Abstract: A system, method, and computer-readable medium are disclosed for performing a data center connectivity management operation. The connectivity management operation includes: providing a plurality of data center assets with a respective plurality of data center asset client modules; establishing a connection between the respective plurality of data center asset client modules and a connectivity management system, the connectivity management system comprising a connectivity management system aggregator; discovering interrelationships of the plurality of data center assets; and, generating a topological map of the plurality of data center assets based upon the interrelationships of the plurality of data center assets.

Abstract: The disclosure relates to isolated microorganisms—including novel strains of the microorganisms—microbial consortia, and agricultural compositions comprising the same. Furthermore, the disclosure teaches methods of utilizing the described microorganisms, microbial consortia, and agricultural compositions comprising the same, in methods for imparting beneficial properties to target plant species. In particular aspects, the disclosure provides methods of increasing desirable plant traits in agronomically important crop species.

Abstract: A software product using gaming protocols and technology to help people deal with chronic conditions is described herein comprising four modules. The first module presents a therapeutic component to teach condition management skills. The second module presents a query component to assess various conditions. The third module presents an activities component to determine progress towards learning condition management skills. The fourth module presents a progression module to track that progress. Progress reports detailing the user's progress may be provided.

Abstract: Apparatuses and methods for positioning an embroidery pattern are provided. According to an illustrative embodiment, an apparatus for positioning an embroidery pattern includes a central edge adapted to be positioned adjacent a centerline of an embroiderable, and an outer edge comprising a set of first, embroidery-positioning points. The set of first points is adapted to receive an adjacent marking to indicate a starting point for embroidering an embroidery pattern on the embroiderable.

Abstract: A printhead assembly includes an ink manifold having a plurality of ink outlets defined in a manifold bonding surface; one or more printhead integrated circuits, each printhead integrated circuit having a plurality of ink inlets defined in a printhead bonding surface; and an adhesive film sandwiched between said manifold bonding surface and said one or more printhead bonding surfaces, said film having a plurality of ink supply holes defined therein, each ink supply hole being aligned with an ink outlet and an ink inlet. The adhesive film is a laminated film comprising a central polymeric film sandwiched between a first adhesive layer and a second adhesive layer, the first adhesive layer has a melt temperature lower than that of the second adhesive layer.

Abstract: A quality valuation system and method that includes a server system in communication with a user computer over a network and a data repository that stores quality indicator data relating to room quality indicators received from the user computer via the network. The server system includes one or more processors configured to communicate with the user computer through the network to display a webpage using the user computer and to receive the quality indicator data entered into the webpage in response to queries provided by the webpage, determine a quality metric based on the quality data received from the user computer; determine the quality level based on the quality metric, and communicate, through the network, the quality level to the user computer for display via the webpage.

Abstract: A method of fabricating an apertured polymeric film. The method comprising the steps of: (a) masking a polymeric film with a first mask having first laser transmission zones defined therein; (b) laser-ablating first apertures through the polymeric film using the first mask; (c) masking the film with a second mask having second laser transmission zones defined therein, each second zone being aligned with a corresponding first aperture, and each second zone having greater perimeter dimensions than the corresponding first aperture; and (d) reaming the first apertures by laser-ablating the polymeric film using the second mask, the reamed first apertures defining second apertures in the film.

Abstract: A printhead assembly includes: a molded ink manifold having a plurality of ink outlets defined in a manifold bonding surface; and printhead integrated circuits bonded to the manifold bonding surface. The manifold bonding surface includes a polymer coating, which plugs fissures in the molded ink manifold.

Abstract: An apparatus for forming an asymmetrical encapsulant bead on a series of wire bonds electrically connecting a micro-electronic device to a series of conductors. The micro-electronic device has a planar active surface with functional elements. The apparatus includes: a tiltable table for supporting the micro-electronic device, the table being configured for tilting the planar active surface at a predetermined angle relative to the horizontal; and a jetter positioned above the tiltable structure for jetting drops of encapsulant material onto the series of wire bonds.

Abstract: A printhead assembly includes: a molded ink manifold having a plurality of ink outlets defined in a manifold bonding surface; and printhead integrated circuits bonded to the manifold bonding surface. The manifold bonding surface includes a polymer coating, which plugs fissures in the molded ink manifold.

