Patents by Inventor Sung-min Hwang

Sung-min Hwang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240131232
    Abstract: Disclosed is an anti-adhesion agent composition which uses a high molecular weight compound having biocompatibility and an oil derived from animals, plants, and minerals so as to improve low viscosity and low strength, which are problems of existing anti-adhesion agents, and prevent adhesion between living tissues. The anti-adhesion composition according to the present disclosure performs a physical barrier function through simple mixing of a polymer material, serving as a physical barrier in its anti-adhesion effect, and a solvent, and remains in the body for a certain period of time, then decomposes, absorbs, and is excreted. The anti-adhesion composition does not interfere with the healing of the wound after surgery, and exhibits an excellent effect of convenient application to the surgical site.
    Type: Application
    Filed: June 13, 2022
    Publication date: April 25, 2024
    Inventors: Sung Joo Hwang, Dong Min Kim, Ji Eun Kim, Yeon Ju Choi, Yong Kyung Hwang
  • Publication number: 20240125989
    Abstract: The present invention provides an optical filter for its use. In the present invention, it is possible to provide an optical filter that effectively blocks ultraviolet ray and infrared ray and exhibits high transmittance in visible light. Furthermore, it is possible to provide an optical filter where the transmission characteristics are stably maintained even when an incident angle is changed. Moreover, it is possible to provide an optical filter that does not exhibit problems such as ripple, petal flare, and curl.
    Type: Application
    Filed: September 29, 2023
    Publication date: April 18, 2024
    Inventors: Joon Ho JUNG, Seon Ho YANG, Sung Min HWANG, Choon Woo JI, Yang Ho KWON
  • Publication number: 20240125988
    Abstract: The present invention provides an optical filter for its use. In the present invention, it is possible to provide an optical filter that effectively blocks ultraviolet ray and infrared ray and exhibits high transmittance in visible light. Furthermore, it is possible to provide an optical filter where the transmission characteristics are stably maintained even when an incident angle is changed. Moreover, it is possible to provide an optical filter that does not exhibit problems such as ripple or petal flare.
    Type: Application
    Filed: September 28, 2023
    Publication date: April 18, 2024
    Inventors: Joon Ho JUNG, Seon Ho YANG, Sung Min HWANG, Choon Woo JI, Tae Jin SONG
  • Publication number: 20240125990
    Abstract: The provided is an optical filter for its use. In the present invention, it is possible to provide an optical filter that effectively blocks ultraviolet ray and infrared ray and exhibits high transmittance in visible light. Furthermore, it is possible to provide an optical filter where the transmission characteristics are stably maintained even when an incident angle is changed. Moreover, it is possible to provide an optical filter that does not exhibit problems such as ripple and petal flare, and thus to provide the optical filter with excellent durability.
    Type: Application
    Filed: October 2, 2023
    Publication date: April 18, 2024
    Inventors: Joon Ho JUNG, Seon Ho YANG, Sung Min HWANG, Choon Woo JI, Sung Yong MOON
  • Patent number: 11961223
    Abstract: An apparatus for predicting performance of a wheel in a vehicle: includes a learning device that generates a latent space for a plurality of two-dimensional (2D) wheel images based on a convolutional autoencoder (CAE), extracts a predetermined number of the plurality of 2D wheel images from the latent space, and learns a dataset having the plurality of 2D wheel images and performance values corresponding to the plurality of 2D wheel images; and a controller that predicts performance for the plurality of 2D wheel images based on a performance prediction model obtained by the learning device.
    Type: Grant
    Filed: April 20, 2021
    Date of Patent: April 16, 2024
    Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION, SOOKMYUNG WOMEN'S UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION
    Inventors: Jong Ho Park, Chang Gon Kim, Chul Woo Jung, Sang Min Lee, Min Kyoo Kang, Ji Un Lee, Kwang Hyeon Hwang, Nam Woo Kang, So Young Yoo, Seong Sin Kim, Sung Hee Lee
  • Patent number: 11939173
    Abstract: A transportation head for a microchip transfer device capable of minimizing mechanical and chemical damage to a microchip, a microchip transfer device having same, and a transfer method thereby, and the transportation head includes a head body having a pickup area and a dummy area; a first protruding pin disposed in the pickup area of the head body; and a liquid droplet attached to the first protruding pin.
