patch antenna includes a seed layer, disposed on a surface of the first ceramic substrate, and a plating layer disposed on the seed layer. The second patch antenna disposed on the second ceramic substrate. The feed via includes a seed layer, formed along an internal wall of a via hole penetrating through the first ceramic substrate in a thickness direction, and a conductive material surrounded by the seed layer in the via hole. The seed layer of the first patch antenna and the seed layer of the feed via are connected to each other.
    Type: Application
    Filed: November 29, 2021
    Publication date: March 17, 2022
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ji Hyung JUNG, Sung Yong AN
  • Chip antenna
    Patent number: 11264703
    Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to oppose the first ceramic substrate, a first patch, disposed on the first ceramic substrate, configured to operate as a feed patch, a second patch, disposed on the second ceramic substrate, configured to operate as a radiation patch, an insertion member disposed between the first ceramic substrate and the second ceramic substrate, and a shielding layer disposed on a side surface of the insertion member.
    Type: Grant
    Filed: January 19, 2021
    Date of Patent: March 1, 2022
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sung Nam Cho, Sung Yong An, Jae Yeong Kim, Ju Hyoung Park
  • Color conversion film comprising a color conversion functional layer including a solid phase change material, and back light unit and display device comprising same
    Patent number: 11256132
    Abstract: A color conversion film having: a substrate film; and a color conversion functional layer including a solid phase change material; and a backlight unit and a display apparatus including the color conversion film.
    Type: Grant
    Filed: November 11, 2019
    Date of Patent: February 22, 2022
    Assignee: LG CHEM, LTD.
    Inventors: Sung Yong Min, Dong Mok Shin, Nari Kim, Ji Ho Kim, Hye Mi Oh
  • PHARMACEUTICAL COMBINATIONS FOR TREATING TUMOR COMPRISING ANTI-CD19 ANTIBODY AND NATURAL KILLER CELL
    Publication number: 20220047632
    Abstract: Provided is a pharmaceutical combination comprising an antibody specific for CD19 and a natural killer cell, and a treatment method using the same. Such a pharmaceutical combination is capable of exhibiting synergistic therapeutic effects on a malignant tumor of B-cell origin such as non-Hodgkin's lymphoma, chronic lymphocytic leukemia, and/or acute lymphoblastic leukemia.
    Type: Application
    Filed: September 5, 2019
    Publication date: February 17, 2022
    Inventors: Jung Hyun HER, Mi Young JUNG, Su Hyun GWON, Ho Yong LIM, Sung Yoo CHO, Sung Yong WON, Yu Kyeong HWANG, Jan ENDELL, Rainer BOXHAMMER
  • Gate fringing effect based channel formation for semiconductor device
    Patent number: 11251189
    Abstract: A memory device is described. Generally, the device includes a string of memory transistors, a source select transistor coupled to a first end of the string of memory transistor and a drain select transistor coupled to a second end of the string of memory transistor. Each memory transistor includes a gate electrode formed adjacent to a charge trapping layer and there is neither a source nor a drain junction between adjacent pairs of memory transistors or between the memory transistors and source select transistor or drain select transistor. In one embodiment, the memory transistors are spaced apart from adjacent memory transistors and the source select transistor and drain select transistor, such that channels are formed therebetween based on a gate fringing effect associated with the memory transistors. Other embodiments are also described.
    Type: Grant
    Filed: April 10, 2019
    Date of Patent: February 15, 2022
    Assignee: LONGITUDE FLASH MEMORY SOLUTIONS LTD.
    Inventors: Youseok Suh, Sung-Yong Chung, Ya-Fen Lin, Yi-Ching Jean Wu
  • Chip antenna
    Patent number: 11251518
    Abstract: A chip antenna comprises a first substrate, a second substrate overlapping the first substrate, a first patch, provided on a first surface of the first substrate a second patch, provided on the second substrate, at least one feed via penetrating through the first substrate in a thickness direction and configured to provide a feed signal to the first patch, and a bonding pad provided on a second surface of the first substrate. The first substrate comprises a dielectric substance and a magnetic substance.
    Type: Grant
    Filed: March 24, 2020
    Date of Patent: February 15, 2022
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Chin Mo Kim, Sung Yong An, Ji Hyung Jung, Jae Yeong Kim, Ju Hyoung Park, Sung Nam Cho
  • License authentication method in wireless access point, wireless access point apparatus performing said license authentication, license activation method in client apparatus, and client apparatus interworking with wireless access point
    Patent number: 11238135
    Abstract: One aspect of the present invention discloses a license authentication method in a wireless access point (AP). The method comprises receiving a license authentication request including license information from a client; calculating a distance of the client from the wireless access point in response to the received license authentication request; based on the calculated distance, determining whether the client exists within a range of allowed positions for license authentication related to license location information for allowing authentication of a license included in the license information; and determining whether to authenticate in response to the license authentication request based on the determination result.
