Patents by Inventor Suraj J. Mathew

Suraj J. Mathew has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10854611
    Abstract: Some embodiments include a memory cell having a first transistor supported by a semiconductor base, and having second and third transistors above the first transistor and vertically stacked one atop the other. Some embodiments include a memory cell having first, second and third transistors. The third transistor is above the second transistor, and the second and third transistors are above the first transistor. The first transistor has first and second source/drain regions, the second transistor has third and fourth source/drain regions, and the third transistor has fifth and sixth source/drain regions. A read bitline is coupled with the sixth source/drain region. A write bitline is coupled with the first source/drain region. A write wordline includes a gate of the first transistor. A read wordline includes a gate of the third transistor. A capacitor is coupled with the second source/drain region and with a gate of the second transistor.
    Type: Grant
    Filed: May 15, 2019
    Date of Patent: December 1, 2020
    Assignee: Micron Technology, Inc.
    Inventors: Suraj J. Mathew, Kris K. Brown, Raghunath Singanamalla, Vinay Nair, Fawad Ahmed, Fatma Arzum Simsek-Ege, Diem Thy N. Tran
  • Patent number: 10847516
    Abstract: Some embodiments include a memory cell having first, second and third transistors, with the second and third transistors being vertically displaced relative to one another. The memory cell has a semiconductor pillar extending along the second and third transistors, with the semiconductor pillar containing channel regions and source/drain regions of the second and third transistors. A capacitor may be electrically coupled between a source/drain region of the first transistor and a gate of the second transistor.
    Type: Grant
    Filed: July 2, 2019
    Date of Patent: November 24, 2020
    Assignee: Micron Technology, Inc.
    Inventors: Suraj J. Mathew, Raghunath Singanamalla, Fawad Ahmed, Kris K. Brown, Vinay Nair, Gloria Yang, Fatma Arzum Simsek-Ege, Diem Thy N. Tran
  • Patent number: 10546862
    Abstract: Some embodiments include an integrated assembly having active-region-pillars extending upwardly from a base. Each of the active-region-pillars has a pair of storage-element-contact-regions, and a digit-line-contact-region between the storage-element-contact-regions. The integrated assembly includes, along a cross-section, a first digit-line-contact-region adjacent a first storage-element-contact-region. The first digit-line-contact-region is recessed relative to the first storage-element-contact-region. A first digit-line is coupled with the first digit-line-contact-region. A second digit-line is laterally offset from the first digit-line. An insulative material is between the first digit-line and the first storage-element-contact-region. A cup-shaped indentation extends into the insulative material and the first storage-element-contact-region. Insulative spacers are along sidewalls of the first and second digit-lines, and include first material.
    Type: Grant
    Filed: January 15, 2019
    Date of Patent: January 28, 2020
    Assignee: Micron Technology, Inc.
    Inventors: Guangjun Yang, Suraj J. Mathew
  • Publication number: 20190326292
    Abstract: Some embodiments include a memory cell having first, second and third transistors, with the second and third transistors being vertically displaced relative to one another. The memory cell has a semiconductor pillar extending along the second and third transistors, with the semiconductor pillar containing channel regions and source/drain regions of the second and third transistors. A capacitor may be electrically coupled between a source/drain region of the first transistor and a gate of the second transistor.
    Type: Application
    Filed: July 2, 2019
    Publication date: October 24, 2019
    Applicant: Micron Technology, Inc.
    Inventors: Suraj J. Mathew, Raghunath Singanamalla, Fawad Ahmed, Kris K. Brown, Vinay Nair, Gloria Yang, Fatma Arzum Simsek-Ege, Diem Thy N. Tran
  • Publication number: 20190267379
    Abstract: Some embodiments include a memory cell having a first transistor supported by a semiconductor base, and having second and third transistors above the first transistor and vertically stacked one atop the other. Some embodiments include a memory cell having first, second and third transistors. The third transistor is above the second transistor, and the second and third transistors are above the first transistor. The first transistor has first and second source/drain regions, the second transistor has third and fourth source/drain regions, and the third transistor has fifth and sixth source/drain regions. A read bitline is coupled with the sixth source/drain region. A write bitline is coupled with the first source/drain region. A write wordline includes a gate of the first transistor. A read wordline includes a gate of the third transistor. A capacitor is coupled with the second source/drain region and with a gate of the second transistor.
    Type: Application
    Filed: May 15, 2019
    Publication date: August 29, 2019
    Applicant: Micron Technology, Inc.