Abstract: An electronic component that has a support structure with a plurality of electrical conductors, a series of wire bonds, each of the wire bonds extending from one of the electrical conductors respectively, each of the wire bonds having an end section contacting the electrical conductor and an intermediate section contiguous with the end section, a bead of dam encapsulant encapsulating the electrical conductors and the end section of each of the wire bonds, and a bead of fill encapsulant contacting the bead of dam encapsulant and encapsulating the intermediate portion of each of the wire bonds. The dam encapsulant has a higher modulus of elasticity than the fill encapsulant.

Abstract: A printhead assembly includes a molded ink manifold, a plurality of printhead integrated circuits, and an adhesive film sandwiched between the ink manifold and the printhead integrated circuits. A manifold bonding surface of the molded ink manifold includes a polymer coating. The polymer coating plugs fissures resulting from a molding process used to mold the ink manifold.

Abstract: A printhead assembly includes a molded ink manifold, a plurality of printhead integrated circuits, and an adhesive film sandwiched between the ink manifold and the printhead integrated circuits. A manifold bonding surface of the molded ink manifold includes a polymer coating. The polymer coating plugs fissures resulting from a molding process used to mold the ink manifold.

Abstract: A printhead assembly includes an ink manifold having a plurality of ink outlets defined in a manifold bonding surface; one or more printhead integrated circuits, each printhead integrated circuit having a plurality of ink inlets defined in a printhead bonding surface; and an adhesive film sandwiched between said manifold bonding surface and said one or more printhead bonding surfaces, said film having a plurality of ink supply holes defined therein, each ink supply hole being aligned with an ink outlet and an ink inlet. The adhesive film is a laminated film comprising a central polymeric film sandwiched between a first adhesive layer and a second adhesive layer, the first adhesive layer has a melt temperature lower than that of the second adhesive layer.

Abstract: A method of assembling a pagewidth printhead. The method includes: aligning a multilayered adhesive film an said ink supply manifold such that ink supply holes in the film are aligned with respective ink outlets in the ink supply manifold; bonding a first adhesive layer of the film to a manifold bonding surface; heating a printhead integrated circuit and positioning the heated printhead integrated circuit on an opposite side of the film such that each ink supply hole is aligned with an ink inlet defined in a printhead bonding surface of the printhead integrated circuit; and repeatedly bonding printhead integrated circuits to the film to provide the pagewidth printhead.

Abstract: A laminated film for attachment of printhead integrated circuits to an ink supply manifold. The film has a plurality of ink supply holes defined therein and film comprises: a central polymeric film; a first adhesive layer for bonding a first surface of the film to the ink supply manifold; and a second adhesive layer for bonding a second surface of the film to the printhead integrated circuits. The central polymeric film is sandwiched between the first and second adhesive layers. A first melt temperature of the first adhesive layer is at least 20° C. less than a second melt temperature of the second adhesive layer.

Abstract: A laminated film for attachment of printhead integrated circuits to an ink supply manifold. The film has a plurality of ink supply holes defined therein and film comprises: a central polymeric web; a first adhesive layer for bonding a first surface of the film to the ink supply manifold; and a second adhesive layer for bonding a second surface of the film to the printhead integrated circuits. The central polymeric web is sandwiched between the first and second adhesive layers. A first melt temperature of the first adhesive layer is at least 20° C. less than a second melt temperature of the second adhesive layer.

Abstract: A method of assembling a pagewidth printhead. The method includes: aligning a multilayered adhesive film an said ink supply manifold such that ink supply holes in the film are aligned with respective ink outlets in the ink supply manifold; bonding a first adhesive layer of the film to a manifold bonding surface; heating a printhead integrated circuit and positioning the heated printhead integrated circuit on an opposite side of the film such that each ink supply hole is aligned with an ink inlet defined in a printhead bonding surface of the printhead integrated circuit; and repeatedly bonding printhead integrated circuits to the film to provide the pagewidth printhead.

Abstract: A printhead assembly includes a molded ink manifold, a plurality of printhead integrated circuits, and an adhesive film sandwiched between the ink manifold and the printhead integrated circuits. A manifold bonding surface of the molded ink manifold includes a polymer coating. The polymer coating plugs fissures resulting from a molding process used to mold the ink manifold.

Abstract: A printhead assembly includes a molded ink manifold, a plurality of printhead integrated circuits, and an adhesive film sandwiched between the ink manifold and the printhead integrated circuits. A manifold bonding surface of the molded ink manifold includes a polymer coating. The polymer coating plugs fissures resulting from a molding process used to mold the ink manifold.