Patents by Inventor Sung Yong

Sung Yong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210262469
    Abstract: A compressor may include a casing, and a compression device installed inside of the casing and that compresses the refrigerant while rotating by receiving a rotational force of an electric motor through a rotational shaft. A high/low pressure separation plate may be installed at an upper portion of the compression device, and an insulation plate may be provided to block the high/low pressure separation plate and the suction tube from each other by being located therebetween. The insulation plate may reduce heat transfer between a refrigerant discharge space having a high temperature located at the upper portion of the high/low pressure separation plate and a refrigerant suction space having a relatively low temperature located at a lower portion of the high/low pressure separation plate.
    Type: Application
    Filed: February 22, 2021
    Publication date: August 26, 2021
    Inventors: Changeol JO, Suchul KIM, Jeonghun Kim, Sung Yong Ahn
  • Publication number: 20210253802
    Abstract: Provided are thermoplastic polymer particles having an aspect ratio of 1.00 or more and less than 1.05, and a roundness of 0.95 to 1.00. The thermoplastic polymer particles are formed from a thermoplastic polymer resin in a continuous matrix phase. The thermoplastic polymer particles show a peak cold crystallization temperature (Tcc) at a temperature between a glass transition temperature (Tg) and the melting point (Tm) in a differential scanning calorimetry (DSC) curve which is derived from temperature rise analysis at 10° C./min by differential scanning calorimetry.
    Type: Application
    Filed: March 25, 2021
    Publication date: August 19, 2021
    Applicant: LG Hausys, Ltd.
    Inventors: Jae Ho Lim, Sung Yong Kang, Kyoung Min Kang, Hee-Jung Lee, Min Gyung Kim, Chang-Young Park, Jun Ho Choi, Jae Han Song, Yu Jin Go
  • Publication number: 20210257841
    Abstract: A semiconductor circuit includes a first selection circuit which selects a first battery or a first capacitor, a second selection circuit which selects a second battery or a second capacitor, a voltage measuring circuit which measures a first voltage of the first battery or the first capacitor selected by the first selection circuit, and measures a second voltage of the second battery or the second capacitor selected by the second selection circuit, a controller which compares the first voltage and the second voltage to generate a comparison result, and a switching circuit which receives a signal based on a target output voltage, connects the first battery or capacitor selected by the first selection circuit, and the second battery capacitor selected by the second selection circuit in an interconnection relationship based on the comparison result to provide to an output terminal an output voltage responsive to the target output voltage.
    Type: Application
    Filed: September 25, 2020
    Publication date: August 19, 2021
    Inventors: Sung Yong Lee, Gyu Hyeong Cho, Min Woo Ko, Tae-Hwang Kong, Sang Ho Kim
  • Publication number: 20210248287
    Abstract: A method of simulating a motion of an object controlling another object based on an example motion or a previously generated motion of the object is disclosed. The method includes refining a motion of a first object based on a motion of the first object predicted based on a motion specification, and on a trajectory of a second object controlled by the first object, and simulating the motion of the first object and the trajectory of the second object based on a vector for controlling joints of the first object that is generated based on the refined motion.
    Type: Application
    Filed: June 11, 2020
    Publication date: August 12, 2021
    Inventors: Junyong Noh, Seokpyo Hong, Daseong Han, Kyungmin Cho, Sung Yong Shin
  • Patent number: 11079728
    Abstract: Disclosed is a smart factory platform for processing data obtained in a continuous process including a first process and a second process following the first process. The smart factory platform includes a distributed parallel processing system including at least one processing unit that generates mapping data by mapping a process identification (ID) to collection data collected from the continuous process and sorts the mapping data to generate sorting data, the process ID defining a process where the collection data occurs and the sorting data being generated for association processing between pieces of collection data collected from different processes; and a big data analysis system storing the sorting data with respect to the process ID.
    Type: Grant
    Filed: August 31, 2017
    Date of Patent: August 3, 2021
    Assignee: POSCO ICT CO., LTD.
