Patents by Inventor Susumu Moriya
Susumu Moriya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8497156Abstract: A semiconductor device includes a wiring board, a semiconductor element mounted on the wiring board, a sealing resin configured to cover the semiconductor element, a ground electrode having an end connected to a wiring layer of the wiring board and an exposing part exposed at a surface of the sealing resin, and a shielding member configured to cover the sealing resin and be connected to the ground electrode.Type: GrantFiled: August 5, 2011Date of Patent: July 30, 2013Assignee: Fujitsu Semiconductor LimitedInventor: Susumu Moriya
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Patent number: 8411197Abstract: An image pickup device is disclosed that has little deformation caused by thermal expansion of a transparent resin for sealing an image pickup element. The image pickup device includes an image pickup element having a light receiving surface, a micro-lens for condensing incident light to the image pickup element, a first transparent plate disposed on the light receiving surface of the image pickup element with the micro-lens in between, a transparent resin that seals the image pickup element and the first transparent plate, and a second transparent plate disposed on the transparent resin to face the first transparent plate.Type: GrantFiled: October 20, 2004Date of Patent: April 2, 2013Assignee: Fujitsu Semiconductor LimitedInventors: Naoyuki Watanabe, Toshiyuki Honda, Yoshito Akutagawa, Susumu Moriya, Izumi Kobayashi
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Patent number: 8194162Abstract: An imaging device includes an image sensing device provided on a semiconductor substrate; a transparent member provided on a light-receiving area of the image sensing device; and a circuit element provided on the transparent member, wherein the image sensing device and the circuit element are electrically coupled to each other.Type: GrantFiled: March 10, 2010Date of Patent: June 5, 2012Assignee: Fujitsu Semiconductor LimitedInventors: Susumu Moriya, Izumi Kobayashi, Takao Ohno
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Publication number: 20110294261Abstract: A semiconductor device includes a wiring board, a semiconductor element mounted on the wiring board, a sealing resin configured to cover the semiconductor element, a ground electrode having an end connected to a wiring layer of the wiring board and an exposing part exposed at a surface of the sealing resin, and a shielding member configured to cover the sealing resin and be connected to the ground electrode.Type: ApplicationFiled: August 5, 2011Publication date: December 1, 2011Applicant: FUJITSU SEMICONDUCTOR LIMITEDInventor: Susumu Moriya
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Patent number: 8018033Abstract: A semiconductor device includes a wiring board, a semiconductor element mounted on the wiring board, a sealing resin configured to cover the semiconductor element, a ground electrode having an end connected to a wiring layer of the wiring board and an exposing part exposed at a surface of the sealing resin, and a shielding member configured to cover the sealing resin and be connected to the ground electrode.Type: GrantFiled: June 8, 2009Date of Patent: September 13, 2011Assignee: Fujitsu Semiconductor LimitedInventor: Susumu Moriya
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Patent number: 7998779Abstract: A solid-state imaging device includes: a solid-state imaging element having a light-receiving area; a transparent member disposed so as to oppose the light-receiving area; a supporting member configured to support the transparent member; a first mark disposed at either an upper surface of the transparent member or an upper surface of the supporting member; and a second mark disposed at an outer side of the light-receiving area, at an upper surface of the solid-state imaging element.Type: GrantFiled: March 10, 2009Date of Patent: August 16, 2011Assignee: Fujitsu Semiconductor LimitedInventors: Naoyuki Watanabe, Takao Ohno, Susumu Moriya, Izumi Kobayashi
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Patent number: 7955044Abstract: A method for processing substrates for a substrate processing facility includes the steps of: performing ventilation of a container with a fan filter unit while a lid of the container is in a closed state, when the container is stored in a storage shelf, and when the container is transferred with a substrate transfer device, and ventilating the container with the fan filter with the lid of the container in an open state, when substrates are transferred in a substrate loading/unloading section with the substrate transfer device.Type: GrantFiled: September 12, 2007Date of Patent: June 7, 2011Assignee: Daifuku Co., Ltd.Inventors: Susumu Moriya, Yoshiteru Ikehata
