Patents by Inventor Sunil Rao
Sunil Rao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12244266Abstract: Various embodiments of a system and associated method for detecting and classifying faults in a photovoltaic array using graph-based signal processing.Type: GrantFiled: May 12, 2021Date of Patent: March 4, 2025Assignee: Arizona Board of Regents on Behalf of Arizona State UniversityInventors: Jie Fan, Sunil Rao, Gowtham Muniraju, Cihan Tepedelenlioglu, Andreas Spanias
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Publication number: 20240264643Abstract: A light pipe housing for a drive carrier comprises a base structure having a front face, a back face, a first light pipe cavity, and a second light pipe cavity. The light pipe housing comprises a raised ramp extending between the first light pipe cavity and the second light pipe cavity, the raised ramp having a first edge adjacent to the first light pipe cavity and a second edge adjacent to the second light pipe cavity. The housing further comprises a top cover having a cut out portion. The base structure and top cover are in conjunction configured to carry any one of a first light pipe and a second light pipe for the drive carrier. The light pipe housing configured to carry one light pipe at a time. The first light pipe and the second light pipe have mutually different light pipe arrangements.Type: ApplicationFiled: February 3, 2023Publication date: August 8, 2024Inventors: John R. Grady, Joseph Allen, Sunil Rao Ganta Papa Rao Bala, Keith Sauer
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Publication number: 20240256009Abstract: A drive carrier includes a frame to receive and carry a media drive, a handle assembly, and a latching assembly having a helical compression spring and a latch. The handle assembly having a handle is pivotably connected to the frame and configured to rotate relative to the frame between open and closed positions. The handle assembly in its closed position, is configured to engage to a drive cage and hold the drive carrier in the drive cage. The latch is pivotably connected to the frame and rotatable between latched and unlatched positions. A second locking arm of the latch in its latched position, is engageable with a first locking arm of the handle to retain the handle in the closed position. The helical compression spring is arranged at an acute angle relative to the frame and applies force on the latch to bias the latch towards the latched position.Type: ApplicationFiled: January 30, 2023Publication date: August 1, 2024Inventor: Sunil Rao Ganta Papa Rao Bala
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Patent number: 11932898Abstract: Computer-implemented processes for precision therapeutic biomarker screening for cancer include using a model-based overlapping clustering framework to assess large numbers of possible drugs and drug combinations against patient data, including cell line responsiveness. A multivariate regression model has been developed, along with a latent overlapping cluster indicator variable. The techniques employ a new finite mixture of multivariate regression (FMMR) model and expectation-maximization (EM) algorithm for modeling. The techniques can analyze large amounts of drug data and identify complex overlapping drug clusters, as well as cluster-wise drivers that facilitate identification of new drugs for treating pathologies, such as cancer, in patients.Type: GrantFiled: July 31, 2017Date of Patent: March 19, 2024Assignee: UNIVERSITY OF MIAMIInventors: Jonnagadda Sunil Rao, Hongmei Liu
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Patent number: 11695601Abstract: A system includes a transmitter to transmit a set of bits associated with signaling having one or more levels. The system includes a receiver coupled to the transmitter, the receiver to receive the set of bits and generate a first plurality of digital values, each digital value generated at a first timing value and a plurality of reference voltages, the reference voltage incremented based at least in part on generating a digital value of the first plurality of digital values. The receiver is to generate a second plurality of digital values at a second timing value and the plurality of reference voltages, the first timing value incremented to the second timing value based at least in part on generating the first plurality of digital values. The system includes a controller to determine an amplitude associated with each the first and second plurality of digital values.Type: GrantFiled: August 13, 2021Date of Patent: July 4, 2023Assignee: Nvidia CorporationInventors: Sunil Rao Sudhakaran, Arash Zargaran-Yazd, Santhosh Kumar Gude, Seema Kumar
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Publication number: 20230062528Abstract: Various embodiments of a system and associated method for detection of COVID-19 and other respiratory diseases through classification of audio samples are disclosed herein. The system utilizes features directly extracted from the coughing audio and develops automated diagnostic tools for COVID-19. In particular, the present application discusses a novel modification of a deep neural network architecture by using log-mel spectrograms of the audio excerpts and by optimizing a combination of binary cross-entropy and focal loss parameters. One embodiment of the system achieved an average validation AUC of 82.23% and a test AUC of 78.3% at a sensitivity of 80.49%.Type: ApplicationFiled: August 12, 2022Publication date: March 2, 2023Applicant: Arizona Board of Regents on Behalf of Arizona State UniversityInventors: Sunil Rao, Vivek Sivaraman Narayanaswamy, Michael Esposito, Andreas Spanias
