Abstract: A circuit board is configured so as to include not less than two wiring layers, an insulator layer for electric insulation between the wiring layers, and an inner-via-hole conductive member provided in the insulator layer in a thickness direction of the insulator layer, for electric connection between the wiring layers. The insulator layer is made of a composite material containing an organic resin and a material having a smaller thermal expansion coefficient than that of the organic resin, and includes a surface part, a core part, and a surface part laminated in the stated order, the surface part having a high content of the organic resin, the core part having a low content of the organic resin. The wiring layers have a land portion that is connected with the inner-via-hole conductive member, the land portion being embedded so as to be substantially in contact with the core part, and the inner-via-hole conductive member has a thickness substantially equal to a thickness of the core part.

Abstract: A circuit board is configured so as to include not less than two wiring layers, an insulator layer for electric insulation between the wiring layers, and an inner-via-hole conductive member provided in the insulator layer in a thickness direction of the insulator layer, for electric connection between the wiring layers. The insulator layer is made of a composite material containing an organic resin and a material having a smaller thermal expansion coefficient than that of the organic resin, and includes a surface part, a core part, and a surface part laminated in the stated order, the surface part having a high content of the organic resin, the core part having a low content of the organic resin. The wiring layers have a land portion that is connected with the inner-via-hole conductive member, the land portion being embedded so as to be substantially in contact with the core part, and the inner-via-hole conductive member has a thickness substantially equal to a thickness of the core part.

Abstract: A circuit board is configured so as to include not less than two wiring layers, an insulator layer for electric insulation between the wiring layers, and an inner-via-hole conductive member provided in the insulator layer in a thickness direction of the insulator layer, for electric connection between the wiring layers. The insulator layer is made of a composite material containing an organic resin and a material having a smaller thermal expansion coefficient than that of the organic resin, and includes a surface part, a core part, and a surface part laminated in the stated order, the surface part having a high content of the organic resin, the core part having a low content of the organic resin. The wiring layers have a land portion that is connected with the inner-via-hole conductive member, the land portion being embedded so as to be substantially in contact with the core part, and the inner-via-hole conductive member has a thickness substantially equal to a thickness of the core part.

Abstract: A liquid crystal material filling apparatus which includes, in a vacuum chamber, a liquid crystal pot having a liquid crystal reservoir for storing a liquid crystal material. A groove part is coupled with the liquid crystal reservoir at a certain angle and contains a medium for holding the liquid crystal material. A filling jig cassette is provided to accommodate a plurality of liquid crystal panels having injection ports faced downwardly, and an elevation device is provided for moving the liquid crystal pot up and down. Also, a posture control mechanism is provided for switching a posture of the liquid crystal pot in accordance with the up/down movement of the liquid crystal pot thereby to cause the liquid crystal material to flow from the liquid crystal reservoir to the groove part at a raised position and bring the medium in touch with lower faces of the injection ports of the liquid crystal panels.

Abstract: A liquid crystal material filling apparatus which includes, in a vacuum chamber, a liquid crystal pot having a liquid crystal reservoir for storing a liquid crystal material. A groove part is coupled with the liquid crystal reservoir at a certain angle and contains a medium for holding the liquid crystal material. A filling jig cassette is provided to accommodate a plurality of liquid crystal panels having injection ports faced downwardly, and an elevation device is provided for moving the liquid crystal pot up and down. Also, a posture control mechanism is provided for switching a posture of the liquid crystal pot in accordance with the up/down movement of the liquid crystal pot thereby to cause the liquid crystal material to flow from the liquid crystal reservoir to the groove part at a raised position and bring the medium in touch with lower faces of the injection ports of the liquid crystal panels.

Abstract: A power semiconductor device such as power thyristor including a semiconductor substrate which is clamped by first and second conductive members serving as the electrodes as well as heat sinks, and a plurality of heat pipes whose ends are inserted directly into the conductive members. A plurality of semiconductor substrates and temperature compensating plates are alternatively stacked on another and conductive members are provided on outermost temperature compensating plates to form an assembly. The assembly is hermetically sealed by an insulating package formed by an insulator having a corrugated outer surface such that outer surfaces of the conductive members are exposed out of the package. One or more heat pipes are inserted into the insulating package such that electrically insulating cooling medium filled in the heat pipes can be in direct contact with the semiconductor substrates. The heat pipes may be inserted into the conductive members or heat sinks provided in the assembly.

Abstract: An apparatus for controlling friction between the leaf springs of a laminated leaf spring assembly comprises a clamp. The clamp includes a spring supporting member and a pressure member which clamp the laminated leaf spring assembly therebetween. The apparatus further comprises a hydraulic cylinder for pressing the pressure member to urge the laminated leaf spring assembly against the spring supporting member. The pressure of a pressurized fluid supplied to the hydraulic cylinder is controlled by a control valve of a hydraulic control member. The operating pressure of the control valve is controlled by detecting values of predetermined factors of a body to be supported by a detector and supplying predetermined signals to the control valve in accordance with the detected values.