Patents by Inventor Sushant S. Koshti

Sushant S. Koshti has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220297320
    Abstract: A factory interface includes a housing, a front surface of the housing having multiple load ports, a robot having an arm and an end effector, and a track attached to a floor within the housing. The robot is adapted to move horizontally along the track to multiple positions from which the arm can reach the end effector of the robot into a front opening unified pod attached to any of the multiple load ports.
    Type: Application
    Filed: March 10, 2022
    Publication date: September 22, 2022
    Inventors: Paul B. Reuter, Sushant S. Koshti, Maureen Frances Breiling
  • Patent number: 11450539
    Abstract: Electronic device processing systems including environmental control of the factory interface are described. One electronic device processing system has a factory interface having a factory interface chamber, a load lock apparatus coupled to the factory interface, one or more substrate carriers coupled to the factory interface, and an environmental control system coupled to the factory interface and operational to monitor or control one of: relative humidity, temperature, an amount of oxygen, or an amount of inert gas within the factory interface chamber. In another aspect, purge of a carrier purge chamber within the factory interface chamber is provided. Methods for processing substrates are described, as are numerous other aspects.
    Type: Grant
    Filed: August 24, 2018
    Date of Patent: September 20, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Sushant S. Koshti, Dean C. Hruzek, Ayan Majumdar, John C. Menk, Helder T. Lee, Sangram Patil, Sanjay Rajaram, Douglas B. Baumgarten, Nir Merry
  • Publication number: 20220285193
    Abstract: The disclosure describes devices, systems, and methods for integrating load locks into a factory interface footprint space. A factory interface for an electronic device manufacturing system can include a load port for receiving a substrate carrier. The load port can include a frame adapted for connecting the load port to a factory interface, the frame comprising a transport opening through which one or more substrates are capable of being transported between the substrate carrier and the factory interface. The load port can also include an actuator coupled to the frame, and a load port door coupled to the actuator and configured to seal the transport opening. The frame height can be greater than the height of the load port door, and less than 2.5 times the height of the load port door.
    Type: Application
    Filed: March 1, 2022
    Publication date: September 8, 2022
    Inventors: Srinivas Poshatrahalli Gopalakrishna, Paul B. Reuter, Devendra Channappa Holeyannavar, Douglas B. Baumgarten, Sushant S. Koshti, Arunkumar Ramachandraiah, Narayanan Ramachandran
  • Publication number: 20220199436
    Abstract: A substrate processing system includes a factory interface having a controlled environment and a transfer chamber. The transfer chamber includes four first facets and three second facets, where each of the three second facets has a width that is narrower than that of each of the four first facets. A first processing chamber is attached to one of the four first facets. A first auxiliary chamber is attached to a first of the three second facets, where the first auxiliary chamber is smaller than the first processing chamber. A load lock is attached to a second of the three second facets and to the factory interface. A robot is attached to a bottom of the transfer chamber, the robot adapted to transfer substrates to and from the first processing chamber, the first auxiliary chamber, and the load lock.
    Type: Application
    Filed: May 11, 2021
    Publication date: June 23, 2022
    Inventors: Nir Merry, Schubert S. Chu, Sushant S. Koshti, Michael C. Kuchar, Nyi Oo Myo, Songjae Lee
  • Patent number: 11282724
    Abstract: A factory interface for an electronic device processing system includes a factory interface chamber, an inert gas supply conduit, an exhaust conduit and an inert gas recirculation system. The inert gas supply conduit supplies an inert gas into the factory interface chamber. The exhaust conduit exhausts the inert gas from the factory interface chamber. The inert gas recirculation system recirculates the inert gas exhausted from the factory interface chamber back into the factory interface chamber.
    Type: Grant
    Filed: August 7, 2019
    Date of Patent: March 22, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Sushant S. Koshti, Dean C. Hruzek, Ayan Majumdar, John C. Menk, Helder T. Lee, Sangram Patil, Sanjay Rajaram, Douglas Baumgarten, Nir Merry
  • Publication number: 20220068677
    Abstract: The disclosure describes devices, systems, and methods for integrating load locks into a factory interface footprint space. A factory interface for an electronic device manufacturing system can include an interior volume defined by a bottom, a top and a plurality of sides, a first load lock disposed within the interior volume of the factory interface, and a first factory interface robot disposed within the interior volume of the factory interface, wherein the first factory interface robot is configured to transfer substrates between a first set of substrate carriers and the first load lock.
