Abstract: A hardly soluble beverage product, comprising: a container comprising a main body that contains a content and that has a container mouth as an outlet of the content, and a cap that is mounted on the container mouth to close the main body. An internal volume of the container is set to a total of: a volume corresponding to a volume of the powder material contained in the container; a volume corresponding to an amount of the liquid determined in accordance with an amount of the powder material to be mixed or dissolved with the liquid; and a volume as an extra space to cause turbulence of the powder material and the liquid.

Abstract: A die for extrusion-forming a honeycomb structure which includes: a die base provided with ceramic puddle introducing holes and slits in communication with the ceramic puddle introducing holes; and a substrate layer, which roughly defines the final width of the slits, and a surface layer, which precisely defines the final width of the slits, formed on the die base in this order so that the final width of the slits becomes 15 to 200 ?m, wherein the surface layer is made up of tungsten carbide particles which are 5 ?m or less in average particle diameter and contain W3C as a main ingredient. According to this invention, there is provided a die for extrusion-forming a honeycomb structure which can restrain fluctuation in extrusion-forming speed among its parts and resistance to pushing force, both caused at the time of extrusion-forming, to be very small and is superior in productivity and durability.

Abstract: A circuit board in which end faces (36a) of wires are located in positions withdrawn from the end in a joint region of a first board (31a), end faces (36b) of wires are located in positions withdrawn from the end in a joint region of a second board (31b), a gap (W) between the end faces (36a) of the wires of the first board (31a) and the end faces (36b) of the wires of the second board (31b) is filled with a conductor (16A), and the first board (31a) and the second board (31b) are jointed by means of a resin.

Abstract: In a method for forming bumps 19 on electrodes 32 of a wiring board 31, a fluid 14 containing conductive particles 16 and a gas bubble generating agent is supplied onto a first region 17 including the electrodes 32 on the wiring board 31. Then, a substrate 40 which has a protruding surface 13 having the same area as that of the first region 17 and formed on a main surface 18 of the substrate 40 having a larger area than that of the first region 17 is disposed so that the protruding surface 13 faces the first region 17 of the wiring board 31. Then, the fluid 14 is heated to generate gas bubbles 30 from the gas bubble generating agent contained in the fluid 14.

Abstract: A die for extrusion-forming a honeycomb structure which includes: a die base provided with ceramic puddle introducing holes and slits in communication with the ceramic puddle introducing holes; and a substrate layer, which roughly defines the final width of the slits, and a surface layer, which precisely defines the final width of the slits, formed on the die base in this order so that the final width of the slits becomes 15 to 200 ?m, wherein the surface layer is made up of tungsten carbide particles which are 5 ?m or less in average particle diameter and contain W3C as a main ingredient. According to this invention, there is provided a die for extrusion-forming a honeycomb structure which can restrain fluctuation in extrusion-forming speed among its parts and resistance to pushing force, both caused at the time of extrusion-forming, to be very small and is superior in productivity and durability.

Abstract: A die for extrusion-forming a honeycomb structure which includes: a die base provided with ceramic puddle introducing holes and slits in communication with the ceramic puddle introducing holes; and a substrate layer, which roughly defines the final width of the slits, and a surface layer, which precisely defines the final width of the slits, formed on the die base in this order so that the final width of the slits becomes 15 to 200 ?m, wherein the surface layer is made up of tungsten carbide particles which are 5 ?m or less in average particle diameter and contain W3C as a main ingredient. According to this invention, there is provided a die for extrusion-forming a honeycomb structure which can restrain fluctuation in extrusion-forming speed among its parts and resistance to pushing force, both caused at the time of extrusion-forming, to be very small and is superior in productivity and durability.

Abstract: The antifreeze of the present invention is including propylene glycol, first material, and second material. The first material is normal aliphatic dicarboxylic acid in which number of carbon atoms is from 10 to 12, salt of the normal aliphatic dicarboxylic acid, or mixture thereof. The second material is benzimidazole compound which has a benzimidazole skeleton, salt of the benzimidazole compound, triazine compound which has a triazine skeleton and has a mercapto group, salt of the triazine compound, or mixture thereof. Such antifreeze has less environment load than antifreeze including ethylene glycol. Furthermore, such antifreeze does not cause metal to corrode more than the antifreeze including ethylene glycol.

