Abstract: A method of manufacturing a chip scale light-emitting diode package is provided. The method of manufacturing chip scale light-emitting diode package includes: manufacturing a lens molding sheet including intaglios on one surface thereof; forming a lens layer having lens portions on one surface thereof and a flat surface on a surface opposite thereto by applying a light-transmitting resin to the intaglios; forming an adhesive layer on the flat surface of the lens layer; arranging light-emitting diode chips, each having a first surface and a second surface opposite to the first surface, on the adhesive layer in such a way that the light-emitting diode chips correspond to the lens portions and the second surface is attached to the adhesive layer, wherein a first electrode pad and a second electrode pad are formed on the first surface; and manufacturing a chip array sheet by forming a molding part on the adhesive layer to cover outer surfaces of the light-emitting diode chips.

Abstract: An LED pixel device is disclosed. The LED pixel device includes a first light-transmitting substrate, a second light-transmitting substrate overlying the first light-transmitting substrate, a third light-transmitting substrate overlying the second light-transmitting substrate, a first light-emitting cell underlying the first light-transmitting substrate, a second light-emitting cell interposed between the first light-transmitting substrate and the second light-transmitting substrate, and a third light-emitting cell interposed between the second light-transmitting substrate and the third light-transmitting substrate. The first light-emitting cell, the second light-emitting cell, and the third light-emitting cell emit light of different wavelengths.

Abstract: A multi-pixel LED package is disclosed. The multi-pixel LED package includes: n pixel groups (where n is a natural number equal to or greater than 2), each of which includes a plurality of pixels, each of which includes a first LED chip, a second LED chip, and a third LED chip; and a substrate on which the n pixel groups are arrayed.

Abstract: An LED display lighting device is disclosed. The LED display lighting device includes: a substrate including a substrate base and a first electrode part and a second electrode part, both of which are disposed on the substrate base; a plurality of LED chips arranged in a matrix on the substrate; and a diffusion plate covering the upper portions of the LED chips. Each of the LED chips includes: a light-transmitting base; n LED cells disposed under the light-transmitting base and each including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer; an interconnection through which the n LED cells are connected in series; a first electrode structure through which the first conductive semiconductor layer of the first LED cell is connected to the first electrode part; and a second electrode structure through which the second conductive semiconductor layer of the n-th LED cell is connected to the second electrode part.

Abstract: An LED package is disclosed. The LED package includes: a base including a chip mounting surface; an LED chip including a central axis line perpendicular to the chip mounting surface; a total internal reflection (TIR) lens having a refractive index higher than that of a medium covering the upper and side surfaces of the LED chip and including entrance planes bordering the medium and exit planes from which light entering through the entrance planes is emitted; and a reflector coupled to the TIR lens. The entrance planes include main entrance planes having one or more radii of curvature and protruding toward the LED chip and a pair of lateral entrance planes connected to the main entrance planes at the edges of the main entrance planes and extending downward from the main entrance planes.

Abstract: An LED display lighting device is disclosed. The LED display lighting device includes: a substrate including a substrate base and a first electrode part and a second electrode part, both of which are disposed on the substrate base; a plurality of LED chips arranged in a matrix on the substrate; and a diffusion plate covering the upper portions of the LED chips. Each of the LED chips includes: a light-transmitting base; n LED cells disposed under the light-transmitting base and each including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer; an interconnection through which the n LED cells are connected in series; a first electrode structure through which the first conductive semiconductor layer of the first LED cell is connected to the first electrode part; and a second electrode structure through which the second conductive semiconductor layer of the n-th LED cell is connected to the second electrode part.

Abstract: A quantum dot LED package is disclosed. The quantum dot LED package includes: a heat dissipating reflector having a through cavity; a quantum dot plate accommodated in the upper portion of the through cavity; an LED chip accommodated in the lower portion of the through cavity and whose top surface is coupled to the lower surface of the quantum dot plate; electrode pads disposed on the lower surface of the LED chip and protruding more downward than the lower surface of the heat dissipating reflector; and a resin part formed in the through cavity to fix between the LED chip and the reflector and between the quantum dot plate and the reflector.

Abstract: A light emitting element is disclosed. The light emitting element includes: an LED chip including a light emitting semiconductor stack and first and second electrode pads disposed under the light emitting semiconductor stack and spaced apart from each other; a substrate mounted with the LED chip and including a first electrode corresponding to the first electrode pad and a second electrode corresponding to the second electrode pad; a first solder portion connecting the first electrode pad and the first electrode; and a second solder portion connecting the second electrode pad and the second electrode. The first solder portion and the second solder portion are formed without escaping from the mounting area of the LED chip on the substrate by heating a solder material to its melting point or above with an IR laser.

Abstract: A quantum dot LED package is disclosed. The quantum dot LED package includes: a heat dissipating reflector having a through cavity; a quantum dot plate accommodated in the upper portion of the through cavity; an LED chip accommodated in the lower portion of the through cavity and whose top surface is coupled to the lower surface of the quantum dot plate; electrode pads disposed on the lower surface of the LED chip and protruding more downward than the lower surface of the heat dissipating reflector; and a resin part formed in the through cavity to fix between the LED chip and the reflector and between the quantum dot plate and the reflector.

