Abstract: Disclosed are a memristor device, a method of fabricating the same, a synaptic device including a memristor device, and a neuromorphic device including a synaptic device. The disclosed memristor device may comprise a first electrode, a second electrode disposed to be spaced apart from the first electrode; and a resistance changing layer including a copolymer between the first electrode and the second electrode. The copolymer may be a copolymer of a first monomer and a second monomer, and the first polymer formed from the first monomer may have a property that diffusion of metal ions is faster than that of the second polymer formed from the second monomer. The second polymer may have a lower diffusivity of metal ions as compared with the first polymer. The first monomer may include vinylimidazole (VI). The second monomer may include 1,3,5-trivinyl-1,3,5-trimethylcyclotrisiloxane (V3D3). The copolymer may include p(V3D3-co-VI).

Abstract: Disclosed are a memristor device, a method of fabricating the same, a synaptic device including a memristor device, and a neuromorphic device including a synaptic device. The disclosed memristor device may comprise a first electrode, a second electrode disposed to be spaced apart from the first electrode; and a resistance changing layer including a copolymer between the first electrode and the second electrode. The copolymer may be a copolymer of a first monomer and a second monomer, and the first polymer formed from the first monomer may have a property that diffusion of metal ions is faster than that of the second polymer formed from the second monomer. The second polymer may have a lower diffusivity of metal ions as compared with the first polymer. The first monomer may include vinylimidazole (VI). The second monomer may include 1,3,5-trivinyl-1,3,5-trimethylcyclotrisiloxane (V3D3). The copolymer may include p(V3D3-co-VI).

Abstract: A memristor device, a fabricating method thereof, a synaptic device including the memristor device, and a neuromorphic device including the synaptic device are provided. The memristor device includes a first electrode, a second electrode spaced apart from the first electrode, a resistance change layer disposed between the first electrode and the second electrode and including a polymer, and an insertion layer disposed between the first electrode and the resistance change layer and including an oxide. An electrochemical metallization mechanism (ECM) filament is formed in the resistance change layer, and a valence change mechanism (VCM) filament is formed in the insertion layer. The memristor device has a synaptic characteristic according to a change in resistance of the resistance change layer. The insertion layer includes an Al2O3 layer. The insertion layer includes an Al2O3 layer formed by an atomic layer deposition (ALD) process using a temperature of about 200° C. or higher.

Abstract: The present disclosure provides a soft memristor for soft neuromorphic system including a substrate, a first electrode layer formed on the substrate, a metal diffusion barrier layer formed on the first electrode layer, a resistive switching material layer formed on the metal diffusion barrier layer, and a second electrode layer formed on the resistive switching material layer.

Abstract: The present disclosure provides a method for preparing a transition metal chalcogenide including: a step of forming a transition metal chalcogenide thin film; and a step of controlling the defects of the transition metal chalcogenide thin film by injecting a processing gas including oxygen and nitrogen to the formed transition metal chalcogenide thin film.

Abstract: Disclosed are a memristor device, a method of fabricating the same, a synaptic device including a memristor device, and a neuromorphic device including a synaptic device. The disclosed memristor device may comprise a first electrode, a second electrode disposed to be spaced apart from the first electrode; and a resistance changing layer including a copolymer between the first electrode and the second electrode. The copolymer may be a copolymer of a first monomer and a second monomer, and the first polymer formed from the first monomer may have a property that diffusion of metal ions is faster than that of the second polymer formed from the second monomer. The second polymer may have a lower diffusivity of metal ions as compared with the first polymer. The first monomer may include vinylimidazole (VI). The second monomer may include 1,3,5-trivinyl-1,3,5-trimethylcyclotrisiloxane (V3D3). The copolymer may include p(V3D3-co-VI).

Abstract: The present disclosure provides a method for preparing a transition metal chalcogenide including: a step of forming a transition metal chalcogenide thin film; and a step of controlling the defects of the transition metal chalcogenide thin film by injecting a processing gas including oxygen and nitrogen to the formed transition metal chalcogenide thin film.

Abstract: The present disclosure relates to a transition metal chalcogenide for preparing metal nanostructures, metal nanostructures obtained thereby, an electronic instrument including the same, and a method for manufacturing the same. More particularly, the present disclosure relates to a transition metal chalcogenide for preparing metal nanostructures using transition metal dichalcogenide nanosheets as a reducing agent, metal nanostructures obtained thereby, an electronic instrument including the same, and a method for manufacturing the same.