Abstract: A circuit board in which end faces (36a) of wires are located in positions withdrawn from the end in a joint region of a first board (31a), end faces (36b) of wires are located in positions withdrawn from the end in a joint region of a second board (31b), a gap (W) between the end faces (36a) of the wires of the first board (31a) and the end faces (36b) of the wires of the second board (31b) is filled with a conductor (16A), and the first board (31a) and the second board (31b) are jointed by means of a resin.

Abstract: In a method for forming bumps 19 on electrodes 32 of a wiring board 31, a fluid 14 containing conductive particles 16 and a gas bubble generating agent is supplied onto a first region 17 including the electrodes 32 on the wiring board 31. Then, a substrate 40 which has a protruding surface 13 having the same area as that of the first region 17 and formed on a main surface 18 of the substrate 40 having a larger area than that of the first region 17 is disposed so that the protruding surface 13 faces the first region 17 of the wiring board 31. Then, the fluid 14 is heated to generate gas bubbles 30 from the gas bubble generating agent contained in the fluid 14.

Abstract: A component built-in module of the present invention includes: a first wiring pattern; an electronic component mounted on the first wiring pattern; a second wiring pattern; an electrical insulating sheet with the electrical component built therein, the electrical insulating sheet being disposed between the first wiring pattern and the second wiring pattern; and a via conductor formed in a via hole penetrating through the electrical insulating sheet, the via conductor connecting electrically the first wiring pattern and the second wiring pattern. A side face of the via conductor defines a continuous line in an axis direction of the via conductor. Thus, a component built-in module having excellent reliability concerning electrical connection can be provided.

Abstract: A method of manufacturing a multilayered circuit board includes the steps of: manufacturing a laminated body by laminating a prepreg of a predetermined thickness on at least one surface of a double-sided circuit board having a grounding link and a signal wiring patterned on both surfaces thereof; and applying heat and pressure to the laminated body and completing a layered structure in which the signal wiring is laid inside the prepreg at a boundary between the double-sided circuit board and the prepreg, wherein prepreg sheets of a predetermined thickness are used in a completed layered structure so that a thickness of a prepreg of the double-sided circuit board is smaller than a distance between a surface of the prepreg on a side not opposed to the double-sided circuit board and the signal wiring laid inside the prepreg.

Abstract: There is disclosed a die 1 for forming a honeycomb structure comprises: a plate-like die substrate 2 having at least two surfaces 8, 9, in which back holes 3 for introducing a green material are formed in one surface 8, and slits 4 communicating with back holes 3 are formed in the other surface 9; an underlayer 5 disposed on the substrate 2 so as to coat at least a part of a portion constituting the back hole 3 and the slit 4; an intermediate layer 6 disposed so as to coat at least a part of the underlayer 5 and constituted of tungsten carbide particles whose average particle diameter is 5 ?m or less and containing W3C as a main component; and a surface layer 7 disposed so as to coat at least a part of the intermediate layer 6 and constituted of diamond and/or diamond-like carbon.

Abstract: A component built-in module of the present invention includes: a first wiring pattern; an electronic component mounted on the first wiring pattern; a second wiring pattern; an electrical insulating sheet with the electrical component built therein, the electrical insulating sheet being disposed between the first wiring pattern and the second wiring pattern; and a via conductor formed in a via hole penetrating through the electrical insulating sheet, the via conductor connecting electrically the first wiring pattern and the second wiring pattern. A side face of the via conductor defines a continuous line in an axis direction of the via conductor. Thus, a component built-in module having excellent reliability concerning electrical connection can be provided.