    Inventors: Won Mo Yang, Hyun Woo Yu, Eun Kgu Kim, Man Jin Park, Jang Soo Jung, Tong Ki Kim, Young Lea Lee, Seong Cheol Park, Sung Yong Lee, Kyung Ho Ku, Seung Hyun Seo, Nam Geon Yang, Woo Kyum Kim, Jin Woong Kang, Seo Yeon Hwang, In Lee
  • Patent number: 11075492
    Abstract: Disclosed herein is an adapter and an electronic system. The adapter includes a power cable, a converter arranged on one end of the power cable, and a connector arranged on another end of the power cable and configured to be connected to an electronic device, and the connector includes a connector body formed in a cylindrical shape and an inside of which includes a hollow portion, a first adapter terminal arranged on a circumferential surface of the hollow portion of the connector body, and a second adapter terminal arranged on a circumferential surface of the connector body, and configured to have a power capacity different from a power capacity of the first adapter terminal.
    Type: Grant
    Filed: November 6, 2019
    Date of Patent: July 27, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Tae Jun You, Sung Yong Joo, Seong Ho Park, Sang Goo Lee
  • Patent number: 11066341
    Abstract: Disclosed herein are microbial consortia and compositions including microbes for example for use in agricultural or biodegradation applications. In some embodiments, soil, plants, and/or plant parts (such as seeds, seedlings, shoots, roots, leaves, fruit, stems, or branches) are contacted with a disclosed microbial consortia or composition including microbes. The microbial consortia or microbe-containing compositions may be applied to soil, plant, and/or plant parts alone or in combination with additional components (such as chitin, chitosan, glucosamine, amino acids, and/or liquid fertilizer). In additional embodiments, the disclosed microbial consortia or compositions including microbes are used in methods of degrading biological materials, such as chitin-containing biological materials.
    Type: Grant
    Filed: August 31, 2016
    Date of Patent: July 20, 2021
    Assignee: AMVAC Chemical Corporation
    Inventors: Sung-Yong H. Yoon, Kathleen Swords, D. Ry Wagner, Xing Liang Liu
  • Patent number: 11069954
    Abstract: A chip antenna includes a first dielectric substrate, a second dielectric substrate spaced apart from and opposing the first dielectric substrate, a first patch disposed on the first dielectric substrate, a second patch disposed on the second dielectric substrate, and a mounting pad and a feed pad disposed on a mounting surface of the first dielectric substrate. The first dielectric substrate, mounted on a mounting substrate through the mounting pad, is electrically connected to the mounting substrate through the feed pad. One of the first dielectric substrate and the second dielectric substrate is formed of ceramic and another is formed of polytetrafluoroethylene (PTFE).
    Type: Grant
    Filed: February 12, 2020
    Date of Patent: July 20, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Chin Mo Kim, Jae Yeong Kim, Sung Yong An, Sung Nam Cho, Ji Hyung Jung
  • Patent number: 11066527
    Abstract: The present invention provides polylactic acid particles, which are formed in a continuous matrix phase from a polylactic acid resin and have a particle diameter of 1 to 100 ?m. In a differential scanning calorimetry (DSC) curve of the polylactic acid particles, derived from the analysis by DSC using a temperature rise of 10° C./min, a peak of the cold crystallization temperature (Tcc) is shown at a temperature between the glass transition temperature (Tg) and the melting point (Tm). The polylactic acid particles have an aspect ratio of more than or equal to 1.00 and less than 1.05 and a roundness of 0.95 to 1.00. The polylactic acid particles have a flow time of 20 to 30 seconds.
    Type: Grant
    Filed: March 9, 2018
    Date of Patent: July 20, 2021
    Inventors: Kyoung Min Kang, Sung Yong Kang, Hee-Jung Lee, Min Gyung Kim, Chang-Young Park, Jae Ho Lim, Jun Ho Choi, Jae Han Song, Yu Jin Go
  • Publication number: 20210201698
    Abstract: A sensory substitution method includes obtaining a color image by using a sensor device, converting color information about the color image, received from the sensor device, into tactile information by using a user terminal, and generating a tactile stimulus corresponding to the tactile information received from the user terminal by using a tactile output device.
