Patents by Inventor Sunil Rao

Sunil Rao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10725251
    Abstract: An optical cable router is disclosed. The optical cable router is to couple to rocker-arm plenums of a modular computing system. The optical cable router includes a crossbar that includes an optical cable cavity. The optical cable cavity has a plurality of optical cables and an access panel. The optical cable router further includes optical connectors, each of which is coupled to a respective optical cable of the plurality of optical cables. Each optical connector is also coupled to a respective optical connector of a respective modular computing device retained in the modular computing system.
    Type: Grant
    Filed: January 31, 2018
    Date of Patent: July 28, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Kevin B. Leigh, Sunil Rao Ganta Papa Rao Bala, John Grady
  • Patent number: 10691184
    Abstract: An apparatus includes a chassis; a circuit board assembly; and a heat sink assembly. The circuit board assembly includes a component to be removably installed in the connector. The heat sink assembly forms a cover for the chassis. The heat sink assembly includes a first heat sink and a second heat sink. The first heat sink is attached to the chassis, and the first heat sink includes an opening in the cover that corresponds to a location of the component. The second heat sink is to be attached to the first heat sink to close the opening and to be removable from the first heat sink to allow access to the opening to service the component.
    Type: Grant
    Filed: November 29, 2018
    Date of Patent: June 23, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Sunil Rao Ganta Papa Rao Bala, Kelly K. Smith, Joseph Allen
  • Publication number: 20200174534
    Abstract: An apparatus includes a chassis; a circuit board assembly; and a heat sink assembly. The circuit board assembly includes a component to be removably installed in the connector. The heat sink assembly forms a cover for the chassis. The heat sink assembly includes a first heat sink and a second heat sink. The first heat sink is attached to the chassis, and the first heat sink includes an opening in the cover that corresponds to a location of the component. The second heat sink is to be attached to the first heat sink to close the opening and to be removable from the first heat sink to allow access to the opening to service the component.
    Type: Application
    Filed: November 29, 2018
    Publication date: June 4, 2020
    Inventors: Sunil Rao Ganta Papa Rao Bala, Kelly K. Smith, Joseph Allen
  • Publication number: 20200045850
    Abstract: A flexible heat transfer mechanism is provided for transferring heat from a heat generating component to a heatsink. The heat transfer mechanism may include a pedestal coupled to the heatsink via a heat transfer element. The heat transfer element may be a compliant member that is capable of flexing in a vertical direction such that the pedestal may be vertically displaced relative to the heatsink.
    Type: Application
    Filed: July 31, 2018
    Publication date: February 6, 2020
    Inventors: Sunil Rao Ganta Papa Rao Bala, Richard Bargerhuff, Nabeel Fathi
  • Patent number: 10539753
    Abstract: The present disclosure provides a liquid-cooled transceiver assembly. The liquid-cooled transceiver assembly comprises a removable communications module and a receiving bay assembly. The removable communications module includes a faceplate connector to receive a signal from an external device, a signal conversion chip that is coupled to the faceplate connector, and a lever assembly. The lever assembly can engage the receiving bay assembly such that the signal conversion chip is aligned with and makes an electrical connection with an electrical socket disposed on the receiving bay assembly. The removable communications module is inserted into the receiving bay assembly which when fully assembled functions as a liquid-cooled transceiver assembly.
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: January 21, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Kevin B. Leigh, Sunil Rao Ganta Papa Rao Bala, John Norton
  • Publication number: 20190278037
    Abstract: Examples relate to a removable transceiver module that comprises a base frame installable in a rail-pair receptacle that surrounds a first connector in a system board. It further comprises a module base board, a second connector attached thereto and a lever handle pivotally attached to the base frame and coupled to the module base board. The transceiver module is installed in the rail-pair receptacle in response to a lateral movement of the base frame to the receptacle to align the first and second connectors. The lever handle is movable between a closed position to couple the second connector to the first connector and an open position to install the transceiver module into the receptacle. This lever handle determines a vertical move of the module base board between the closed position and the open position.
    Type: Application
    Filed: March 9, 2018
    Publication date: September 12, 2019
    Inventors: Kevin B. Leigh, Sunil Rao Ganta Papa Rao Bala, Arlen L. Roesner
  • Publication number: 20190235185
    Abstract: An optical cable router is disclosed. The optical cable router is to couple to rocker-arm plenums of a modular computing system. The optical cable router includes a crossbar that includes an optical cable cavity. The optical cable cavity has a plurality of optical cables and an access panel. The optical cable router further includes optical connectors, each of which is coupled to a respective optical cable of the plurality of optical cables. Each optical connector is also coupled to a respective optical connector of a respective modular computing device retained in the modular computing system.
