Patents by Inventor Susanne Westenhöfer
Susanne Westenhöfer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20160031169Abstract: A device comprises at least one optics member (O) comprising at least one transparent portion (t) and at least one blocking portion (b). The at least one transparent portion (t) is made of one or more materials substantially transparent for light of at least a specific spectral range, referred to as transparent materials, and the at least one blocking portion (b) is made of one or more materials substantially non-transparent for light of the specific spectral range, referred to as non-transparent materials. The transparent portion (t) comprises at least one passive optical component (L). The at least one passive optical component (L) comprises a transparent element (6) having two opposing approximately flat surfaces substantially perpendicular to a vertical direction in a distance approximately equal to a thickness of the at least one blocking portion (b) measured along the vertical direction, and, attached to the transparent element (6), at least one optical structure (5).Type: ApplicationFiled: October 14, 2015Publication date: February 4, 2016Inventors: Hartmut Rudmann, Susanne Westenhöfer, Bojan Tesanovic
-
Patent number: 9193120Abstract: A device comprises at least one optics member (O) comprising at least one transparent portion (t) and at least one blocking portion (b). The at least one transparent portion (t) is made of one or more materials substantially transparent for light of at least a specific spectral range, referred to as transparent materials, and the at least one blocking portion (b) is made of one or more materials substantially non-transparent for light of the specific spectral range, referred to as non-transparent materials. The transparent portion (t) comprises at least one passive optical component (L). The at least one passive optical component (L) comprises a transparent element (6) having two opposing approximately flat surfaces substantially perpendicular to a vertical direction in a distance approximately equal to a thickness of the at least one blocking portion (b) measured along the vertical direction, and, attached to the transparent element (6), at least one optical structure (5).Type: GrantFiled: May 28, 2014Date of Patent: November 24, 2015Assignee: Heptagon Micro Optics Pte. Ltd.Inventors: Hartmut Rudmann, Susanne Westenhöfer, Bojan Tesanovic
-
Publication number: 20150325613Abstract: Optoelectronic modules include an optoelectronic device and a transparent cover. A non-transparent material is provided on the sidewalls of the transparent cover, which can help reduce light leakage from the sides of the transparent cover or can help reduce stray light from entering the module. The modules can be fabricated, for example, in wafer-level processes. In some implementations, openings such as trenches are formed in a transparent wafer. The trenches then can be filled with a non-transparent material using, for example, a vacuum injection tool. When a wafer-stack including the trench-filled transparent wafer subsequently is separated into individual modules, the result is that each module can include a transparent cover having sidewalls that are covered by the non-transparent material.Type: ApplicationFiled: June 18, 2015Publication date: November 12, 2015Inventors: Hartmut Rudmann, Simon Gubser, Susanne Westenhöfer, Stephan Heimgartner, Jens Geiger, Xu Yi, Thng Chong Kim, John A. Vidallon, Ji Wang, Qi Chuan Yu, Kam Wah Leong
-
Patent number: 9094593Abstract: Optoelectronic modules include an optoelectronic device and a transparent cover. A non-transparent material is provided on the sidewalls of the transparent cover, which can help reduce light leakage from the sides of the transparent cover or can help reduce stray light from entering the module. The modules can be fabricated, for example, in wafer-level processes. In some implementations, openings such as trenches are formed in a transparent wafer. The trenches then can be filled with a non-transparent material using, for example, a vacuum injection tool. When a wafer-stack including the trench-filled transparent wafer subsequently is separated into individual modules, the result is that each module can include a transparent cover having sidewalls that are covered by the non-transparent material.Type: GrantFiled: July 24, 2014Date of Patent: July 28, 2015Assignee: Heptagon Micro Optics Pte. Ltd.Inventors: Hartmut Rudmann, Simon Gubser, Susanne Westenhöfer, Stephan Heimgartner, Jens Geiger, Xu Yi, Thng Chong Kim, John A. Vidallon, Ji Wang, Qi Chuan Yu, Kam Wah Leong
-
Patent number: 8975108Abstract: An optical proximity sensor module includes a substrate, a light emitter mounted on a first surface of the substrate, the light emitter being operable to emit light at a first wavelength, and a light detector mounted on the first surface of the substrate, the light detector being operable to detect light at the first wavelength. The module includes an optics member disposed substantially parallel to the substrate, and a separation member disposed between the substrate and the optics member. The separation member may surround the light emitter and the light detector, and may include a wall portion that extends from the substrate to the optics member and that separates the light emitter and the light detector from one another. The separation member may be composed, for example, of a non-transparent polymer material containing a pigment, such as carbon black.Type: GrantFiled: June 13, 2014Date of Patent: March 10, 2015Assignee: Heptagon Micro Optics Pte. Ltd.Inventors: Hartmut Rudmann, Alexander Bietsch, Susanne Westenhöfer, Simon Gubser