    Inventors: Suraj J. Mathew, Kris K. Brown, Raghunath Singanamalla, Vinay Nair, Fawad Ahmed, Fatma Arzum Simsek-Ege, Diem Thy N. Tran
  • Patent number: 10361204
    Abstract: Some embodiments include a memory cell having first, second and third transistors, with the second and third transistors being vertically displaced relative to one another. The memory cell has a semiconductor pillar extending along the second and third transistors, with the semiconductor pillar containing channel regions and source/drain regions of the second and third transistors. A capacitor may be electrically coupled between a source/drain region of the first transistor and a gate of the second transistor.
    Type: Grant
    Filed: June 12, 2018
    Date of Patent: July 23, 2019
    Assignee: Micron Technology, Inc.
    Inventors: Suraj J. Mathew, Raghunath Singanamalla, Fawad Ahmed, Kris K. Brown, Vinay Nair, Gloria Yang, Fatma Arzum Slmsek-Ege, Diem Thy N. Tran
  • Patent number: 10319724
    Abstract: Some embodiments include a memory cell having a first transistor supported by a semiconductor base, and having second and third transistors above the first transistor and vertically stacked one atop the other. Some embodiments include a memory cell having first, second and third transistors. The third transistor is above the second transistor, and the second and third transistors are above the first transistor. The first transistor has first and second source/drain regions, the second transistor has third and fourth source/drain regions, and the third transistor has fifth and sixth source/drain regions. A read bitline is coupled with the sixth source/drain region. A write bitline is coupled with the first source/drain region. A write wordline includes a gate of the first transistor. A read wordline includes a gate of the third transistor. A capacitor is coupled with the second source/drain region and with a gate of the second transistor.
    Type: Grant
    Filed: July 12, 2018
    Date of Patent: June 11, 2019
    Assignee: Micron Technology, Inc.
    Inventors: Suraj J. Mathew, Kris K. Brown, Raghunath Singanamalla, Vinay Nair, Fawad Ahmed, Fatma Arzum Simsek-Ege, Diem Thy N. Tran
  • Publication number: 20190088652
    Abstract: Some embodiments include a memory cell having first and second transistors, and a capacitor vertically displaced relative to the first and second transistors. The capacitor has a first node electrically coupled with a source/drain region of the first transistor, a second node electrically coupled with a source/drain region of the second transistor, and capacitor dielectric material between the first and second nodes. Some embodiments include a memory cell having first and second transistors vertically displaced relative to one another, and a capacitor between the first and second transistors. The capacitor has a first node electrically coupled with a source/drain region of the first transistor, a second node electrically coupled with a source/drain region of the second transistor, and capacitor dielectric material between the first and second nodes.
    Type: Application
    Filed: November 7, 2018
    Publication date: March 21, 2019
    Applicant: Micron Technology, Inc.
    Inventors: Gloria Yang, Suraj J. Mathew, Raghunath Singanamalla, Vinay Nair, Scott J. Derner, Michael Amiel Shore, Brent Keeth, Fatma Arzum Simsek-Ege, Diem Thy N. Tran
  • Patent number: 10157926
    Abstract: Some embodiments include a memory cell having first and second transistors, and a capacitor vertically displaced relative to the first and second transistors. The capacitor has a first node electrically coupled with a source/drain region of the first transistor, a second node electrically coupled with a source/drain region of the second transistor, and capacitor dielectric material between the first and second nodes. Some embodiments include a memory cell having first and second transistors vertically displaced relative to one another, and a capacitor between the first and second transistors. The capacitor has a first node electrically coupled with a source/drain region of the first transistor, a second node electrically coupled with a source/drain region of the second transistor, and capacitor dielectric material between the first and second nodes.
    Type: Grant
    Filed: July 31, 2017
    Date of Patent: December 18, 2018
    Assignee: Micron Technology, Inc.
    Inventors: Gloria Yang, Suraj J. Mathew, Raghunath Singanamalla, Vinay Nair, Scott J. Derner, Michael Amiel Shore, Brent Keeth, Fatma Arzum Simsek-Ege, Diem Thy N. Tran
  • Publication number: 20180331107
    Abstract: Some embodiments include a memory cell having a first transistor supported by a semiconductor base, and having second and third transistors above the first transistor and vertically stacked one atop the other. Some embodiments include a memory cell having first, second and third transistors. The third transistor is above the second transistor, and the second and third transistors are above the first transistor. The first transistor has first and second source/drain regions, the second transistor has third and fourth source/drain regions, and the third transistor has fifth and sixth source/drain regions. A read bitline is coupled with the sixth source/drain region. A write bitline is coupled with the first source/drain region. A write wordline includes a gate of the first transistor. A read wordline includes a gate of the third transistor. A capacitor is coupled with the second source/drain region and with a gate of the second transistor.