Abstract: Provided is an electronic device containing: a two-dimensional semiconductor material; and another heterogeneous material adjacent to the two-dimensional semiconductor material, wherein the heterogeneous material is doped with an impurity of a type different from the two-dimensional semiconductor material or has a band gap different from the two-dimensional semiconductor material.

Abstract: The present disclosure provides a soft memristor for soft neuromorphic system including a substrate, a first electrode layer formed on the substrate, a metal diffusion barrier layer formed on the first electrode layer, a resistive switching material layer formed on the metal diffusion barrier layer, and a second electrode layer formed on the resistive switching material layer.

Abstract: Provided is a memory- and logic device-integrated soft electronic system, the memory- and logic device-integrated soft electronic system including: a substrate 100; a plurality of bar-shaped first electrodes 110 stacked on the substrate; a resistance-variable material layer 120 coated on the lower electrode; and a plurality of bar-shaped second electrodes 130 stacked on the resistance-variable material layer 120, wherein the first electrode and the second electrode cross each other.

Abstract: Disclosed are a two-dimensional semiconductor in which an energy band gap changes with thickness, a manufacturing method therefor, and a semiconductor device comprising the same. A two-dimensional semiconductor according to an embodiment comprises: a first layer having a first thickness; and a second layer having a second thickness, wherein the first thickness and the second thickness are different from each other, the first layer forms a first junction with a first electrode, and the second layer forms a second junction with a second electrode.

Abstract: Provided is a method for preparing a transition metal dichalcogenide alloy, which includes: a step of stacking two or more transition metal dichalcogenide compound thin films having different bandgaps on a substrate; a step of irradiating light to the two or more transition metal dichalcogenide compound thin films having different bandgaps; and a step of preparing a transition metal alloy by evaporating a dichalcogenide compound of the transition metal dichalcogenide compound thin film by the light.

Abstract: Provided is a method for manufacturing a doped graphene thin film having a mesoporous structure using a flash lamp, which comprises: a step of coating a mixture solution of a doping element source-containing material comprising a doping element and graphene oxide on a substrate; and a step of irradiating light to the coated mixture solution using a flash lamp, thereby carrying out reduction of the graphene oxide and doping of the doping element at the same time.

Abstract: Provided is a flexible thin-film transistor using a two-dimensional semiconductor material, which includes: a flexible substrate; a channel formed on the flexible substrate and formed of a two-dimensional semiconductor material; a gate insulator and a gate electrode stacked sequentially on the channel; and source and drain electrodes formed on the channel as being spaced apart from the gate electrode.

Abstract: Provided is an electronic device containing: a two-dimensional semiconductor material; and another heterogeneous material adjacent to the two-dimensional semiconductor material, wherein the heterogeneous material is doped with an impurity of a type different from the two-dimensional semiconductor material or has a band gap different from the two-dimensional semiconductor material.

Abstract: Provided is a thin-film transistor containing source, drain and gate electrodes, which contains: a channel layer containing a two-dimensional material; a gate insulator formed on the channel layer; and a gate electrode formed on the gate insulator, wherein the gate insulator contains at least two insulators having different dielectric constants.

Abstract: Provided is a method for manufacturing a transition metal dichalcogenide (TMDC) thin film, which includes: a step of injecting two or more transition metal dichalcogenide precursors into a reactor equipped with a substrate in vapor phase; and a step of forming a transition metal dichalcogenide thin film on the substrate by decomposing the transition metal dichalcogenide precursors under an oxygen condition.

Abstract: Provided is a memory- and logic device-integrated soft electronic system, the memory- and logic device-integrated soft electronic system including: a substrate 100; a plurality of bar-shaped first electrodes 110 stacked on the substrate; a resistance-variable material layer 120 coated on the lower electrode; and a plurality of bar-shaped second electrodes 130 stacked on the resistance-variable material layer 120, wherein the first electrode and the second electrode cross each other.

Abstract: Disclosed are a two-dimensional semiconductor in which an energy band gap changes with thickness, a manufacturing method therefor, and a semiconductor device comprising the same. A two-dimensional semiconductor according to an embodiment comprises: a first layer having a first thickness; and a second layer having a second thickness, wherein the first thickness and the second thickness are different from each other, the first layer forms a first junction with a first electrode, and the second layer forms a second junction with a second electrode.