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Publication number: 20230052588Abstract: A system includes a transmitter to transmit a set of bits associated with signaling having one or more levels. The system includes a receiver coupled to the transmitter, the receiver to receive the set of bits and generate a first plurality of digital values, each digital value generated at a first timing value and a plurality of reference voltages, the reference voltage incremented based at least in part on generating a digital value of the first plurality of digital values. The receiver is to generate a second plurality of digital values at a second timing value and the plurality of reference voltages, the first timing value incremented to the second timing value based at least in part on generating the first plurality of digital values. The system includes a controller to determine an amplitude associated with each the first and second plurality of digital values.Type: ApplicationFiled: August 13, 2021Publication date: February 16, 2023Inventors: Sunil Rao Sudhakaran, Arash Zargaran-Yazd, Santhosh Kumar Gude, Seema Kumar
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Patent number: 11573854Abstract: Various embodiments include a memory device that recovers from write errors and read errors more quickly relative to prior memory devices. Certain patterns of write data and read data may result on poor signal quality on the memory interface between memory controllers and memory devices. The disclosed memory device, synchronously with the memory controller, scrambles read data before transmitting the data to the memory controller and descrambles received from the memory controller. The scrambling and descrambling results in a different pattern on the memory interface even for the same read data or write data. Therefore, when a write operation or a read operation fails, and the operation is replayed, the pattern transmitted on the memory interface is different when the operation is replayed. As a result, the memory device more easily recovers from data patterns that cause poor signal quality on the memory interface.Type: GrantFiled: November 10, 2021Date of Patent: February 7, 2023Assignee: NVIDIA CORPORATIONInventors: Gautam Bhatia, Robert Bloemer, Sunil Rao Sudhakaran
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Patent number: 11521908Abstract: Examples include a computing system including a heater element for heating a processor device installed in the computing system. The computing system includes a chassis, a circuit board assembly housed in the chassis and a heat sink assembly disposed on the chassis to form a cover of the chassis. The circuit board assembly includes a processor package including a substrate having a first portion and a second portion. The processor package includes the processor device disposed on the first portion of the substrate. The heater element disposed on the second portion of the substrate. In the computing system, the heat sink assembly is disposed on the chassis such that a gap separates the heat sink assembly and the heater element.Type: GrantFiled: July 16, 2020Date of Patent: December 6, 2022Assignee: Hewlett Packard Enterprise Development LPInventors: Sunil Rao Ganta Papa Rao Bala, Matthew Kielbasa, Harvey Edward White, Jr.
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Publication number: 20220245025Abstract: Various embodiments include a memory device that recovers from write errors and read errors more quickly relative to prior memory devices. Certain patterns of write data and read data may result on poor signal quality on the memory interface between memory controllers and memory devices. The disclosed memory device, synchronously with the memory controller, scrambles read data before transmitting the data to the memory controller and descrambles received from the memory controller. The scrambling and descrambling results in a different pattern on the memory interface even for the same read data or write data. Therefore, when a write operation or a read operation fails, and the operation is replayed, the pattern transmitted on the memory interface is different when the operation is replayed. As a result, the memory device more easily recovers from data patterns that cause poor signal quality on the memory interface.Type: ApplicationFiled: November 10, 2021Publication date: August 4, 2022Inventors: Gautam BHATIA, Robert BLOEMER, Sunil Rao SUDHAKARAN
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Patent number: 11262815Abstract: Systems, apparatuses, and methods described herein provide heat sinks that can be incorporated into chassis, yet be compatible with edge devices that contain many different combinations of hardware that can be arranged in many different ways on circuit boards. In one example, a pattern of fittings on an interior-facing side of the heat sink are configured to mate with fittings on a first side of an adapter pedestal. A second side of the adapter pedestal is configured to thermally couple with an electronic component housed within the chassis when the heat sink is fully seated and the pedestal is properly coupled to the heat sink.Type: GrantFiled: November 1, 2019Date of Patent: March 1, 2022Assignee: Hewlett Packard Enterprise Development LPInventors: Chanh V. Hua, Sunil Rao Ganta Papa Rao Bala
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Publication number: 20220020660Abstract: Examples include a computing system including a heater element for heating a processor device installed in the computing system. The computing system includes a chassis, a circuit board assembly housed in the chassis and a heat sink assembly disposed on the chassis to form a cover of the chassis. The circuit board assembly includes a processor package including a substrate having a first portion and a second portion. The processor package includes the processor device disposed on the first portion of the substrate. The heater element disposed on the second portion of the substrate. In the computing system, the heat sink assembly is disposed on the chassis such that a gap separates the heat sink assembly and the heater element.Type: ApplicationFiled: July 16, 2020Publication date: January 20, 2022Inventors: Sunil Rao Ganta Papa Rao Bala, Matthew Kielbasa, Harvey Edward White, JR.