    Type: Application
    Filed: August 3, 2021
    Publication date: March 3, 2022
    Inventors: Jacob Newman, Andrew J. Constant, Michael R. Rice, Paul B. Reuter, Shay Assaf, Sushant S. Koshti
  • Publication number: 20210398824
    Abstract: A substrate processing system includes an equipment front end module (EFEM) coupled to a vacuum-based mainframe, the EFEM including multiple interface openings. The system further includes a batch degas chamber attached to the EFEM at an interface opening of the multiple interface openings. The batch degas chamber includes a housing that is sealed to the interface opening of the EFEM. Within the housing is located a cassette configured to hold multiple substrates. A reactor chamber, attached to the housing, is to receive the cassette and perform an active degas process on the multiple substrates. The active degas process removes moisture and contaminants from surfaces of the multiple substrates. An exhaust line is attached to the reactor chamber to provide an exit for the moisture and contaminants.
    Type: Application
    Filed: June 19, 2020
    Publication date: December 23, 2021
    Inventors: Dean C. Hruzek, Nir Merry, Marek Radko, Paul B. Reuter, Steven Sansoni, Sushant S. Koshti, John Joseph Mazzocco, Juan Chacin
  • Patent number: 11087998
    Abstract: A transfer chamber configured to be used during semiconductor device manufacturing is described. Transfer chamber includes at least one first side of a first width configured to couple to one or more substrate transfer units (e.g., one or more load locks or one or more pass-through units), and at least a second set of sides of a second width that is different than the first width, the second set of sides configured to couple to one or more processing chambers. A total number of sides of the transfer chamber is at least seven. Transfers within the transfer chamber are serviceable by a single robot. Process tools and methods for processing substrates are described, as are numerous other aspects.
    Type: Grant
    Filed: March 20, 2019
    Date of Patent: August 10, 2021
    Assignee: Applied Materials, Inc.
    Inventors: Michael Robert Rice, Michael Meyers, John J. Mazzocco, Dean C. Hruzek, Michael Kuchar, Sushant S. Koshti, Penchala N. Kankanala, Eric A. Englhardt
  • Publication number: 20210143034
    Abstract: A substrate processing system includes a factory interface, a transfer chamber, and a robot. The transfer chamber includes four first facets adapted for attachment to one or more first processing chambers and three second facets, wherein each of the three second facets has a width that is narrower than that of each of the four first facets. The system includes a second processing chamber having a first interface attached to a first of the three second facets and a load lock attached to a second of the three second facets and to the factory interface. The system also includes a robot attached to a bottom of the transfer chamber, the robot adapted to transfer substrates to and from the one or more first processing chambers, the second processing chamber, and the load lock.
    Type: Application
    Filed: January 22, 2021
    Publication date: May 13, 2021
    Inventors: Michael Robert Rice, Michael Meyers, John J. Mazzocco, Dean C. Hruzek, Michael Kuchar, Sushant S. Koshti, Penchala N. Kankanala, Eric A. Englhardt
  • Patent number: 10971381
    Abstract: A transfer chamber configured to be used during semiconductor device manufacturing is described. Transfer chamber includes at least one first side of a first width configured to couple to one or more substrate transfer units (e.g., one or more load locks or one or more pass-through units), and at least a second set of sides of a second width that is different than the first width, the second set of sides configured to couple to one or more processing chambers. A total number of sides of the transfer chamber is at least seven. Transfers within the transfer chamber are serviceable by a single robot. Process tools and methods for processing substrates are described, as are numerous other aspects.
    Type: Grant
    Filed: November 3, 2014
    Date of Patent: April 6, 2021
    Assignee: Applied Materials, Inc.