    Type: Application
    Filed: January 31, 2018
    Publication date: August 1, 2019
    Inventors: Kevin B. Leigh, Sunil Rao Ganta Papa Rao Bala, John Grady
  • Publication number: 20190161784
    Abstract: Computer-implemented processes for precision therapeutic biomarker screening for cancer include using a model-based overlapping clustering framework to assess large numbers of possible drugs and drug combinations against patient data, including cell line responsiveness. A multivariate regression model has been developed, along with a latent overlapping cluster indicator variable. The techniques employ a new finite mixture of multivariate regression (FMMR) model and expectation-maximization (EM) algorithm for modeling. The techniques can analyze large amounts of drug data and identify complex overlapping drug clusters, as well as cluster-wise drivers that facilitate identification of new drugs for treating pathologies, such as cancer, in patients.
    Type: Application
    Filed: July 31, 2017
    Publication date: May 30, 2019
    Inventors: Jonnagadda Sunil Rao, Hongmei Liu
  • Patent number: 10032710
    Abstract: An integrated circuit (IC) system includes an IC coupled to a package. The package, in turn, is coupled to a ball grid array. The integrated circuit is electrically coupled to the ball grid array by a plurality of package through-hole (PTH) vias that penetrate through the package. Each PTH via includes a conductive element associated with a differential signaling pair. The conductive elements within a given differential signaling pair are disposed in the package at specific locations, relative to other conductive elements in other differential signaling pairs, to reduce crosstalk between those differential signaling pairs. At least one advantage of technique described herein is that the conductive elements within the package can be densely packed together without inducing excessive crosstalk. Therefore, the package can support a large number of differential signaling pairs, allowing high-throughput data communication.
    Type: Grant
    Filed: July 23, 2015
    Date of Patent: July 24, 2018
    Assignee: NVIDIA CORPORATION
    Inventors: Seunghyun Hwang, Vishnu Balan, Sunil Rao Sudhakaran
  • Publication number: 20170025345
    Abstract: An integrated circuit (IC) system includes an IC coupled to a package. The package, in turn, is coupled to a ball grid array. The integrated circuit is electrically coupled to the ball grid array by a plurality of package through-hole (PTH) vias that penetrate through the package. Each PTH via includes a conductive element associated with a differential signaling pair. The conductive elements within a given differential signaling pair are disposed in the package at specific locations, relative to other conductive elements in other differential signaling pairs, to reduce crosstalk between those differential signaling pairs. At least one advantage of technique described herein is that the conductive elements within the package can be densely packed together without inducing excessive crosstalk. Therefore, the package can support a large number of differential signaling pairs, allowing high-throughput data communication.
    Type: Application
    Filed: July 23, 2015
    Publication date: January 26, 2017
    Inventors: Seunghyun HWANG, Vishnu BALAN, Sunil Rao SUDHAKARAN
  • Publication number: 20120322760
    Abstract: Methods of identifying and selecting subjects for treatment with a low molecular weight heparin (LMWH) composition are provided. Methods of treatment with the LMWH compositions are also provided.
    Type: Application
    Filed: September 22, 2010
    Publication date: December 20, 2012
    Applicant: MOMENTA PHARMACEUTICALS, INC.
    Inventors: Ian Fier, James Roach, Sunil Rao, Richard Clinton Becker
  • Patent number: 7237717
    Abstract: An electronic voting system comprising of one or more intelligent fixed in place voting machines, mobile voting machines and one or more trusted servers connected by secure wired or wireless communication means to enable electronic voting. A secure system for electronic voting by means of dynamically reconfiguring the mobile device as a mobile voting machine, said mobile voting machine communicating voice and data information with one or more trusted election servers to enable electronic voting in real time by leveraging the processing power/databases resident on the mobile device and or the processing power/databases resident on the trusted election servers. A system for providing disabled voters with enhanced utility by means such as language translation, speech recognition and other features by enabling the desired and enhanced functionality by using the processing power of the mobile device by itself and or in conjunction with the processing power of the local, central and or network server.
    Type: Grant
    Filed: November 8, 2003
    Date of Patent: July 3, 2007
    Assignee: IP Holdings, Inc.
    Inventors: Raman Rao, Rekha Rao, Sunil Rao
  • Publication number: 20070101326
    Abstract: A system and computer-implemented method of converting a contention scope attribute of a user thread executing in a multithreaded environment are described. The method includes dynamically converting the contention scope attribute of the user thread running in the multithreaded environment between a process scope and a system scope. In changing from system scope to process scope, the kernel thread to which the user thread is mapped is converted to a scheduler activation thread, the contention attribute for the user thread is reset in a threads library and the user thread is added to the run queue of a relevant virtual processor. In changing from process scope to system scope, the underlying scheduler activation kernel thread is permanently and exclusively mapped to the user thread to achieve a system scope for the thread. And a replacement scheduler activation kernel thread is created for other user threads of the same process previously sharing the original scheduler activation kernel thread.
    Type: Application
    Filed: October 27, 2005
    Publication date: May 3, 2007
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Weidong Cai, Deepak Tripathi, Sunil Rao