Patents by Inventor Susumu Hiyama

Susumu Hiyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Image pickup element, method of manufacturing image pickup element, and electronic apparatus
    Patent number: 11862652
    Abstract: An image pickup element includes: a semiconductor substrate including a photoelectric conversion section for each pixel; a pixel separation groove provided in the semiconductor substrate; and a fixed charge film provided on a light-receiving surface side of the semiconductor substrate, wherein the fixed charge film includes a first insulating film and a second insulating film, the first insulating film being provided contiguously from the light-receiving surface to a wall surface and a bottom surface of the pixel separation groove, and the second insulating film being provided on a part of the first insulating film, the part corresponding to at least the light-receiving surface.
    Type: Grant
    Filed: November 21, 2022
    Date of Patent: January 2, 2024
    Assignee: SONY GROUP CORPORATION
    Inventors: Shuji Manda, Susumu Hiyama, Yasuyuki Shiga
  • IMAGE PICKUP ELEMENT, METHOD OF MANUFACTURING IMAGE PICKUP ELEMENT, AND ELECTRONIC APPARATUS
    Publication number: 20230411424
    Abstract: An image pickup element includes: a semiconductor substrate including a photoelectric conversion section for each pixel; a pixel separation groove provided in the semiconductor substrate; and a fixed charge film provided on a light-receiving surface side of the semiconductor substrate, wherein the fixed charge film includes a first insulating film and a second insulating film, the first insulating film being provided contiguously from the light-receiving surface to a wall surface and a bottom surface of the pixel separation groove, and the second insulating film being provided on a part of the first insulating film, the part corresponding to at least the light-receiving surface.
    Type: Application
    Filed: August 21, 2023
    Publication date: December 21, 2023
    Applicant: Sony Group Corporation
    Inventors: Shuji Manda, Susumu Hiyama, Yasuyuki Shiga
  • Solid-state imaging device, method of manufacturing the same, and electronic equipment
    Patent number: 11676978
    Abstract: A solid state imaging device including a semiconductor layer comprising a plurality of photodiodes, a first antireflection film located over a first surface of the semiconductor layer, a second antireflection film located over the first antireflection film, a light shielding layer having side surfaces which are adjacent to at least one of first and the second antireflection film.
    Type: Grant
    Filed: January 12, 2022
    Date of Patent: June 13, 2023
    Assignee: SONY GROUP CORPORATION
    Inventors: Susumu Hiyama, Kazufumi Watanabe
  • IMAGE PICKUP ELEMENT, METHOD OF MANUFACTURING IMAGE PICKUP ELEMENT, AND ELECTRONIC APPARATUS
    Publication number: 20230081078
    Abstract: An image pickup element includes: a semiconductor substrate including a photoelectric conversion section for each pixel; a pixel separation groove provided in the semiconductor substrate; and a fixed charge film provided on a light-receiving surface side of the semiconductor substrate, wherein the fixed charge film includes a first insulating film and a second insulating film, the first insulating film being provided contiguously from the light-receiving surface to a wall surface and a bottom surface of the pixel separation groove, and the second insulating film being provided on a part of the first insulating film, the part corresponding to at least the light-receiving surface.
    Type: Application
    Filed: November 21, 2022
    Publication date: March 16, 2023
    Applicant: Sony Group Corporation
    Inventors: Shuji Manda, Susumu Hiyama, Yasuyuki Shiga
  • Image pickup element, method of manufacturing image pickup element, and electronic apparatus
    Patent number: 11557623
    Abstract: An image pickup element includes: a semiconductor substrate including a photoelectric conversion section for each pixel; a pixel separation groove provided in the semiconductor substrate; and a fixed charge film provided on a light-receiving surface side of the semiconductor substrate, wherein the fixed charge film includes a first insulating film and a second insulating film, the first insulating film being provided contiguously from the light-receiving surface to a wall surface and a bottom surface of the pixel separation groove, and the second insulating film being provided on a part of the first insulating film, the part corresponding to at least the light-receiving surface.
    Type: Grant
    Filed: January 11, 2021
    Date of Patent: January 17, 2023
    Assignee: SONY CORPORATION
    Inventors: Shuji Manda, Susumu Hiyama, Yasuyuki Shiga
  • SOLID-STATE IMAGING DEVICE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC EQUIPMENT
    Publication number: 20220139973
    Abstract: A solid state imaging device including a semiconductor layer comprising a plurality of photodiodes, a first antireflection film located over a first surface of the semiconductor layer, a second antireflection film located over the first antireflection film, a light shielding layer having side surfaces which are adjacent to at least one of first and the second antireflection film.
    Type: Application
    Filed: January 12, 2022
    Publication date: May 5, 2022
    Applicant: Sony Group Corporation
    Inventors: Susumu Hiyama, Kazufumi Watanabe
  • Solid-state imaging device, method of manufacturing the same, and electronic equipment
    Patent number: 11251212
    Abstract: A solid state imaging device including a semiconductor layer comprising a plurality of photodiodes, a first antireflection film located over a first surface of the semiconductor layer, a second antireflection film located over the first antireflection film, a light shielding layer having side surfaces which are adjacent to at least one of first and the second antireflection film.