Abstract: A light emitting element is disclosed. The light emitting element includes: a mount substrate on which a first electrode pad, a second electrode pad, a third electrode pad, and a fourth electrode pad are disposed; a first vertical LED chip mounted on the mount substrate such that the bottom portion of the first vertical LED chip is connected to the first electrode pad; a second vertical LED chip mounted on the mount substrate such that the bottom portion of the second vertical LED chip is connected to the second electrode pad; a third vertical LED chip mounted on the mount substrate such that the bottom portion of the third vertical LED chip is connected to the third electrode pad; a light-transmitting conductive plate electrically connected to the top portions of the first vertical LED chip, the second vertical LED chip, and the third vertical LED chip; and a conductor connecting the light-transmitting conductive plate to the fourth electrode pad.

Abstract: An LED pixel device is disclosed. The LED pixel device includes a first light-transmitting substrate, a second light-transmitting substrate overlying the first light-transmitting substrate, a third light-transmitting substrate overlying the second light-transmitting substrate, a first light-emitting cell underlying the first light-transmitting substrate, a second light-emitting cell interposed between the first light-transmitting substrate and the second light-transmitting substrate, and a third light-emitting cell interposed between the second light-transmitting substrate and the third light-transmitting substrate. The first light-emitting cell, the second light-emitting cell, and the third light-emitting cell emit light of different wavelengths.

Abstract: An LED package is disclosed. The LED package includes: a metal reflector having a cavity formed therein; an LED chip arranged on the bottom of the cavity of the reflector; a wavelength converting panel including a lower glass plate, an upper glass plate, and a wavelength converting sheet interposed between the lower glass plate and the upper glass plate and arranged on the cavity of the reflector; and a sealing member disposed on the side surface of the lower glass plate and the side surface of the upper glass plate and connecting the wavelength converting panel to the reflector.

Abstract: A multi-pixel LED package is disclosed. The multi-pixel LED package includes: n pixel groups (where n is a natural number equal to or greater than 2), each of which includes a plurality of pixels, each of which includes a first LED chip, a second LED chip, and a third LED chip; and a substrate on which the n pixel groups are arrayed.

Abstract: An LED package is disclosed. The LED package includes: a base including a chip mounting surface; an LED chip including a central axis line perpendicular to the chip mounting surface; a total internal reflection (TIR) lens having a refractive index higher than that of a medium covering the upper and side surfaces of the LED chip and including entrance planes bordering the medium and exit planes from which light entering through the entrance planes is emitted; and a reflector coupled to the TIR lens. The entrance planes include main entrance planes having one or more radii of curvature and protruding toward the LED chip and a pair of lateral entrance planes connected to the main entrance planes at the edges of the main entrance planes and extending downward from the main entrance planes.

Abstract: A light emitting element is disclosed. The light emitting element includes: an LED chip including a light emitting semiconductor stack and first and second electrode pads disposed under the light emitting semiconductor stack and spaced apart from each other; a substrate mounted with the LED chip and including a first electrode corresponding to the first electrode pad and a second electrode corresponding to the second electrode pad; a first solder portion connecting the first electrode pad and the first electrode; and a second solder portion connecting the second electrode pad and the second electrode. The first solder portion and the second solder portion are formed without escaping from the mounting area of the LED chip on the substrate by heating a solder material to its melting point or above with an IR laser.

Abstract: An LED package is disclosed. The LED package includes: a metal reflector having a cavity formed therein; an LED chip arranged on the bottom of the cavity of the reflector; a wavelength converting panel including a lower glass plate, an upper glass plate, and a wavelength converting sheet interposed between the lower glass plate and the upper glass plate and arranged on the cavity of the reflector; and a sealing member disposed on the side surface of the lower glass plate and the side surface of the upper glass plate and connecting the wavelength converting panel to the reflector.

Abstract: A light emitting element is disclosed. The light emitting element includes: an LED chip including a light emitting semiconductor stack and first and second electrode pads disposed under the light emitting semiconductor stack and spaced apart from each other; a substrate mounted with the LED chip and including a first electrode corresponding to the first electrode pad and a second electrode corresponding to the second electrode pad; a first solder portion connecting the first electrode pad and the first electrode; and a second solder portion connecting the second electrode pad and the second electrode. The first solder portion and the second solder portion are formed without escaping from the mounting area of the LED chip on the substrate by heating a solder material to its melting point or above with an IR laser.

Abstract: A light emitting element is disclosed. The light emitting element includes: a mount substrate on which a first electrode pad, a second electrode pad, a third electrode pad, and a fourth electrode pad are disposed; a first vertical LED chip mounted on the mount substrate such that the bottom portion of the first vertical LED chip is connected to the first electrode pad; a second vertical LED chip mounted on the mount substrate such that the bottom portion of the second vertical LED chip is connected to the second electrode pad; a third vertical LED chip mounted on the mount substrate such that the bottom portion of the third vertical LED chip is connected to the third electrode pad; a light-transmitting conductive plate electrically connected to the top portions of the first vertical LED chip, the second vertical LED chip, and the third vertical LED chip; and a conductor connecting the light-transmitting conductive plate to the fourth electrode pad.

Abstract: The present disclosure discloses a linear LED module including: at least one LED bar including multiple LEDs arrayed on a substrate in a lengthwise direction of the substrate; a mounting portion in which the at least one LED bar is mounted on its mounting surface in the lengthwise direction; and a composite reflective portion integrated with the mounting portion and adapted to reflect light emitted from the at least one LED bar. A cross-section of the composite reflective portion includes a curved reflective surface adjacent to the mounting portion and a straight reflective surface extending away from a boundary with the mounting portion. Also disclosed is a backlight unit including the linear LED module. The backlight unit includes a rear case arranged in rear of a display panel, a reflective sheet positioned in rear of the display panel in the rear case, and a linear LED module.