LED package
Latest LUMENS CO., LTD. Patents:
- Semiconductor light emitting device and method of manufacturing the same
- CHIP SCALE LIGHT-EMITTING DIODE PACKAGE AND MANUFACTURING METHOD THEREOF
- Chip scale light-emitting diode package and manufacturing method thereof
- Surface light source module and method of manufacturing the same
- Ultra-slim backlight unit
Description
Claims
The ornamental design for an LED package, as shown and described.
Referenced Cited
U.S. Patent Documents
D578084 | October 7, 2008 | Kobayakawa |
D608309 | January 19, 2010 | Kim |
D640993 | July 5, 2011 | Lin |
D654032 | February 14, 2012 | Yu |
D656468 | March 27, 2012 | Park |
D697877 | January 21, 2014 | Hsu |
D728492 | May 5, 2015 | Lin |
20130277701 | October 24, 2013 | Okabe |
20160293810 | October 6, 2016 | Baike |
20190058099 | February 21, 2019 | Oh |
Patent History
Patent number: D865688
Type: Grant
Filed: Jul 3, 2018
Date of Patent: Nov 5, 2019
Assignee: LUMENS CO., LTD. (Yongin-si)
Inventors: Seunghyun Oh (Yongin-si), Pyounggug Kim (Yongin-si), Sungsik Jo (Yongin-si)
Primary Examiner: Selina Sikder
Application Number: 29/655,474
Type: Grant
Filed: Jul 3, 2018
Date of Patent: Nov 5, 2019
Assignee: LUMENS CO., LTD. (Yongin-si)
Inventors: Seunghyun Oh (Yongin-si), Pyounggug Kim (Yongin-si), Sungsik Jo (Yongin-si)
Primary Examiner: Selina Sikder
Application Number: 29/655,474
Classifications
Current U.S. Class:
Electron Or Vacuum Tube (23) (D13/180)