    Type: Grant
    Filed: January 4, 2019
    Date of Patent: February 1, 2022
    Assignee: N3N CO., LTD.
    Inventors: Sung Yong Kim, Hye Yong Oh, Dae Hee Kim
  • CHIP ANTENNA
    Publication number: 20220029274
    Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on the first ceramic substrate to operate as a feed patch, and a second patch disposed on the second ceramic substrate to operate as a radiation patch. One or both of the first ceramic substrate and the second ceramic substrate include a groove, and one or both of the first patch and the second patch is disposed in the groove of the respective first ceramic substrate and second ceramic substrate and protrudes from the groove.
    Type: Application
    Filed: October 12, 2021
    Publication date: January 27, 2022
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae Yeong KIM, Sung Nam CHO, Sung Yong AN, Ji Hyung JUNG, Chin Mo KIM
  • Microbial consortia
    Patent number: 11230506
    Abstract: Disclosed herein are microbial consortia and compositions including microbes for use in agricultural or biodegradation applications. In some embodiments, soil, plants, and/or plant parts (such as seeds, seedlings, shoots, roots, leaves, fruit, stems, or branches) are contacted with a disclosed microbial consortia or composition including microbes. The microbial consortia or microbe-containing compositions may be applied to soil, plant, and/or plant parts alone or in combination with additional components (such as chitin, chitosan, glucosamine, amino acids, and/or liquid fertilizer). In additional embodiments, the disclosed microbial consortia or compositions including microbes are used in methods of degrading biological materials, such as chitin-containing biological materials.
    Type: Grant
    Filed: June 24, 2019
    Date of Patent: January 25, 2022
    Assignee: AMVAC Chemical Corporation
    Inventors: Sung-Yong H. Yoon, Kathleen Swords, D. Ry Wagner, Selvasundaram Rajagopal
  • Chip antenna and chip antenna module including the same
    Patent number: 11233336
    Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on one surface of the first ceramic substrate to operate as a feeding patch, a second patch disposed on the second ceramic substrate to operate as a radiation patch, at least one feed via penetrating through the first ceramic substrate in a thickness direction to provide a feed signal to the first patch, and a bonding pad disposed on a second surface of the first ceramic substrate opposite the first surface. A thickness of the first ceramic substrate is greater than a thickness of the second ceramic substrate.
    Type: Grant
    Filed: October 31, 2019
    Date of Patent: January 25, 2022
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ju Hyoung Park, Kyu Bum Han, Jae Yeong Kim, Jeong Ki Ryoo, Sung Nam Cho, Sung Yong An
  • Microbial consortia
    Patent number: 11230505
    Abstract: Disclosed herein are microbial consortia and compositions including microbes, for example, for use in agricultural or biodegradation applications. In some embodiments, soil, plants, and/or plant parts (such as seeds, seedlings, shoots, roots, leaves, fruit, stems, or branches) are contacted with a disclosed microbial consortia or composition including microbes. The microbial consortia or microbe-containing compositions may be applied to soil, plant, and/or plant parts alone or in combination with additional components (such as chitin, chitosan, glucosamine, amino acids, and/or liquid fertilizer). In additional embodiments, the disclosed microbial consortia or compositions including microbes are used in methods of degrading biological materials, such as chitin-containing biological materials.
    Type: Grant
    Filed: June 21, 2019
    Date of Patent: January 25, 2022
    Assignee: AMVAC Chemical Corporation
    Inventors: Sung-Yong H. Yoon, Kathleen Swords, D. Ry Wagner, Selvasundaram Rajagopal
  • CHIP ANTENNA MODULE
    Publication number: 20220021103
    Abstract: A chip antenna module includes a first dielectric layer; a solder layer disposed on a first surface of the first dielectric layer; a patch antenna pattern disposed on a second surface of the first dielectric layer; a coupling pattern disposed on the second surface of the first dielectric layer, and spaced apart from the patch antenna pattern without overlapping the patch antenna pattern in a thickness direction; a first feed via extending through the first dielectric layer in the thickness direction so as not to overlap the patch antenna pattern and the coupling pattern in the thickness direction; a first feed pattern extending from a first end of the first feed to overlap at least a portion of the coupling pattern; and a second feed pattern extending from a second end of the first feed via to overlap at least a portion of the coupling pattern.