-
Publication number: 20150034975Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.Type: ApplicationFiled: July 24, 2014Publication date: February 5, 2015Inventors: Hartmut Rudmann, Simon Gubser, Susanne Westenhöfer, Stephan Heimgartner, Jens Geiger, Sonja Hanselmann, Christoph Friese, Xu Yi, Thng Chong Kim, John A. Vidallon, Ji Wang, Qi Chuan Yu, Kam Wah Leong
-
Publication number: 20150036046Abstract: Optoelectronic modules include an optoelectronic device and a transparent cover. A non-transparent material is provided on the sidewalls of the transparent cover, which can help reduce light leakage from the sides of the transparent cover or can help reduce stray light from entering the module. The modules can be fabricated, for example, in wafer-level processes. In some implementations, openings such as trenches are formed in a transparent wafer. The trenches then can be filled with a non-transparent material using, for example, a vacuum injection tool. When a wafer-stack including the trench-filled transparent wafer subsequently is separated into individual modules, the result is that each module can include a transparent cover having sidewalls that are covered by the non-transparent material.Type: ApplicationFiled: July 24, 2014Publication date: February 5, 2015Inventors: Hartmut Rudmann, Simon Gubser, Susanne Westenhöfer, Stephan Heimgartner, Jens Geiger, Xu Yi, Thng Chong Kim, John A. Vidallon, Ji Wang, Qi Chuan Yu, Kam Wah Leong
-
Publication number: 20140347747Abstract: A device comprises at least one optics member (O) comprising at least one transparent portion (t) and at least one blocking portion (b). The at least one transparent portion (t) is made of one or more materials substantially transparent for light of at least a specific spectral range, referred to as transparent materials, and the at least one blocking portion (b) is made of one or more materials substantially non-transparent for light of the specific spectral range, referred to as non-transparent materials. The transparent portion (t) comprises at least one passive optical component (L). The at least one passive optical component (L) comprises a transparent element (6) having two opposing approximately flat surfaces substantially perpendicular to a vertical direction in a distance approximately equal to a thickness of the at least one blocking portion (b) measured along the vertical direction, and, attached to the transparent element (6), at least one optical structure (5).Type: ApplicationFiled: May 28, 2014Publication date: November 27, 2014Applicant: Heptagon Micro Optics Pte. Ltd.Inventors: Hartmut Rudmann, Susanne Westenhöfer, Bojan Tesanovic
-
Publication number: 20140291703Abstract: An optical proximity sensor module includes a substrate, a light emitter mounted on a first surface of the substrate, the light emitter being operable to emit light at a first wavelength, and a light detector mounted on the first surface of the substrate, the light detector being operable to detect light at the first wavelength. The module includes an optics member disposed substantially parallel to the substrate, and a separation member disposed between the substrate and the optics member. The separation member may surround the light emitter and the light detector, and may include a wall portion that extends from the substrate to the optics member and that separates the light emitter and the light detector from one another. The separation member may be composed, for example, of a non-transparent polymer material containing a pigment, such as carbon black.Type: ApplicationFiled: June 13, 2014Publication date: October 2, 2014Inventors: Hartmut Rudmann, Alexander Bietsch, Susanne Westenhöfer, Simon Gubser
-
Publication number: 20140263973Abstract: Compact optoelectronic modules are described and can be used in various electronic or other appliances, such as television units. For example, a light emitting device, a first sensor or sensor module such as an infra-red sensor or an infra-red receiver module, and a second sensor or sensor module such as an ambient light sensor or ambient light sensor module, can be integrated into a single compact optoelectronic module. Multiple such optoelectronic modules can be fabricated in a wafer-level process.Type: ApplicationFiled: March 7, 2014Publication date: September 18, 2014Applicant: Heptagon Micro Optics Pte. Ltd.Inventors: Jens Geiger, Susanne Westenhöfer
-
Patent number: 8791489Abstract: An optical proximity sensor module includes a substrate, a light emitter mounted on a first surface of the substrate, the light emitter being operable to emit light at a first wavelength, and a light detector mounted on the first surface of the substrate, the light detector being operable to detect light at the first wavelength. The module includes an optics member disposed substantially parallel to the substrate, and a separation member disposed between the substrate and the optics member. The separation member may surround the light emitter and the light detector, and may include a wall portion that extends from the substrate to the optics member and that separates the light emitter and the light detector from one another. The separation member may be composed, for example, of a non-transparent polymer material containing a pigment, such as carbon black.Type: GrantFiled: March 14, 2013Date of Patent: July 29, 2014Assignee: Heptagon Micro Optics Pte. Ltd.Inventors: Hartmut Rudmann, Alexander Bietsch, Susanne Westenhoefer, Simon Gubser
