Abstract: A method of attaching one or more printhead integrated circuits to an ink supply manifold. The method comprises the steps of: (a) providing a laminated film having a plurality of ink supply holes defined therein, the laminated film comprising a central polymeric film sandwiched between first and second adhesive layers, wherein a first melt temperature of the first adhesive layer is at least 20° C.

Abstract: A laminated film for attachment of printhead integrated circuits to an ink supply manifold. The film has a plurality of ink supply holes defined therein and film comprises: a central polymeric film; a first adhesive layer for bonding a first surface of the film to the ink supply manifold; and a second adhesive layer for bonding a second surface of the film to the printhead integrated circuits. The central polymeric film is sandwiched between the first and second adhesive layers. A first melt temperature of the first adhesive layer is at least 20° C. less than a second melt temperature of the second adhesive layer.

Abstract: A laminated film for attachment of printhead integrated circuits to an ink supply manifold. The film has a plurality of ink supply holes defined therein and film comprises: a central polymeric web; a first adhesive layer for bonding a first surface of the film to the ink supply manifold; and a second adhesive layer for bonding a second surface of the film to the printhead integrated circuits. The central polymeric web is sandwiched between the first and second adhesive layers. A first melt temperature of the first adhesive layer is at least 20° C. less than a second melt temperature of the second adhesive layer.

Abstract: A method of attaching one or more printhead integrated circuits to an ink supply manifold. The method comprises the steps of: (a) providing a laminated film having a plurality of ink supply holes defined therein, the laminated film comprising a central polymeric film sandwiched between first and second adhesive layers, wherein a first melt temperature of the first adhesive layer is at least 20° C.

Abstract: A method of fabricating an apertured polymeric film. The method comprising the steps of: (a) masking a polymeric film with a first mask having first laser transmission zones defined therein; (b) laser-ablating first apertures through the polymeric film using the first mask; (c) masking the film with a second mask having second laser transmission zones defined therein, each second zone being aligned with a corresponding first aperture, and each second zone having greater perimeter dimensions than the corresponding first aperture; and (d) reaming the first apertures by laser-ablating the polymeric film using the second mask, the reamed first apertures defining second apertures in the film.

Abstract: An electronic component that has a support structure with a plurality of electrical conductors, a series of wire bonds, each of the wire bonds extending from one of the electrical conductors respectively, each of the wire bonds having an end section contacting the electrical conductor and an intermediate section contiguous with the end section, a bead of dam encapsulant encapsulating the electrical conductors and the end section of each of the wire bonds, and a bead of fill encapsulant contacting the bead of dam encapsulant and encapsulating the intermediate portion of each of the wire bonds. The dam encapsulant has a higher modulus of elasticity than the fill encapsulant.

Abstract: An electronic component that has a support structure with a plurality of electrical conductors, a series of wire bonds, each of the wire bonds extending from one of the electrical conductors respectively, each of the wire bonds having an end section contacting the electrical conductor and an intermediate section contiguous with the end section, a bead of dam encapsulant encapsulating the electrical conductors and the end section of each of the wire bonds, and a bead of fill encapsulant contacting the bead of dam encapsulant and encapsulating the intermediate portion of each of the wire bonds. The dam encapsulant has a higher modulus of elasticity than the fill encapsulant.

Abstract: An article having a printed image is formed from a substrate, an adhesive disposed over the substrate, a sheet disposed over the adhesive, a digitally printed image directly printed on the sheet, and an elastomer disposed over the printed image.

Abstract: Hair care products represent a world-wide multi-billion dollar industry. Pre-formed polymers are commonly used in a variety of hair care products including shampoos, conditioners, gels, and hair sprays. The present invention provides technology for polymerizing monomers on hair in situ to produce desired hair characteristics. This eliminates the solubility and application issues found with some polymers. The polymerization of monomers on hair is typically initiated using a thermal or photoinitiatied free radical initiator. In certain embodiments, the monomers are fluorinated thereby producing a fluorinated polymer on the hair upon polymerization. The invention provides monomers, initiators, methods, and kits for use in treating hair with polymers.

Abstract: A system and method for identifying and measuring adherence to software development requirements is presented. A software agent provides a user with product and technical questions. In turn, the user provides product and technical answers, or attributes, which are stored in a repository. A globalization plan generator uses the product and technical attributes to generate a software development plan. In addition, a globalization verification test generator uses the globalization plan to generate a test plan and measure the success of the software product based upon the test plan.

Abstract: There is disclosed a dielectric antenna comprising a dielectric resonator mounted in direct contact with a microstrip transmission line formed on one side of a printed circuit board. The dielectric antenna may be a dielectric resonator antenna (DRA), a high dielectric antenna (HDA) or a dielectrically-loaded antenna. The simple construction of the antenna leads to improved manufacturing reliability and efficiency, and allows all functional features of the antenna to be located on one side of a printed circuit board (PCB) substrate.

Abstract: The present invention relates to a softening-through-the-wash composition comprising: (i) a fabric-softening cationic quaternary ammonium di-ester compound comprising a cationic quaternary ammonium component having the formula: wherein, each R is independently selected from C12–C22 alkyl groups; and (ii) a source of acid selected from the group consisting of C12–C22 fatty acids, mono-alkyl esters of a C12-C22 alkyl sulphuric acids, C11–C13 alkyl benzene sulphonic acids, anionic derivatives thereof, salts thereof, and combinations thereof; and (iii) clay; and (iv) one or more adjunct components.

Abstract: There is disclosed a dielectric antenna comprising a dielectric resonator mounted in direct contact with a microstrip transmission line formed on one side of a printed circuit board. The dielectric antenna may be a dielectric resonator antenna (DRA), a high dielectric antenna (HDA) or a dielectrically-loaded antenna. The simple construction of the antenna leads to improved manufacturing reliability and efficiency, and allows all functional features of the antenna to be located on one side of a printed circuit board (PCB) substrate.

Abstract: The present invention relates to a softening-through-the-wash composition comprising:

Abstract: There is provided a detergent composition comprising (a) an organic polymer containing acrylic acid or its salts, having an average molecular weight of less than 15,000; and (b) an amino tricarboxylic acid or its salts or complexes or any mixture thereof exhibiting improved soil and stain removal.

Abstract: Detergent compositions comprising an amino tricarboxylic acid with a rapid rate of dissolution in a washing liquor exhibit a reduced tendency to leave calcium carbonate, lime soap and other deposits on substrates being cleaned. Dishwashing and laundry compositions comprising percarbonate bleach and methyl glycine diacetic acid are provided.

Abstract: A soft contact lens comprising a silicone-hydrogel made by curing a reaction mixture comprising a silicone-containing monomer.