Patents by Inventor Susumu Inoue

Susumu Inoue has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200295071
    Abstract: There is provided a semiconductor device including: a plurality of bumps on a first semiconductor substrate; and a lens material in a region other than the plurality of bumps on the first semiconductor substrate, wherein a distance between a side of a bump closest to the lens material and a side of the lens material closest to the bump is greater than twice a diameter of the bump closest to the lens material, and wherein the distance between the side of the bump closest to the lens material and the side of the lens material closest to the bump is greater a minimum pitch of the bumps.
    Type: Application
    Filed: June 3, 2020
    Publication date: September 17, 2020
    Applicant: Sony Corporation
    Inventors: Jun OGI, Junichiro FUJIMAGARI, Susumu INOUE, Atsushi FUJIWARA
  • Publication number: 20200279884
    Abstract: To improve detection efficiency in a solid-state imaging element including a SPAD in which an electrode and wiring are placed in a central portion. A solid-state imaging element includes a photodiode and a light collecting section. The photodiode includes a light receiving surface and an electrode placed on the light receiving surface, and that outputs an electrical signal in accordance with light incident on the light receiving surface in a state where a voltage exceeding a breakdown voltage is applied to the electrode. The light collecting section causes light from a subject to be collected in the light receiving surface other than a region where the electrode is placed.
    Type: Application
    Filed: May 15, 2020
    Publication date: September 3, 2020
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Yuhi YORIKADO, Atsushi TODA, Susumu INOUE
  • Patent number: 10714521
    Abstract: To improve detection efficiency in a solid-state imaging element including a SPAD in which an electrode and wiring are placed in a central portion. A solid-state imaging element includes a photodiode and a light collecting section. The photodiode includes a light receiving surface and an electrode placed on the light receiving surface, and that outputs an electrical signal in accordance with light incident on the light receiving surface in a state where a voltage exceeding a breakdown voltage is applied to the electrode. The light collecting section causes light from a subject to be collected in the light receiving surface other than a region where the electrode is placed.
    Type: Grant
    Filed: March 5, 2019
    Date of Patent: July 14, 2020
    Assignee: Sony Semiconductor Solutions Corporation
    Inventors: Yuhi Yorikado, Atsushi Toda, Susumu Inoue
  • Patent number: 10707259
    Abstract: There is provided a semiconductor device including: a plurality of bumps on a first semiconductor substrate; and a lens material in a region other than the plurality of bumps on the first semiconductor substrate, wherein a distance between a side of a bump closest to the lens material and a side of the lens material closest to the bump is greater than twice a diameter of the bump closest to the lens material, and wherein the distance between the side of the bump closest to the lens material and the side of the lens material closest to the bump is greater a minimum pitch of the bumps.
    Type: Grant
    Filed: January 8, 2019
    Date of Patent: July 7, 2020
    Assignee: Sony Corporation
    Inventors: Jun Ogi, Junichiro Fujimagari, Susumu Inoue, Atsushi Fujiwara
  • Patent number: 10577210
    Abstract: A transport device includes a transport section, a processing section, a detector, and a transport controller. The transport section transports a sheet. The processing section performs processing on the sheet. The detector detects a movement of a pointing instrument on a detection surface of the detector itself. The transport controller allows the sheet to be transported by a distance corresponding to the movement of the pointing instrument, and in a direction corresponding to the movement of the pointing instrument.
    Type: Grant
    Filed: July 29, 2016
    Date of Patent: March 3, 2020
    Assignee: Seiko Epson Corporation
    Inventor: Susumu Inoue
  • Patent number: 10475831
    Abstract: The present technology relates to a solid-state image sensing device for preventing a reduction in light receiving sensitivity of an avalanche photodiode, an electronic device, and a method for manufacturing the solid-state image sensing device. A solid-state image sensing device includes an avalanche photodiode having a first region of a first conductive type, a second region of a second conductive type different from the first conductive type, and an avalanche region sandwiched between the first region and the second region, which extend in a thickness direction of a semiconductor substrate, and a film formed on at least one side of the semiconductor substrate and including a metal oxide film, a metal nitride film, or a mix crystal-based film of metal oxide film and metal nitride film. The present technology can be applied to CMOS image sensors, for example.
    Type: Grant
    Filed: September 5, 2016
    Date of Patent: November 12, 2019
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Susumu Inoue, Yuhi Yorikado, Atsushi Toda
  • Publication number: 20190198548
    Abstract: To improve detection efficiency in a solid-state imaging element including a SPAD in which an electrode and wiring are placed in a central portion. A solid-state imaging element includes a photodiode and a light collecting section. The photodiode includes a light receiving surface and an electrode placed on the light receiving surface, and that outputs an electrical signal in accordance with light incident on the light receiving surface in a state where a voltage exceeding a breakdown voltage is applied to the electrode. The light collecting section causes light from a subject to be collected in the light receiving surface other than a region where the electrode is placed.