-
Patent number: 8767303Abstract: A device comprises at least one optics member (O) comprising at least one transparent portion (t) and at least one blocking portion (b). The at least one transparent portion (t) is made of one or more materials substantially transparent for light of at least a specific spectral range, referred to as transparent materials, and the at least one blocking portion (b) is made of one or more materials substantially non-transparent for light of the specific spectral range, referred to as non-transparent materials. The transparent portion (t) comprises at least one passive optical component (L). The at least one passive optical component (L) comprises a transparent element (6) having two opposing approximately flat surfaces substantially perpendicular to a vertical direction in a distance approximately equal to a thickness of the at least one blocking portion (b) measured along the vertical direction, and, attached to the transparent element (6), at least one optical structure (5).Type: GrantFiled: July 19, 2012Date of Patent: July 1, 2014Assignee: Heptagon Micro Optics Pte. Ltd.Inventors: Hartmut Rudmann, Susanne Westenhoefer, Bojan Tesanovic
-
Patent number: 8606057Abstract: Opto-electronic modules include conductive wiring and connections that can facilitate integrating the modules into an external device. Some opto-electronic modules include an opto-electronic stack that includes at least one lens and an opto-electronic element. Conductive paths can extend from the bottom to the top of the module. The conductive paths can include conductive pads on the surface of the opto-electronic element, as well as wiring at least partially embedded in a substrate and walls of a housing for the opto-electronic stack. Conductive connections can be disposed between a top surface of the substrate and the bottom surface of the walls such that the conductive connections electrically connect the second wiring to the first wiring and to the conductive pads on the surface of the opto-electronic element. The modules can be fabricated, for example, in wafer-level processes so that multiple opto-electronic modules can be manufactured at the same time.Type: GrantFiled: November 26, 2012Date of Patent: December 10, 2013Assignee: Heptagon Micro Optics Pte. Ltd.Inventors: Hartmut Rudmann, Mario Cesana, Jukka Alasirnio, Philippe Bouchilloux, Susanne Westenhoefer, Jens Geiger
-
Publication number: 20130264586Abstract: An optical proximity sensor module includes a substrate, a light emitter mounted on a first surface of the substrate, the light emitter being operable to emit light at a first wavelength, and a light detector mounted on the first surface of the substrate, the light detector being operable to detect light at the first wavelength. The module includes an optics member disposed substantially parallel to the substrate, and a separation member disposed between the substrate and the optics member. The separation member may surround the light emitter and the light detector, and may include a wall portion that extends from the substrate to the optics member and that separates the light emitter and the light detector from one another. The separation member may be composed, for example, of a non-transparent polymer material containing a pigment, such as carbon black.Type: ApplicationFiled: March 14, 2013Publication date: October 10, 2013Inventors: Hartmut Rudmann, Alexander Bietsch, Susanne Westenhoefer, Simon Gubser
-
Publication number: 20130033767Abstract: A device comprises at least one optics member (O) comprising at least one transparent portion (t) and at least one blocking portion (b). The at least one transparent portion (t) is made of one or more materials substantially transparent for light of at least a specific spectral range, referred to as transparent materials, and the at least one blocking portion (b) is made of one or more materials substantially non-transparent for light of the specific spectral range, referred to as non-transparent materials. The transparent portion (t) comprises at least one passive optical component (L). The at least one passive optical component (L) comprises a transparent element (6) having two opposing approximately flat surfaces substantially perpendicular to a vertical direction in a distance approximately equal to a thickness of the at least one blocking portion (b) measured along the vertical direction, and, attached to the transparent element (6), at least one optical structure (5).Type: ApplicationFiled: July 19, 2012Publication date: February 7, 2013Applicant: HEPTAGON MICRO OPTICS PTE. LTD.Inventors: Hartmut Rudmann, Susanne Westenhoefer, Bojan Tesanovic
-
Patent number: 7704418Abstract: An optical element is manufactured using a replication tool comprising a negative structural feature defined in a replication side of the replication tool, and a peripheral feature formed in the replication side of the replication tool adjacent the negative structural feature. The negative structural feature defines the shape of the optical element. A replication material is disposed between a substrate and the replication tool, which are moved toward each other. The peripheral feature confines the replication material to a predetermined area of the substrate. The replication material can be hardened to form the optical element from the replication material attached to the substrate.Type: GrantFiled: November 20, 2007Date of Patent: April 27, 2010Assignee: Heptagon OyInventors: Harmut Rudmann, Stephan Heimgartner, Susanne Westenhöfer, Markus Rossi