    Inventors: Michael Robert Rice, Michael Meyers, John J. Mazzocco, Dean C. Hruzek, Michael Kuchar, Sushant S. Koshti, Penchala N. Kankanala, Eric A. Englhardt
  • Patent number: 10847391
    Abstract: A transfer chamber for semiconductor device manufacturing includes (1) a plurality of sides that define a region configured to maintain a vacuum level and allow transport of substrates between processing chambers, the plurality of sides defining a first portion and a second portion of the transfer chamber and including (a) a first side that couples to two twinned processing chambers; and (b) a second side that couples to a single processing chamber; (2) a first substrate handler located in the first portion of the transfer chamber; (3) a second substrate handler located in the second portion of the transfer chamber; and (4) a hand-off location configured to allow substrates to be passed between the first portion and the second portion of the transfer chamber using the first and second substrate handlers. Method aspects are also provided.
    Type: Grant
    Filed: February 14, 2014
    Date of Patent: November 24, 2020
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Nir Merry, Michael Robert Rice, Sushant S. Koshti, Jeffrey C. Hudgens
  • Publication number: 20190391602
    Abstract: An electronic device manufacturing system includes a mass flow controller (MFC) that has a thermal flow sensor. The thermal flow sensor may measure a mass flow rate and may include a sensor tube having an inner surface coated with a material to form an inner barrier layer. The inner barrier layer may prevent or substantially reduce the likelihood of a corrosive reaction from occurring on the inner surface, which may prevent or reduce the likelihood of the MFC drifting beyond the MFC's mass flow rate accuracy specifications. This may improve the repeatability of flow detection by the MFC. Methods of measuring and controlling a mass flow rate in an electronic device manufacturing system are also provided, as are other aspects.
    Type: Application
    Filed: September 6, 2019
    Publication date: December 26, 2019
    Inventors: Ming Xu, Sushant S. Koshti, Michael R. Rice, Steven E. Babayan, Jennifer Y. Sun
  • Publication number: 20190362997
    Abstract: A factory interface for an electronic device processing system includes a factory interface chamber, an inert gas supply conduit, an exhaust conduit and an inert gas recirculation system. The inert gas supply conduit supplies an inert gas into the factory interface chamber. The exhaust conduit exhausts the inert gas from the factory interface chamber. The inert gas recirculation system recirculates the inert gas exhausted from the factory interface chamber back into the factory interface chamber.
    Type: Application
    Filed: August 7, 2019
    Publication date: November 28, 2019
    Inventors: Sushant S. Koshti, Dean C. Hruzek, Ayan Majumdar, John C. Menk, Helder T. Lee, Sangram Patil, Sanjay Rajaram, Douglas Baumgarten, Nir Merry
  • Patent number: 10409295
    Abstract: An electronic device manufacturing system includes a mass flow controller (MFC) that has a thermal flow sensor. The thermal flow sensor may measure a mass flow rate and may include a sensor tube having an inner surface coated with a material to form an inner barrier layer. The inner barrier layer may prevent or substantially reduce the likelihood of a corrosive reaction from occurring on the inner surface, which may prevent or reduce the likelihood of the MFC drifting beyond the MFC's mass flow rate accuracy specifications. This may improve the repeatability of flow detection by the MFC. Methods of measuring and controlling a mass flow rate in an electronic device manufacturing system are also provided, as are other aspects.
    Type: Grant
    Filed: December 31, 2016
    Date of Patent: September 10, 2019
    Assignee: Applied Materials, Inc.
    Inventors: Ming Xu, Sushant S. Koshti, Michael R. Rice, Steven E. Babayan, Jennifer Y. Sun
  • Publication number: 20190214284
    Abstract: A transfer chamber configured to be used during semiconductor device manufacturing is described. Transfer chamber includes at least one first side of a first width configured to couple to one or more substrate transfer units (e.g., one or more load locks or one or more pass-through units), and at least a second set of sides of a second width that is different than the first width, the second set of sides configured to couple to one or more processing chambers. A total number of sides of the transfer chamber is at least seven. Transfers within the transfer chamber are serviceable by a single robot. Process tools and methods for processing substrates are described, as are numerous other aspects.