    Type: Grant
    Filed: November 19, 2019
    Date of Patent: February 15, 2022
    Assignee: SONY CORPORATION
    Inventors: Susumu Hiyama, Kazufumi Watanabe
  • IMAGE PICKUP ELEMENT, METHOD OF MANUFACTURING IMAGE PICKUP ELEMENT, AND ELECTRONIC APPARATUS
    Publication number: 20210134858
    Abstract: An image pickup element includes: a semiconductor substrate including a photoelectric conversion section for each pixel; a pixel separation groove provided in the semiconductor substrate; and a fixed charge film provided on a light-receiving surface side of the semiconductor substrate, wherein the fixed charge film includes a first insulating film and a second insulating film, the first insulating film being provided contiguously from the light-receiving surface to a wall surface and a bottom surface of the pixel separation groove, and the second insulating film being provided on a part of the first insulating film, the part corresponding to at least the light-receiving surface.
    Type: Application
    Filed: January 11, 2021
    Publication date: May 6, 2021
    Applicant: Sony Corporation
    Inventors: Shuji Manda, Susumu Hiyama, Yasuyuki Shiga
  • Image pickup element, method of manufacturing image pickup element, and electronic apparatus
    Patent number: 10950644
    Abstract: An image pickup element includes: a semiconductor substrate including a photoelectric conversion section for each pixel; a pixel separation groove provided in the semiconductor substrate; and a fixed charge film provided on a light-receiving surface side of the semiconductor substrate, wherein the fixed charge film includes a first insulating film and a second insulating film, the first insulating film being provided contiguously from the light-receiving surface to a wall surface and a bottom surface of the pixel separation groove, and the second insulating film being provided on a part of the first insulating film, the part corresponding to at least the light-receiving surface.
    Type: Grant
    Filed: September 11, 2019
    Date of Patent: March 16, 2021
    Assignee: Sony Corporation
    Inventors: Shuji Manda, Susumu Hiyama, Yasuyuki Shiga
  • Solid state imaging device for reducing dark current
    Patent number: 10770500
    Abstract: A solid state imaging device having a light sensing section that performs photoelectric conversion of incident light includes: an insulating layer formed on a light receiving surface of the light sensing section; a layer having negative electric charges formed on the insulating layer; and a hole accumulation layer formed on the light receiving surface of the light sensing section.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: September 8, 2020
    Assignee: Sony Corporation
    Inventors: Itaru Oshiyama, Takashi Ando, Susumu Hiyama, Tetsuji Yamaguchi, Yuko Ohgishi, Harumi Ikeda
  • SOLID-STATE IMAGING DEVICE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC EQUIPMENT
    Publication number: 20200091206
    Abstract: A solid state imaging device including a semiconductor layer comprising a plurality of photodiodes, a first antireflection film located over a first surface of the semiconductor layer, a second antireflection film located over the first antireflection film, a light shielding layer having side surfaces which are adjacent to at least one of first and the second antireflection film.
    Type: Application
    Filed: November 19, 2019
    Publication date: March 19, 2020
    Applicant: Sony Corporation
    Inventors: Susumu Hiyama, Kazufumi Watanabe
  • Solid-state imaging device, method of manufacturing the same, and electronic equipment
    Patent number: 10529760
    Abstract: A solid state imaging device including a semiconductor layer comprising a plurality of photodiodes, a first antireflection film located over a first surface of the semiconductor layer, a second antireflection film located over the first antireflection film, a light shielding layer having side surfaces which are adjacent to at least one of first and the second antireflection film.
    Type: Grant
    Filed: September 28, 2017
    Date of Patent: January 7, 2020
    Assignee: Sony Cororation
    Inventors: Susumu Hiyama, Kazufumi Watanabe
  • IMAGE PICKUP ELEMENT, METHOD OF MANUFACTURING IMAGE PICKUP ELEMENT, AND ELECTRONIC APPARATUS
    Publication number: 20200006411
    Abstract: An image pickup element includes: a semiconductor substrate including a photoelectric conversion section for each pixel; a pixel separation groove provided in the semiconductor substrate; and a fixed charge film provided on a light-receiving surface side of the semiconductor substrate, wherein the fixed charge film includes a first insulating film and a second insulating film, the first insulating film being provided contiguously from the light-receiving surface to a wall surface and a bottom surface of the pixel separation groove, and the second insulating film being provided on a part of the first insulating film, the part corresponding to at least the light-receiving surface.