    Type: Grant
    Filed: August 23, 2019
    Date of Patent: March 26, 2024
    Assignee: LG DISPLAY CO., LTD.
    Inventors: Dahl-Young Khang, Sung-Hwan Hwang, Jia Lee, Sung-Soo Yoon, Su Seok Choi, Kiseok Chang, Jeong Min Moon, Soon Shin Jung, Sungpil Ryu, Jihwan Jung
  • Publication number: 20240098990
    Abstract: A semiconductor device includes a gate stack structure including insulating patterns and conductive patterns which are alternately stacked, a first separation structure penetrating the gate stack structure, a second separation structure penetrating the gate stack structure and being adjacent to the first separation structure, first and second memory channel structures penetrating the gate stack structure and disposed between the first separation structure and the second separation structure, a first bit line overlapping with the first and second memory channel structures and electrically connected to the first memory channel structure, and a second bit line overlapping with the first and second memory channel structures and the first bit line and electrically connected to the second memory channel structure.
    Type: Application
    Filed: March 28, 2023
    Publication date: March 21, 2024
    Applicant: Samsung Electronics Co., Ltd
    Inventors: Sung-Min Hwang, Jaehoon Lee, Seunghyun Cho, Jae-Joo Shim, Dong-Sik Lee
  • Publication number: 20240090211
    Abstract: A semiconductor memory device includes a gate stack structure including insulating layers, a lower selection line and word lines, the word lines including a first word line adjacent to the lower selection line and a second word line on the first word line, a memory channel structure penetrating the gate stack structure, a plurality of first contact plugs electrically connected to the first word line, a plurality of second contact plugs electrically connected to the second word line, a first conductive line connected to the plurality of first contact plugs, and a second conductive line connected to one of the plurality of second contact plugs.
    Type: Application
    Filed: April 17, 2023
    Publication date: March 14, 2024
    Inventors: Soyeon KIM, Sung-Min HWANG, Dong-Sik LEE, Seunghyun CHO, Bongtae PARK, Jae-Joo SHIM
  • Patent number: 11930639
    Abstract: A three-dimensional semiconductor memory device may include horizontal patterns disposed on a peripheral circuit structure and spaced apart from each other, memory structures provided on the horizontal patterns, respectively, each of the memory structures including a three-dimensional arrangement of memory cells. Penetrating insulating patterns and separation structures may isolate the horizontal patterns from one another. Through vias may extend through the penetrating insulating patterns to connect logic circuits of the peripheral circuit structure to the memory structure.
    Type: Grant
    Filed: March 28, 2022
    Date of Patent: March 12, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Woosung Yang, Dong-Sik Lee, Sung-Min Hwang, Joon-Sung Lim
  • Patent number: 11922860
    Abstract: Provided is a pixel driving circuit including a first circuit configured to control, in a data writing mode, a signal related to driving of one or more light-emitting elements, and a second circuit configured to supply, in a driving mode, power to the one or more light-emitting elements based on a signal transmitted from the first circuit.
    Type: Grant
    Filed: September 16, 2022
    Date of Patent: March 5, 2024
    Assignee: Sapien Semiconductors Inc.
    Inventors: Sung Ho Hwang, Ji Han Kim, Ji Haeng Lee, Hye Min Bae, Dae Young Jung
  • Patent number: 11912674
    Abstract: The present invention provides methods for treating or ameliorating metabolic diseases, cholestatic liver diseases, or organ fibrosis, which comprises administering to a subject a therapeutically effective amount of a pharmaceutical composition comprising an isoxazole derivative, a racemate, an enantiomer, or a diastereoisomer thereof, or a pharmaceutically acceptable salt of the derivative, the racemate, the enantiomer, or the diastereoisomer.