    Type: Application
    Filed: March 5, 2019
    Publication date: June 27, 2019
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Yuhi YORIKADO, Atsushi TODA, Susumu INOUE
  • Publication number: 20190148445
    Abstract: There is provided a semiconductor device including: a plurality of bumps on a first semiconductor substrate; and a lens material in a region other than the plurality of bumps on the first semiconductor substrate, wherein a distance between a side of a bump closest to the lens material and a side of the lens material closest to the bump is greater than twice a diameter of the bump closest to the lens material, and wherein the distance between the side of the bump closest to the lens material and the side of the lens material closest to the bump is greater a minimum pitch of the bumps.
    Type: Application
    Filed: January 8, 2019
    Publication date: May 16, 2019
    Applicant: SONY CORPORATION
    Inventors: Jun OGI, Junichiro FUJIMAGARI, Susumu INOUE, Atsushi FUJIWARA
  • Patent number: 10283544
    Abstract: To improve detection efficiency in a solid-state imaging element including a SPAD in which an electrode and wiring are placed in a central portion. A solid-state imaging element includes a photodiode and a light collecting section. The photodiode includes a light receiving surface and an electrode placed on the light receiving surface, and that outputs an electrical signal in accordance with light incident on the light receiving surface in a state where a voltage exceeding a breakdown voltage is applied to the electrode. The light collecting section causes light from a subject to be collected in the light receiving surface other than a region where the electrode is placed.
    Type: Grant
    Filed: October 14, 2016
    Date of Patent: May 7, 2019
    Assignee: Sony Semiconductor Solutions Corporation
    Inventors: Yuhi Yorikado, Atsushi Toda, Susumu Inoue
  • Patent number: 10199419
    Abstract: There is provided a semiconductor device including: a plurality of bumps (13) on a first semiconductor substrate (11); and a lens material (57) in a region other than the plurality of bumps on the first semiconductor substrate, wherein a distance between a side of a bump closest to the lens material and a side of the lens material closest to the bump is greater than twice a diameter of the bump closest to the lens material, and wherein the distance between the side of the bump closest to the lens material and the side of the lens material closest to the bump is greater a minimum pitch of the bumps.
    Type: Grant
    Filed: February 22, 2016
    Date of Patent: February 5, 2019
    Assignee: Sony Corporation
    Inventors: Jun Ogi, Junichiro Fujimagari, Susumu Inoue, Atsushi Fujiwara
  • Publication number: 20180211990
    Abstract: To improve detection efficiency in a solid-state imaging element including a SPAD in which an electrode and wiring are placed in a central portion. A solid-state imaging element includes a photodiode and a light collecting section. The photodiode includes a light receiving surface and an electrode placed on the light receiving surface, and that outputs an electrical signal in accordance with light incident on the light receiving surface in a state where a voltage exceeding a breakdown voltage is applied to the electrode. The light collecting section causes light from a subject to be collected in the light receiving surface other than a region where the electrode is placed.
    Type: Application
    Filed: October 14, 2016
    Publication date: July 26, 2018
    Inventors: Yuhi YORIKADO, Atsushi TODA, Susumu INOUE
  • Patent number: 10022621
    Abstract: An elongated member such as a bar includes spaced-apart infrared light illumination ports at opposite ends thereof. Exemplary spacing between the two spaced-apart light ports may be 20 centimeters or more. Each light port comprises an array of plural light sources. The plural light sources in each array may be directionally aimed to as to provide different illumination directions. The plural light sources in each array may emit different colors or frequencies of light. Example applications include targeting or marking capabilities for a video game or other system handheld pointing device.
    Type: Grant
    Filed: June 28, 2017
    Date of Patent: July 17, 2018
    Assignee: Nintendo Co., Ltd.
    Inventors: Kenichiro Ashida, Junji Takamoto, Yoshitomo Goto, Fumiyoshi Suetake, Akio Ikeda, Susumu Inoue, Shin Sugiyama, Kuniaki Ito
  • Publication number: 20180182789
    Abstract: The present technology relates to a solid-state image sensing device for preventing a reduction in light receiving sensitivity of an avalanche photodiode, an electronic device, and a method for manufacturing the solid-state image sensing device. A solid-state image sensing device includes an avalanche photodiode having a first region of a first conductive type, a second region of a second conductive type different from the first conductive type, and an avalanche region sandwiched between the first region and the second region, which extend in a thickness direction of a semiconductor substrate, and a film formed on at least one side of the semiconductor substrate and including a metal oxide film, a metal nitride film, or a mix crystal-based film of metal oxide film and metal nitride film. The present technology can be applied to CMOS image sensors, for example.
    Type: Application
    Filed: September 5, 2016
    Publication date: June 28, 2018
    Inventors: SUSUMU INOUE, YUHI YORIKADO, ATSUSHI TODA
  • Patent number: 9997552
    Abstract: The present technology relates to a solid-state imaging device, an imaging apparatus, an electronic apparatus, and a semiconductor device, which can prevent overflow of an underfilling resin filled in a portion adapted to connect the substrate to the flip chip and can prevent secondary damages such as electric short-circuit and contact with processing equipment. By utilizing a molding technology of forming an on-chip lens, a dam is formed in a ring shape or a square shape in a manner surrounding a range where a flip chip is connected via a solder bump on an upper layer of a substrate of the solid-state imaging device and provided in order to form the on-chip lens. This can block the underfilling resin filled in the range where the substrate and the flip chip are electrically connected. The present technology can be applied to a solid-state imaging device.