    Type: Application
    Filed: September 29, 2021
    Publication date: January 20, 2022
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ju Hyoung PARK, Myeong Woo HAN, Jae Yeong KIM, Young Sik HUR, Sung Yong AN, Dae Ki LIM
  • Chip antenna
    Patent number: 11223100
    Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on the first ceramic substrate to operate as a feed patch, and a second patch disposed on the second ceramic substrate to operate as a radiation patch. One or both of the first ceramic substrate and the second ceramic substrate include a groove, and one or both of the first patch and the second patch is disposed in the groove of the respective first ceramic substrate and second ceramic substrate and protrudes from the groove.
    Type: Grant
    Filed: January 2, 2020
    Date of Patent: January 11, 2022
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae Yeong Kim, Sung Nam Cho, Sung Yong An, Ji Hyung Jung, Chin Mo Kim
  • Chip antenna
    Patent number: 11223133
    Abstract: A chip antenna includes a first substrate, a second substrate overlapping the first substrate, a first patch, provided on a first surface of the first substrate, operating as a feed patch, a second patch, provided on the second substrate, operating as a radiation patch, at least one feed via penetrating through the first substrate in a thickness direction and configured to provide a feed signal to the first patch, and a ground pad provided on the other surface of the first substrate. The first substrate comprises a ceramic sintered material. The ceramic sintered material comprises an Mg2SiO4 phase, an MgAl2O4 phase, and a CaTiO3 phase, and a content of the CaTiO3 phase in the ceramic sintered material ranges from 5.1 mol % to 15.1 mol %.
    Type: Grant
    Filed: February 27, 2020
    Date of Patent: January 11, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Yeong Kim, Chin Mo Kim, Ji Hyung Jung, Sung Nam Cho, Sung Yong An
  • Touch sensor and sensor array
    Patent number: 11216129
    Abstract: A touch sensor including a sensor array including a first touch node and a second touch node adjacent to each other in at least one of a first direction or a second direction, the second direction perpendicular to the first direction, the first touch node and the second touch node electrically separated from each other, each of the first touch node and the second touch node including a driving electrode and a sensing electrode, and a controller configured to output a first driving signal having a first phase to the driving electrode of the first touch node and output a second driving signal having a second phase opposite to the first phase of the first driving signal to the driving electrode of the second touch node may be provided. The controller may be further configured to output the first driving signal and the second driving signal simultaneously.
    Type: Grant
    Filed: January 9, 2020
    Date of Patent: January 4, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yoon Kyung Choi, Ki Up Kim, Jin Bong Kim, Sung Yong Cho
  • Chip antenna
    Patent number: 11211689
    Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate, a first patch antenna, a second patch antenna, and a feed via. The second ceramic substrate is disposed to oppose the first ceramic substrate. The first patch antenna includes a seed layer, disposed on a surface of the first ceramic substrate, and a plating layer disposed on the seed layer. The second patch antenna disposed on the second ceramic substrate. The feed via includes a seed layer, formed along an internal wall of a via hole penetrating through the first ceramic substrate in a thickness direction, and a conductive material surrounded by the seed layer in the via hole. The seed layer of the first patch antenna and the seed layer of the feed via are connected to each other.
    Type: Grant
    Filed: January 9, 2020
    Date of Patent: December 28, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ji Hyung Jung, Sung Yong An
  • CHIP ANTENNA
    Publication number: 20210384633
    Abstract: A chip antenna includes a first substrate, a second substrate overlapping the first substrate, a first patch, provided on a first surface of the first substrate, operating as a feed patch, a second patch, provided on the second substrate, operating as a radiation patch, at least one feed via penetrating through the first substrate in a thickness direction and configured to provide a feed signal to the first patch, and a ground pad provided on the other surface of the first substrate. The first substrate comprises a ceramic sintered material. The ceramic sintered material comprises an Mg2SiO4 phase, an MgAl2O4 phase, and a CaTiO3 phase, and a content of the CaTiO3 phase in the ceramic sintered material ranges from 5.1 mol % to 15.1 mol %.
    Type: Application
    Filed: September 1, 2021
    Publication date: December 9, 2021
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae Yeong KIM, Chin Mo KIM, Ji Hyung JUNG, Sung Nam CHO, Sung Yong AN
  • CHIP ANTENNA AND ANTENNA MODULE INCLUDING CHIP ANTENNA
    Publication number: 20210384609
    Abstract: A chip antenna is provided. The chip antenna includes a first dielectric layer; a second dielectric layer disposed on an upper surface of the first dielectric layer; a patch antenna pattern disposed in the second dielectric layer; first and second feed vias disposed to penetrate through at least one of the first and second dielectric layers, respectively and electrically connected to a corresponding feed point among different first and second feed points of the patch antenna pattern; and first and second filters disposed between the first and second dielectric layers, respectively and electrically connected to a corresponding feed via among the first and second feed vias.
    Type: Application
    Filed: September 16, 2020
    Publication date: December 9, 2021
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sung Yong AN, Joong Jin NAM, Jae Yeong KIM