    Type: Grant
    Filed: March 4, 2021
    Date of Patent: February 27, 2024
    Assignee: IL DONG PHARMACEUTICAL CO., LTD.
    Inventors: Jae-Hoon Kang, Hong-Sub Lee, Yoon-Suk Lee, Jin-Ah Jeong, Sung-Wook Kwon, Jeong-Guen Kim, Kyung-Sun Kim, Dong-Keun Song, Sun-Young Park, Kyeo-Jin Kim, Ji-Hye Choi, Hey-Min Hwang
  • Publication number: 20240064974
    Abstract: A semiconductor memory device comprising: a first semiconductor chip including an upper input/output pad, a second semiconductor chip including a lower input/output pad, and a substrate attachment film attaching the first and second semiconductor chips. The first and second semiconductor chips each include a first substrate including a first side facing the substrate attachment film and a second side, a mold structure including gate electrodes, a channel structure penetrating the mold structure and intersecting the gate electrodes, a second substrate including a third side facing the first side and a fourth side, a first circuit element on the third side of the second substrate, and a contact via penetrating the first substrate and connected to the first circuit element. The upper and lower input/output pads are on the second sides of the first and second semiconductor chip, respectively, and contact the contact vias of the first and second semiconductor chips.
    Type: Application
    Filed: November 3, 2023
    Publication date: February 22, 2024
    Inventors: Jae Ho AHN, Ji Won KIM, Sung-Min HWANG, Joon-Sung LIM, Suk Kang SUNG
  • Patent number: 11910611
    Abstract: A nonvolatile memory device includes a substrate including a cell region and a peripheral circuit region, a stacked structure on the cell region, the stacked structure including a plurality of gate patterns separated from each other and stacked sequentially, a semiconductor pattern connected to the substrate through the stacked structure, a peripheral circuit element on the peripheral circuit region, a first interlayer insulating film on the cell region and the peripheral circuit region, the first interlayer insulating film covering the peripheral circuit element, and a lower contact connected to the peripheral circuit element through the first interlayer insulating film, a height of a top surface of the lower contact being lower than or equal to a height of a bottom surface of a lowermost gate pattern of the plurality of gate patterns on the first interlayer insulating film.
    Type: Grant
    Filed: October 22, 2021
    Date of Patent: February 20, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Dong Hoon Jang, Woo Sung Yang, Joon Sung Lim, Sung Min Hwang
  • Publication number: 20240014157
    Abstract: A nonvolatile memory device including a substrate extending in a first direction, a ground selection line extending in the first direction on the substrate, a plurality of word lines stacked sequentially on the ground selection line and extending in the first direction, a landing pad spaced apart from the ground selection line and the plurality of word lines in the first direction, a rear contact plug connected to a lower face of the landing pad and extending in a second direction intersecting the first direction, a front contact plug connected to an upper face of the landing pad opposite the lower face and extending in the second direction, an input/output pad electrically connected to the rear contact plug, and an upper bonding pad electrically connected to the front contact plug and connected to at least a part of a plurality of circuit elements of the nonvolatile memory device.
    Type: Application
    Filed: July 7, 2023
    Publication date: January 11, 2024
    Inventors: Jae Ho Ahn, Ji Won Kim, Sung-Min Hwang, Joon-Sung Lim, Suk Kang Sung
  • Patent number: 11862809
    Abstract: A separator sealing apparatus for bonding an upper separator and a lower separator with an electrode plate being interposed therebetween and a separator sealing method is provided. The separator sealing apparatus includes a first sealing unit configured to seal a first region specified as an outer edge along a width direction of the electrode plate, among portions where the upper separator and the lower separator face each other; and a second sealing unit configured to seal a second region specified as an outer edge along a length direction of the electrode plate, among the portions where the upper separator and the lower separator face each other.