    Type: Application
    Filed: March 20, 2019
    Publication date: July 11, 2019
    Inventors: Michael Robert Rice, Michael Meyers, John J. Mazzocco, Dean C. Hruzek, Michael Kuchar, Sushant S. Koshti, Penchala N. Kankanala, Eric A. Englhardt
  • Patent number: 10199256
    Abstract: In some embodiments, methods and systems are provided for improved handling of lithography masks including loading a mask via a first load port from a first carrier; inverting the mask using a first contact pad; cleaning the mask; inverting the mask using a second contact pad; and unloading the mask via a second load port into a second carrier. Numerous other aspects are provided.
    Type: Grant
    Filed: September 27, 2014
    Date of Patent: February 5, 2019
    Assignee: Applied Materials, Inc.
    Inventors: Edward Ng, Jeffrey C. Hudgens, Ayan Majumdar, Sushant S. Koshti
  • Patent number: 10192765
    Abstract: Electronic device processing systems including environmental control of the factory interface are described. One electronic device processing system has a factory interface having a factory interface chamber, a load lock apparatus coupled to the factory interface, one or more substrate carriers coupled to the factory interface, and an environmental control system coupled to the factory interface and operational to monitor or control one of: relative humidity, temperature, an amount of oxygen, or an amount of inert gas within the factory interface chamber. In another aspect, purge of a carrier purge chamber within the factory interface chamber is provided. Methods for processing substrates are described, as are numerous other aspects.
    Type: Grant
    Filed: August 11, 2014
    Date of Patent: January 29, 2019
    Assignee: Applied Materials, Inc.
    Inventors: Sushant S. Koshti, Dean C. Hruzek, Ayan Majumdar, John C. Menk, Helder T. Lee, Sangram Patil, Sanjay Rajaram, Douglas Baumgarten, Nir Merry
  • Publication number: 20190013216
    Abstract: A transfer chamber for semiconductor device manufacturing includes (1) a plurality of sides that define a region configured to maintain a vacuum level and allow transport of substrates between processing chambers, the plurality of sides defining a first portion and a second portion of the transfer chamber and including (a) a first side that couples to two twinned processing chambers; and (b) a second side that couples to a single processing chamber; (2) a first substrate handler located in the first portion of the transfer chamber; (3) a second substrate handler located in the second portion of the transfer chamber; and (4) a hand-off location configured to allow substrates to be passed between the first portion and the second portion of the transfer chamber using the first and second substrate handlers. Method aspects are also provided.
    Type: Application
    Filed: September 11, 2018
    Publication date: January 10, 2019
    Inventors: Nir Merry, Michael Robert Rice, Sushant S. Koshti, Jeffrey C. Hudgens
  • Publication number: 20180366355
    Abstract: Electronic device processing systems including environmental control of the factory interface are described. One electronic device processing system has a factory interface having a factory interface chamber, a load lock apparatus coupled to the factory interface, one or more substrate carriers coupled to the factory interface, and an environmental control system coupled to the factory interface and operational to monitor or control one of: relative humidity, temperature, an amount of oxygen, or an amount of inert gas within the factory interface chamber. In another aspect, purge of a carrier purge chamber within the factory interface chamber is provided. Methods for processing substrates are described, as are numerous other aspects.
    Type: Application
    Filed: August 24, 2018
    Publication date: December 20, 2018
    Inventors: Sushant S. Koshti, Dean C. Hruzek, Ayan Majumdar, John C. Menk, Helder T. Lee, Sangram Patil, Sanjay Rajaram, Douglas B. Baumgarten, Nir Merry
  • Publication number: 20180188748
    Abstract: An electronic device manufacturing system includes a mass flow controller (MFC) that has a thermal flow sensor. The thermal flow sensor may measure a mass flow rate and may include a sensor tube having an inner surface coated with a material to form an inner barrier layer. The inner barrier layer may prevent or substantially reduce the likelihood of a corrosive reaction from occurring on the inner surface, which may prevent or reduce the likelihood of the MFC drifting beyond the MFC's mass flow rate accuracy specifications. This may improve the repeatability of flow detection by the MFC. Methods of measuring and controlling a mass flow rate in an electronic device manufacturing system are also provided, as are other aspects.
    Type: Application
    Filed: December 31, 2016
    Publication date: July 5, 2018
    Inventors: Ming Xu, Sushant S. Koshti, Michael R. Rice, Steven E. Babayan, Jennifer Y. Sun