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Publication number: 20210357703Abstract: Various embodiments of a system and associated method for detecting and classifying faults in a photovoltaic array using graph-based signal processing.Type: ApplicationFiled: May 12, 2021Publication date: November 18, 2021Applicant: Arizona Board of Regents on Behalf of Arizona State UniversityInventors: Jie Fan, Sunil Rao, Gowtham Muniraju, Cihan Tepedelenlioglu, Andreas Spanias
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Patent number: 11051419Abstract: Example implementations relate a chassis for a circuit assembly. The chassis includes a chassis body defining an access opening and a volume to house the circuit assembly including a circuit module and an input-output (IO) unit. The chassis body houses the circuit assembly such that the circuit module is enclosed within the volume defined by the chassis body and the IO unit remains accessible for cabling at the access opening. The chassis further includes an IO enclosure attached to the chassis body to seal the access opening from surrounding environment, where the IO enclosure includes a cabling port to allow the cabling to the IO unit.Type: GrantFiled: September 6, 2019Date of Patent: June 29, 2021Assignee: Hewlett Packard Enterprise Development LPInventors: Sunil Rao Ganta Papa Rao Bala, Joseph Allen
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Publication number: 20210183500Abstract: A method includes receiving medical image data from an image sharing application running on a sharing device. The method further includes determining a category of medical information represented in the medical image data. The method also includes identifying a viewing device to view the medical image data. The method additionally includes transmitting, to the viewing device, a request for confirmation of a medical condition associated with the category of medical information, wherein the request allows the viewing device to view the medical image data in an image viewing application running on the viewing device before an end of a timeout period. The method further includes receiving, from the viewing device, a signal confirming the medical condition based on the medical image data. The method also includes in response to receiving the signal, transmitting an activation signal to each member user device of a medical team associated with the viewing device.Type: ApplicationFiled: August 6, 2018Publication date: June 17, 2021Inventors: Aditya Mandawat, Alexander Blood, Sunil Rao, Schuyler Jones, Manesh Patel
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Publication number: 20210132670Abstract: Systems, apparatuses, and methods described herein provide heat sinks that can be incorporated into chassis, yet be compatible with edge devices that contain many different combinations of hardware that can be arranged in many different ways on circuit boards. In one example, a pattern of fittings on an interior-facing side of the heat sink are configured to mate with fittings on a first side of an adapter pedestal. A second side of the adapter pedestal is configured to thermally couple with an electronic component housed within the chassis when the heat sink is fully seated and the pedestal is properly coupled to the heat sink.Type: ApplicationFiled: November 1, 2019Publication date: May 6, 2021Inventors: Chanh V. Hua, Sunil Rao Ganta Papa Rao Bala
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Patent number: 10980151Abstract: A flexible heat transfer mechanism is provided for transferring heat from a heat generating component to a heatsink. The heat transfer mechanism may include a pedestal coupled to the heatsink via a heat transfer element. The heat transfer element may be a compliant member that is capable of flexing in a vertical direction such that the pedestal may be vertically displaced relative to the heatsink.Type: GrantFiled: July 31, 2018Date of Patent: April 13, 2021Assignee: Hewlett Packard Enterprise Development LPInventors: Sunil Rao Ganta Papa Rao Bala, Richard Bargerhuff, Nabeel Fathi
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Publication number: 20210076524Abstract: Example implementations relate a chassis for a circuit assembly. The chassis includes a chassis body defining an access opening and a volume to house the circuit assembly including a circuit module and an input-output (IO) unit. The chassis body houses the circuit assembly such that the circuit module is enclosed within the volume defined by the chassis body and the IO unit remains accessible for cabling at the access opening. The chassis further includes an IO enclosure attached to the chassis body to seal the access opening from surrounding environment, where the IO enclosure includes a cabling port to allow the cabling to the IO unit.Type: ApplicationFiled: September 6, 2019Publication date: March 11, 2021Inventors: Sunil Rao Ganta Papa Rao Bala, Joseph Allen
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Patent number: 10795100Abstract: Examples relate to a removable transceiver module that comprises a base frame installable in a rail-pair receptacle that surrounds a first connector in a system board. It further comprises a module base board, a second connector attached thereto and a lever handle pivotally attached to the base frame and coupled to the module base board. The transceiver module is installed in the rail-pair receptacle in response to a lateral movement of the base frame to the receptacle to align the first and second connectors. The lever handle is movable between a closed position to couple the second connector to the first connector and an open position to install the transceiver module into the receptacle. This lever handle determines a vertical move of the module base board between the closed position and the open position.Type: GrantFiled: March 9, 2018Date of Patent: October 6, 2020Assignee: Hewlett Packard Enterprise Development LPInventors: Kevin B. Leigh, Sunil Rao Ganta Papa Rao Bala, Arlen L Roesner
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Publication number: 20200251177Abstract: Systems and methods for mounting a computing device. One system includes a wall mounting bracket having a front side and a back side. The system further includes a main chassis having a front side panel removably connected to the front side of the wall mounting bracket, a second side panel removably connected to the front side of the wall mounting bracket, and a computing device having a first side and a second side, the first side removably attached to the first side panel and the second side removably attached to the second side panel, and the main chassis connected to the front side of the wall mounting bracket.Type: ApplicationFiled: January 31, 2019Publication date: August 6, 2020Inventor: Sunil Rao Ganta Papa Rao Bala