    Type: Grant
    Filed: April 14, 2020
    Date of Patent: January 2, 2024
    Assignee: LG ENERGY SOLUTION, LTD.
    Inventors: Min-Jae Lee, Jong-Hun Kim, Sung-Min Hwang
  • Publication number: 20230417966
    Abstract: The present invention is to provide a stacked layer structure and an image capturing device having a high transmittance of visible light, capable of obtaining a sharp visible light transmission band while efficiently and accurately blocking ultraviolet light near the short wavelength region of the visible light and infrared light in the long wavelength region of the visible light, and preventing a flare phenomenon.
    Type: Application
    Filed: May 26, 2023
    Publication date: December 28, 2023
    Inventors: Joon Ho JUNG, Seon Ho YANG, TAE JIN SONG, Chun Sik KANG, Sung Min HWANG, Choon Woo JI, Ho Sung LEE
  • Publication number: 20230413545
    Abstract: A three-dimensional semiconductor device includes a first gate group on a lower structure and a second gate group on the first gate group. The first gate group includes first pad regions that are: (1) lowered in a first direction that is parallel to an upper surface of the lower structure and (2) raised in a second direction that is parallel to an upper surface of the lower structure and perpendicular to the first direction. The second gate group includes second pad regions that are sequentially raised in the first direction and raised in the second direction.
    Type: Application
    Filed: August 4, 2023
    Publication date: December 21, 2023
    Inventors: Sung Min Hwang, Joon Sung Lim, Bum Kyu Kang, Jae Ho Ahn
  • Patent number: 11844211
    Abstract: A semiconductor memory device comprising: a first semiconductor chip including an upper input/output pad, a second semiconductor chip including a lower input/output pad, and a substrate attachment film attaching the first and second semiconductor chips. The first and second semiconductor chips each include a first substrate including a first side facing the substrate attachment film and a second side, a mold structure including gate electrodes, a channel structure penetrating the mold structure and intersecting the gate electrodes, a second substrate including a third side facing the first side and a fourth side, a first circuit element on the third side of the second substrate, and a contact via penetrating the first substrate and connected to the first circuit element. The upper and lower input/output pads are on the second sides of the first and second semiconductor chip, respectively, and contact the contact vias of the first and second semiconductor chips.
    Type: Grant
    Filed: June 7, 2021
    Date of Patent: December 12, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae Ho Ahn, Ji Won Kim, Sung-Min Hwang, Joon-Sung Lim, Suk Kang Sung
  • Patent number: 11758719
    Abstract: A three-dimensional semiconductor device includes a first gate group on a lower structure and a second gate group on the first gate group. The first gate group includes first pad regions that are: (1) lowered in a first direction that is parallel to an upper surface of the lower structure and (2) raised in a second direction that is parallel to an upper surface of the lower structure and perpendicular to the first direction. The second gate group includes second pad regions that are sequentially raised in the first direction and raised in the second direction.
    Type: Grant
    Filed: August 2, 2021
    Date of Patent: September 12, 2023
    Inventors: Sung Min Hwang, Joon Sung Lim, Bum Kyu Kang, Jae Ho Ahn
  • Patent number: 11749778
    Abstract: A semiconductor device according to an embodiment may include: a light emitting structure; a light transmitting electrode layer disposed on the light emitting structure; and a reflective layer disposed on the light transmitting electrode layer and including a plurality of first openings and a plurality of second openings. The semiconductor device according to the embodiment may include: a first electrode in contact with a first conductivity type semiconductor layer of the light emitting structure; and a second electrode in contact with the light transmitting electrode layer through the plurality of first openings.
    Type: Grant
    Filed: August 24, 2018
    Date of Patent: September 5, 2023
    Assignee: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
    Inventors: Chang Hyeong Lee, June O Song, Tae Sung Lee, Chang Man Lim, Se Yeon Jung, Byung Yeon Choi, Sung Min Hwang