    Type: Grant
    Filed: August 28, 2015
    Date of Patent: June 12, 2018
    Assignee: Sony Semiconductor Solutions Corporation
    Inventors: Susumu Inoue, Kentaro Akiyama, Junichiro Fujimagari, Keita Ishikawa, Jun Ogi, Yukio Tagawa, Takuya Nakamura, Satoru Wakiyama
  • Publication number: 20180146114
    Abstract: An electronic apparatus includes a touch sensor that detects a touch position on an original document, and an image data editing section that edits an image on the original document based on the detected touch position.
    Type: Application
    Filed: October 16, 2017
    Publication date: May 24, 2018
    Inventor: Susumu INOUE
  • Publication number: 20180026068
    Abstract: There is provided a semiconductor device including: a plurality of bumps (13) on a first semiconductor substrate (11); and a lens material (57) in a region other than the plurality of bumps on the first semiconductor substrate, wherein a distance between a side of a bump closest to the lens material and a side of the lens material closest to the bump is greater than twice a diameter of the bump closest to the lens material, and wherein the distance between the side of the bump closest to the lens material and the side of the lens material closest to the bump is greater a minimum pitch of the bumps.
    Type: Application
    Filed: February 22, 2016
    Publication date: January 25, 2018
    Inventors: Jun OGI, Junichiro FUJIMAGARI, Susumu INOUE, Atsushi FUJIWARA
  • Publication number: 20170333784
    Abstract: An elongated member such as a bar includes spaced-apart infrared light illumination ports at opposite ends thereof. Exemplary spacing between the two spaced-apart light ports may be 20 centimeters or more. Each light port comprises an array of plural light sources. The plural light sources in each array may be directionally aimed to as to provide different illumination directions. The plural light sources in each array may emit different colors or frequencies of light. Example applications include targeting or marking capabilities for a video game or other system handheld pointing device.
    Type: Application
    Filed: June 28, 2017
    Publication date: November 23, 2017
    Inventors: Kenichiro ASHIDA, Junji TAKAMOTO, Yoshitomo GOTO, Fumiyoshi SUETAKE, Akio IKEDA, Susumu INOUE, Shin SUGIYAMA, Kuniaki ITO
  • Publication number: 20170256577
    Abstract: The present technology relates to a solid-state imaging device, an imaging apparatus, an electronic apparatus, and a semiconductor device, which can prevent overflow of an underfilling resin filled in a portion adapted to connect the substrate to the flip chip and can prevent secondary damages such as electric short-circuit and contact with processing equipment. By utilizing a molding technology of forming an on-chip lens, a dam is formed in a ring shape or a square shape in a manner surrounding a range where a flip chip is connected via a solder bump on an upper layer of a substrate of the solid-state imaging device and provided in order to form the on-chip lens. This can block the underfilling resin filled in the range where the substrate and the flip chip are electrically connected. The present technology can be applied to a solid-state imaging device.
    Type: Application
    Filed: August 28, 2015
    Publication date: September 7, 2017
    Inventors: Susumu INOUE, Kentaro AKIYAMA, Junichiro FUJIMAGARI, Keita ISHIKAWA, Jun OGI, Yukio TAGAWA, Takuya NAKAMURA, Satoru WAKIYAMA
  • Patent number: 9694278
    Abstract: An elongated member such as a bar includes spaced-apart infrared light illumination ports at opposite ends thereof. Exemplary spacing between the two spaced-apart light ports may be 20 centimeters or more. Each light port comprises an array of plural light sources. The plural light sources in each array may be directionally aimed to as to provide different illumination directions. The plural light sources in each array may emit different colors or frequencies of light. Example applications include targeting or marking capabilities for a video game or other system handheld pointing device.
    Type: Grant
    Filed: June 13, 2016
    Date of Patent: July 4, 2017
    Assignee: Nintendo Co., Ltd.
    Inventors: Kenichiro Ashida, Junji Takamoto, Yoshitomo Goto, Fumiyoshi Suetake, Akio Ikeda, Susumu Inoue, Shin Sugiyama, Kuniaki Ito
  • Publication number: 20170050814
    Abstract: A transport device includes a transport section, a processing section, a detector, and a transport controller. The transport section transports a sheet. The processing section performs processing on the sheet. The detector detects a movement of a pointing instrument on a detection surface of the detector itself. The transport controller allows the sheet to be transported by a distance corresponding to the movement of the pointing instrument, and in a direction corresponding to the movement of the pointing instrument.
    Type: Application
    Filed: July 29, 2016
    Publication date: February 23, 2017
    Inventor: Susumu Inoue