    Type: Application
    Filed: December 23, 2020
    Publication date: July 1, 2021
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Jun Seok Park, Moo Seop Kim, Kyeong Deok Moon, Yun Kyung Park, Sung Yong Shin, Hyung Cheol Shin, Chang Mok Oh, Chi Yoon Jeong
  • Publication number: 20210189534
    Abstract: Embodiments of the disclosure relate to a ferritic alloy having excellent ability to withstand nuclear power plant accidents and a method of manufacturing a nuclear fuel cladding tube using the same. The alloy includes iron (Fe), aluminum (Al), chromium (Cr), and nickel (Ni). The nickel (Ni) may be included 0.5 to 10 wt % based on a total amount of the alloy. The chromium may be included 13 to 18 wt % based on the total amount of the alloy. The aluminum may be included 5 to 7 wt % based on the total amount of the alloy.
    Type: Application
    Filed: February 24, 2020
    Publication date: June 24, 2021
    Applicants: KEPCO NUCLEAR FUEL CO., LTD., KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Sung Yong Lee, Hun Jang, Seung Jae Lee, Yoon Ho Kim, Dae Gyun Ko, Changheui Jang, Chaewon Kim, Hyunmyung Kim
  • Patent number: 11033518
    Abstract: The present invention relates to a pharmaceutical composition containing, as an active ingredient, niclosamide or pharmaceutically acceptable salts thereof, for treating or preventing disease related to Axin-GSK3 interaction, such as familial adenomatosis polyposis (FAP). According to the present invention, familial adenomatosis polyposis (FAP) which causes pain due to lack of specific treatment methods, can be effectively treated using niclosamide, which is a safe drug approved by the FDA.
    Type: Grant
    Filed: January 9, 2018
    Date of Patent: June 15, 2021
    Assignee: BAOBAB PHARM CO., LTD.
    Inventors: Jong In Yook, Hyun Sil Kim, Nam Hee Kim, Kyoung Tai No, Ji Won Choi, Tae Il Kim, Sung Yong Ahn
  • Publication number: 20210175612
    Abstract: An antenna module includes a substrate having a first surface including a ground region and a feeder region; chip antennas mounted on the first surface of the substrate; and at least one patch antenna disposed inside of the substrate or at least partially disposed on a second surface of the substrate. The chip antennas include a body portion, a ground portion bonded to a first surface of the body portion, and a radiation portion bonded to a second surface of a body portion. The ground portion of each chip antenna is mounted on the ground region and the radiation portion of each chip antenna is mounted on the feeder region.
    Type: Application
    Filed: February 17, 2021
    Publication date: June 10, 2021
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae Yeong KIM, Sung Yong AN, Chang Hak CHOI
  • Publication number: 20210175613
    Abstract: An antenna module includes: a board having a first surface including a ground region and a feed region; and chip antennas mounted on the first surface, each of the chip antennas including a first antenna and a second antenna. The first antenna and the second antenna each include a ground portion bonded to the ground region, and a radiation portion bonded to the feed region. A length of a radiating surface of the first antenna is greater than a mounting height of the first antenna, and a mounting height of the second antenna is greater than a length of a radiating surface of the second antenna. A horizontal spacing distance between the radiation portion of the first antenna and the ground region is greater than a horizontal spacing distance between the radiation portion of the second antenna and the ground region.
    Type: Application
    Filed: February 17, 2021
    Publication date: June 10, 2021
    Applicant: Samsung Electro-Mechanics.,Co., Ltd.
    Inventors: Seong Hee CHOI, Sang Jong LEE, Sung Yong AN, Jae Yeong KIM, Ju Hyoung PARK
  • Publication number: 20210165275
    Abstract: The present specification relates to a color conversion film comprising a color conversion functional layer including a microcapsule phase change material, and a backlight unit and a display apparatus including the same.
    Type: Application
    Filed: November 11, 2019
    Publication date: June 3, 2021
    Applicant: LG CHEM, LTD.