    Type: Application
    Filed: July 12, 2018
    Publication date: November 15, 2018
    Applicant: Micron Technology, Inc.
    Inventors: Suraj J. Mathew, Kris K. Brown, Raghunath Singanamalla, Vinay Nair, Fawad Ahmed, Fatma Arzum Simsek-Ege, Diem Thy N. Tran
  • Publication number: 20180301454
    Abstract: Some embodiments include a memory cell having first, second and third transistors, with the second and third transistors being vertically displaced relative to one another. The memory cell has a semiconductor pillar extending along the second and third transistors, with the semiconductor pillar containing channel regions and source/drain regions of the second and third transistors. A capacitor may be electrically coupled between a source/drain region of the first transistor and a gate of the second transistor.
    Type: Application
    Filed: June 12, 2018
    Publication date: October 18, 2018
    Applicant: Micron Technology, Inc.
    Inventors: Suraj J. Mathew, Raghunath Singanamalla, Fawad Ahmed, Kris K. Brown, Vinay Nair, Gloria Yang, Fatma Arzum SImsek-Ege, Diem Thy N. Tran
  • Patent number: 10079235
    Abstract: Some embodiments include a memory cell having first, second and third transistors, with the second and third transistors being vertically displaced relative to one another. The memory cell has a semiconductor pillar extending along the second and third transistors, with the semiconductor pillar containing channel regions and source/drain regions of the second and third transistors. A capacitor may be electrically coupled between a source/drain region of the first transistor and a gate of the second transistor.
    Type: Grant
    Filed: July 31, 2017
    Date of Patent: September 18, 2018
    Assignee: Micron Technology, Inc.
    Inventors: Suraj J. Mathew, Raghunath Singanamalla, Fawad Ahmed, Kris K. Brown, Vinay Nair, Gloria Yang, Fatma Arzum Simsek-Ege, Diem Thy N. Tran
  • Patent number: 10056386
    Abstract: Some embodiments include a memory cell having a first transistor supported by a semiconductor base, and having second and third transistors above the first transistor and vertically stacked one atop the other. Some embodiments include a memory cell having first, second and third transistors. The third transistor is above the second transistor, and the second and third transistors are above the first transistor. The first transistor has first and second source/drain regions, the second transistor has third and fourth source/drain regions, and the third transistor has fifth and sixth source/drain regions. A read bitline is coupled with the sixth source/drain region. A write bitline is coupled with the first source/drain region. A write wordline includes a gate of the first transistor. A read wordline includes a gate of the third transistor. A capacitor is coupled with the second source/drain region and with a gate of the second transistor.
    Type: Grant
    Filed: July 31, 2017
    Date of Patent: August 21, 2018
    Assignee: Micron Technology, Inc.
    Inventors: Suraj J. Mathew, Kris K. Brown, Raghunath Singanamalla, Vinay Nair, Fawad Ahmed, Fatma Arzum Simsek-Ege, Diem Thy N. Tran
  • Publication number: 20180061835
    Abstract: Some embodiments include a memory cell having first and second transistors, and a capacitor vertically displaced relative to the first and second transistors. The capacitor has a first node electrically coupled with a source/drain region of the first transistor, a second node electrically coupled with a source/drain region of the second transistor, and capacitor dielectric material between the first and second nodes. Some embodiments include a memory cell having first and second transistors vertically displaced relative to one another, and a capacitor between the first and second transistors. The capacitor has a first node electrically coupled with a source/drain region of the first transistor, a second node electrically coupled with a source/drain region of the second transistor, and capacitor dielectric material between the first and second nodes.
    Type: Application
    Filed: July 31, 2017
    Publication date: March 1, 2018
    Inventors: Gloria Yang, Suraj J. Mathew, Raghunath Singanamalla, Vinay Nair, Scott J. Derner, Michael Amiel Shore, Brent Keeth, Fatma Arzum Simsek-Ege, Diem Thy N. Tran
  • Publication number: 20180061837
    Abstract: Some embodiments include a memory cell having a first transistor supported by a semiconductor base, and having second and third transistors above the first transistor and vertically stacked one atop the other. Some embodiments include a memory cell having first, second and third transistors. The third transistor is above the second transistor, and the second and third transistors are above the first transistor. The first transistor has first and second source/drain regions, the second transistor has third and fourth source/drain regions, and the third transistor has fifth and sixth source/drain regions. A read bitline is coupled with the sixth source/drain region. A write bitline is coupled with the first source/drain region. A write wordline includes a gate of the first transistor. A read wordline includes a gate of the third transistor. A capacitor is coupled with the second source/drain region and with a gate of the second transistor.