    Type: Application
    Filed: September 11, 2019
    Publication date: January 2, 2020
    Applicant: Sony Corporation
    Inventors: Shuji Manda, Susumu Hiyama, Yasuyuki Shiga
  • Image pickup element, method of manufacturing image pickup element, and electronic apparatus
    Patent number: 10461110
    Abstract: An image pickup element includes: a semiconductor substrate including a photoelectric conversion section for each pixel; a pixel separation groove provided in the semiconductor substrate; and a fixed charge film provided on a light-receiving surface side of the semiconductor substrate, wherein the fixed charge film includes a first insulating film and a second insulating film, the first insulating film being provided contiguously from the light-receiving surface to a wall surface and a bottom surface of the pixel separation groove, and the second insulating film being provided on a part of the first insulating film, the part corresponding to at least the light-receiving surface.
    Type: Grant
    Filed: January 8, 2018
    Date of Patent: October 29, 2019
    Assignee: Sony Corporation
    Inventors: Shuji Manda, Susumu Hiyama, Yasuyuki Shiga
  • Solid-state imaging device and method of producing solid-state imaging device
    Patent number: 10361242
    Abstract: A solid-state imaging device includes a sensor including an impurity diffusion layer provided in a surface layer of a semiconductor substrate; and an oxide insulating film containing carbon, the oxide insulating film being provided on the sensor.
    Type: Grant
    Filed: December 8, 2017
    Date of Patent: July 23, 2019
    Assignee: Sony Corporation
    Inventors: Itaru Oshiyama, Yuki Miyanami, Susumu Hiyama, Kazuki Tanaka
  • SOLID STATE IMAGING DEVICE FOR REDUCING DARK CURRENT, METHOD OF MANUFACTURING THE SAME, AND IMAGING APPARATUS
    Publication number: 20190148444
    Abstract: A solid state imaging device having a light sensing section that performs photoelectric conversion of incident light includes: an insulating layer formed on a light receiving surface of the light sensing section; a layer having negative electric charges formed on the insulating layer; and a hole accumulation layer formed on the light receiving surface of the light sensing section.
    Type: Application
    Filed: December 21, 2018
    Publication date: May 16, 2019
    Applicant: Sony Corporation
    Inventors: Itaru Oshiyama, Takashi Ando, Susumu Hiyama, Tetsuji Yamaguchi, Yuko Ohgishi, Harumi Ikeda
  • Solid state imaging device for reducing dark current, method of manufacturing the same, and imaging apparatus
    Patent number: 10192921
    Abstract: A solid state imaging device having a light sensing section that performs photoelectric conversion of incident light includes: an insulating layer formed on a light receiving surface of the light sensing section; a layer having negative electric charges formed on the insulating layer; and a hole accumulation layer formed on the light receiving surface of the light sensing section.
    Type: Grant
    Filed: August 2, 2017
    Date of Patent: January 29, 2019
    Assignee: Sony Corporation
    Inventors: Itaru Oshiyama, Takashi Ando, Susumu Hiyama, Tetsuji Yamaguchi, Yuko Ohgishi, Harumi Ikeda
  • SOLID STATE IMAGING DEVICE FOR REDUCING DARK CURRENT, METHOD OF MANUFACTURING THE SAME, AND IMAGING APPARATUS
    Publication number: 20180204869
    Abstract: A solid state imaging device having a light sensing section that performs photoelectric conversion of incident light includes: an insulating layer formed on a light receiving surface of the light sensing section; a layer having negative electric charges formed on the insulating layer; and a hole accumulation layer formed on the light receiving surface of the light sensing section.
    Type: Application
    Filed: August 2, 2017
    Publication date: July 19, 2018
    Inventors: Itaru Oshiyama, Takashi Ando, Susumu Hiyama, Tetsuji Yamaguchi, Yuko Ohgishi, Harumi Ikeda
  • SOLID-STATE IMAGING DEVICE AND METHOD OF PRODUCING SOLID-STATE IMAGING DEVICE
    Publication number: 20180175099
    Abstract: A solid-state imaging device includes a sensor including an impurity diffusion layer provided in a surface layer of a semiconductor substrate; and an oxide insulating film containing carbon, the oxide insulating film being provided on the sensor.
    Type: Application
    Filed: December 8, 2017
    Publication date: June 21, 2018
    Inventors: Itaru Oshiyama, Yuki Miyanami, Susumu Hiyama, Kazuki Tanaka
  • IMAGE PICKUP ELEMENT, METHOD OF MANUFACTURING IMAGE PICKUP ELEMENT, AND ELECTRONIC APPARATUS
    Publication number: 20180130835
    Abstract: An image pickup element includes: a semiconductor substrate including a photoelectric conversion section for each pixel; a pixel separation groove provided in the semiconductor substrate; and a fixed charge film provided on a light-receiving surface side of the semiconductor substrate, wherein the fixed charge film includes a first insulating film and a second insulating film, the first insulating film being provided contiguously from the light-receiving surface to a wall surface and a bottom surface of the pixel separation groove, and the second insulating film being provided on a part of the first insulating film, the part corresponding to at least the light-receiving surface.
    Type: Application
    Filed: January 8, 2018
    Publication date: May 10, 2018
    Inventors: Shuji Manda, Susumu Hiyama, Yasuyuki Shiga