    Inventors: Sung Yong MIN, Dong Mok SHIN, Nari KIM, Ji Ho KIM, Hye Mi OH
  • Patent number: 11025160
    Abstract: A power conversion device includes a rectifying circuit that full-wave rectifies an input AC power, a first conversion circuit that includes a passive element, a first switching element, and a second switching element and digitally converts a rectified power while compensating a power factor of the rectified power through at least one of the passive element, the first switching element, and the second switching element, a second conversion circuit that converts the digitally-converted power into a power with a specified magnitude and output the power with the specified magnitude, a device circuit that consumes an output power of the second conversion circuit, a first control circuit that monitors current consumption of the device circuit and controls an amount of output current of the second conversion circuit based on the current consumption of the device circuit, and a second control circuit that controls a power factor compensation degree of the first conversion circuit based on the current consumption, wh
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: June 1, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sung Yong Joo, Yong Joo Lee, Ka San Ha
  • Patent number: 11018418
    Abstract: A chip antenna includes a radiation portion having a block shape and a first surface and a second surface opposing each other, and configured to receive and radiate a feed signal as an electromagnetic wave; a first block made of a dielectric material and coupled to the first surface of the radiation portion; a second block made of a dielectric material and coupled to the second surface of the radiation portion; a ground portion having a block shape and coupled to the first block, and configured to reflect the electromagnetic wave radiated by the radiation portion back toward the radiation portion; and a director having a block shape and coupled to the second block, wherein an overall width of the ground portion, the first block, and the radiation portion is 2 mm or less, and the first block has a dielectric constant of 3.5 or more to 25 or less.
    Type: Grant
    Filed: November 9, 2018
    Date of Patent: May 25, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae Yeong Kim, Sung Yong An, Sang Jong Lee, Seong Hee Choi, Kyu Bum Han, Jeong Ki Ryoo, Byeong Cheol Moon, Chang Hak Choi
  • Patent number: 11014138
    Abstract: A high-frequency heating method for a hot stamping process includes: a first heating step of high-frequency heating a steel sheet, which has an aluminum (Al) coating layer formed on an iron (Fe)-based base material, to a first target temperature at a first heating rate; a second heating step of melting the coating layer by high-frequency heating the steel sheet, which has passed through the first heating step, to a second target temperature at a second heating rate, wherein the second heating rate is lower than the first heating rate; and a third heating step of high-frequency heating the steel sheet, which has passed through the second heating step, to a third target temperature at a third heating rate, wherein the third heating rate is lower than the second heating rate. A compound is formed by a reaction between a material of the coating layer and a material of the base material in the second heating step.
    Type: Grant
    Filed: May 8, 2017
    Date of Patent: May 25, 2021
    Assignees: MS AUTOTECH CO., LTD., MYUNGSHIN INDUSTRY CO., LTD.
    Inventors: Sung Yong Park, Jae Sung Kim, Won Ik Eom
  • Publication number: 20210151853
    Abstract: A chip antenna module includes a first dielectric layer; a solder layer disposed on a first surface of the first dielectric layer; a patch antenna pattern disposed on a second surface of the first dielectric layer; a coupling pattern disposed on the second surface of the first dielectric layer, and spaced apart from the patch antenna pattern without overlapping the patch antenna pattern in a thickness direction; a first feed via extending through the first dielectric layer in the thickness direction so as not to overlap the patch antenna pattern and the coupling pattern in the thickness direction; a first feed pattern extending from a first end of the first feed to overlap at least a portion of the coupling pattern; and a second feed pattern extending from a second end of the first feed via to overlap at least a portion of the coupling pattern.
    Type: Application
    Filed: February 27, 2020
    Publication date: May 20, 2021
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ju Hyoung PARK, Myeong Woo HAN, Jae Yeong KIM, Young Sik HUR, Sung Yong AN, Dae Ki LIM
  • Patent number: D926377
    Type: Grant
    Filed: May 1, 2019
    Date of Patent: July 27, 2021
    Assignee: KMC EXIM CORP.
    Inventor: Sung Yong Chang