Abstract: There are here disclosed a method for removing a titanium-based film from a honeycomb-molding die having on the surface of a base material coated with the titanium-based film, and a method for removing an oxide of titanium from a honeycomb-molding die having the oxide of titanium adhered/deposited on the surface of a base material. In each method, a removing solution comprising a mixture of an acid and hydrogen peroxide is used. According to the methods for removing the titanium-based film and the oxide of titanium, a large amount of the titanium-based film as well as the oxide of titanium adhered/deposited on the base material of a honeycomb-molding die can be removed by use of a small amount of the removing solution without corroding the base material of honeycomb-molding die while re-deposition of dissolved titanium ions on the base material is prevented.

Abstract: A die for extrusion-forming of ceramic formed bodies having a part coming in contact with extruded ceramic clay with a surface roughness (Ra) of 0.1 ?m or more is disclosed. The die has excellent wear resistance and can remarkably reduce a defective body ratio.

Abstract: There is disclosed a die 1 for forming a honeycomb structure comprises: a plate-like die substrate 2 having at least two surfaces 8, 9, in which back holes 3 for introducing a green material are formed in one surface 8, and slits 4 communicating with back holes 3 are formed in the other surface 9; an underlayer 5 disposed on the substrate 2 so as to coat at least a part of a portion constituting the back hole 3 and the slit 4; an intermediate layer 6 disposed so as to coat at least a part of the underlayer 5 and constituted of tungsten carbide particles whose average particle diameter is 5 ?m or less and containing W3C as a main component; and a surface layer 7 disposed so as to coat at least a part of the intermediate layer 6 and constituted of diamond and/or diamond-like carbon.

Abstract: The antifreeze of the present invention is including propylene glycol, first material, and second material. The first material is normal aliphatic dicarboxylic acid in which number of carbon atoms is from 10 to 12, salt of the normal aliphatic dicarboxylic acid, or mixture thereof. The second material is benzimidazole compound which has a benzimidazole skeleton, salt of the benzimidazole compound, triazine compound which has a triazine skeleton and has a mercapto group, salt of the triazine compound, or mixture thereof. Such antifreeze has less environment load than antifreeze including ethylene glycol. Furthermore, such antifreeze does not cause metal to corrode more than the antifreeze including ethylene glycol.

Abstract: A die for extrusion-forming a honeycomb structure which includes: a die base provided with ceramic puddle introducing holes and slits in communication with the ceramic puddle introducing holes; and a substrate layer, which roughly defines the final width of the slits, and a surface layer, which precisely defines the final width of the slits, formed on the die base in this order so that the final width of the slits becomes 15 to 200 ?m, wherein the surface layer is made up of tungsten carbide particles which are 5 ?m or less in average particle diameter and contain W3C as a main ingredient. According to this invention, there is provided a die for extrusion-forming a honeycomb structure which can restrain fluctuation in extrusion-forming speed among its parts and resistance to pushing force, both caused at the time of extrusion-forming, to be very small and is superior in productivity and durability.

Abstract: There are here disclosed a method for removing a titanium-based film from a honeycomb-molding die having on the surface of a base material coated with the titanium-based film, and a method for removing an oxide of titanium from a honeycomb-molding die having the oxide of titanium adhered/deposited on the surface of a base material. In each method, a removing solution comprising a mixture of an acid and hydrogen peroxide is used. According to the methods for removing the titanium-based film and the oxide of titanium, a large amount of the titanium-based film as well as the oxide of titanium adhered/deposited on the base material of a honeycomb-molding die can be removed by use of a small amount of the removing solution without corroding the base material of honeycomb-molding die while re-deposition of dissolved titanium ions on the base material is prevented.

Abstract: A circuit board is configured so as to include not less than two wiring layers, an insulator layer for electric insulation between the wiring layers, and an inner-via-hole conductive member provided in the insulator layer in a thickness direction of the insulator layer, for electric connection between the wiring layers. The insulator layer is made of a composite material containing an organic resin and a material having a smaller thermal expansion coefficient than that of the organic resin, and includes a surface part, a core part, and a surface part laminated in the stated order, the surface part having a high content of the organic resin, the core part having a low content of the organic resin. The wiring layers have a land portion that is connected with the inner-via-hole conductive member, the land portion being embedded so as to be substantially in contact with the core part, and the inner-via-hole conductive member has a thickness substantially equal to a thickness of the core part.