    Type: Application
    Filed: July 31, 2017
    Publication date: March 1, 2018
    Inventors: Suraj J. Mathew, Kris K. Brown, Raghunath Singanamalla, Vinay Nair, Fawad Ahmed, Fatma Arzum Simsek-Ege, Diem Thy N. Tran
  • Publication number: 20180061836
    Abstract: Some embodiments include a memory cell having first, second and third transistors, with the second and third transistors being vertically displaced relative to one another. The memory cell has a semiconductor pillar extending along the second and third transistors, with the semiconductor pillar containing channel regions and source/drain regions of the second and third transistors. A capacitor may be electrically coupled between a source/drain region of the first transistor and a gate of the second transistor.
    Type: Application
    Filed: July 31, 2017
    Publication date: March 1, 2018
    Inventors: Suraj J. Mathew, Raghunath Singanamalla, Fawad Ahmed, Kris K. Brown, Vinay Nair, Gloria Yang, Fatma Arzum Simsek-Ege, Diem Thy N. Tran
  • Publication number: 20150249089
    Abstract: A memory cell includes a transistor device comprising a pair of source/drains, a body comprising a channel, and a gate construction operatively proximate the channel. The memory cell includes a capacitor comprising a pair of capacitor electrodes having a capacitor dielectric there-between. One of the capacitor electrodes is the channel or is electrically coupled to the channel. The other of the capacitor electrodes includes a portion of the body other than the channel. Methods are also disclosed.
    Type: Application
    Filed: May 14, 2015
    Publication date: September 3, 2015
    Inventors: Kamal M. Karda, Suraj J. Mathew, Jaydip Guha
  • Patent number: 9059030
    Abstract: A memory cell includes a transistor device comprising a pair of source/drains, a body comprising a channel, and a gate construction operatively proximate the channel. The memory cell includes a capacitor comprising a pair of capacitor electrodes having a capacitor dielectric there-between. One of the capacitor electrodes is the channel or is electrically coupled to the channel. The other of the capacitor electrodes includes a portion of the body other than the channel. Methods are also disclosed.
    Type: Grant
    Filed: October 7, 2011
    Date of Patent: June 16, 2015
    Assignee: Micron Technology, Inc.
    Inventors: Kamal M. Karda, Suraj J. Mathew, Jaydip Guha
  • Patent number: 9054216
    Abstract: Trenches are formed into semiconductive material. Masking material is formed laterally over at least elevationally inner sidewall portions of the trenches. Conductivity modifying impurity is implanted through bases of the trenches into semiconductive material there-below. Such impurity is diffused into the masking material received laterally over the elevationally inner sidewall portions of the trenches and into semiconductive material received between the trenches below a mid-channel portion. An elevationally inner source/drain is formed in the semiconductive material below the mid-channel portion. The inner source/drain portion includes said semiconductive material between the trenches which has the impurity therein. A conductive line is formed laterally over and electrically coupled to at least one of opposing sides of the inner source/drain. A gate is formed elevationally outward of and spaced from the conductive line and laterally adjacent the mid-channel portion. Other embodiments are disclosed.
    Type: Grant
    Filed: June 30, 2014
    Date of Patent: June 9, 2015
    Assignee: Micron Technology, Inc.
    Inventors: Jaydip Guha, Shyam Surthi, Suraj J. Mathew, Kamal M. Karda, Hung-Ming Tsai
  • Publication number: 20150001605
    Abstract: A method of forming a gate construction of a recessed access device includes forming a pair of sidewall spacers laterally over opposing sidewalls of a gate dielectric and elevationally over first conductive gate material. The gate dielectric, the first conductive gate material, and the sidewall spacers are received within a trench formed in semiconductive material. Second conductive gate material is deposited within the semiconductive material trench between the pair of sidewall spacers in electrical connection with the first conductive gate material. Other implementations are disclosed, including recessed access device gate constructions independent of method of manufacture.
    Type: Application
    Filed: September 16, 2014
    Publication date: January 1, 2015
    Inventors: Suraj J. Mathew, Jaydip Guha