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Patent number: 7923303Abstract: A method of resin sealing an electronic part, includes the steps of: providing a board where one or more of the electronic parts are mounted in an upper mold; melting a resin material received in a cavity forming part of a lower mold; and dipping the electronic part held by the upper mold into the molten resin so that the resin sealing is achieved. The resin material is received in the cavity forming part of the lower mold after the resin material is pressurized and dispersed in a sealing resin supply apparatus.Type: GrantFiled: November 11, 2009Date of Patent: April 12, 2011Assignee: Fujitsu Semiconductor LimitedInventors: Yoshito Akutagawa, Izumi Kobayashi, Naoyuki Watanabe, Susumu Moriya, Toshiyuki Honda, Noboru Hayasaka
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Publication number: 20100231766Abstract: An imaging device includes an image sensing device provided on a semiconductor substrate; a transparent member provided on a light-receiving area of the image sensing device; and a circuit element provided on the transparent member, wherein the image sensing device and the circuit element are electrically coupled to each other.Type: ApplicationFiled: March 10, 2010Publication date: September 16, 2010Applicant: FUJITSU MICROELECTRONICS LIMITEDInventors: Susumu Moriya, Izumi Kobayashi, Takao Ohno
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Publication number: 20100052212Abstract: A method of resin sealing an electronic part, includes the steps of: providing a board where one or more of the electronic parts are mounted in an upper mold; melting a resin material received in a cavity forming part of a lower mold; and dipping the electronic part held by the upper mold into the molten resin so that the resin sealing is achieved. The resin material is received in the cavity forming part of the lower mold after the resin material is pressurized and dispersed in a sealing resin supply apparatus.Type: ApplicationFiled: November 11, 2009Publication date: March 4, 2010Applicant: FUJITSU MICROELECTRONICS LIMITEDInventors: Yoshito AKUTAGAWA, Izumi Kobayashi, Naoyuki Watanabe, Susumu Moriya, Toshiyuki Honda, Noboru Hayasaka
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Patent number: 7659937Abstract: A camera module includes a module structure constituted by a lens unit to which an image pickup lens is attached and a package to which an imaging element is attached so as to be opposite to the image pickup lens. An optical filter is arranged between the imaging element and the image pickup lens. A portion of a flat surface of the optical filter is fixed to a filter fixing portion via an adhesive. The optical filter is adhered to the filter fixing portion in a state in which an end portion formed by a side surface of the optical filter and the flat surface is in noncontact with the filter fixing portion or the adhesive. Minute particles generated from a cut surface of the optical filter fall outside the filter fixing portion.Type: GrantFiled: March 29, 2006Date of Patent: February 9, 2010Assignee: Fujitsu Microelectronics LimitedInventors: Masanori Onodera, Susumu Moriya, Izumi Kobayashi, Hiroshi Aoki, Koji Sawahata, Shigeo Iriguchi, Toshiyuki Honda, Katsuro Hiraiwa
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Patent number: 7638367Abstract: A method of resin sealing an electronic part, includes the steps of: providing a board where one or more of the electronic parts are mounted in an upper mold; melting a resin material received in a cavity forming part of a lower mold; and dipping the electronic part held by the upper mold into the molten resin so that the resin sealing is achieved. The resin material is received in the cavity forming part of the lower mold after the resin material is pressurized and dispersed in a sealing resin supply apparatus.Type: GrantFiled: July 11, 2006Date of Patent: December 29, 2009Assignee: Fujitsu Microelectronics LimitedInventors: Yoshito Akutagawa, Izumi Kobayashi, Naoyuki Watanabe, Susumu Moriya, Toshiyuki Honda, Noboru Hayasaka
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Patent number: 7616250Abstract: An image capturing device is disclosed that includes a light receiving element having a light receiving surface, a plate-like transparent member provided on the light receiving surface of the light receiving element, and resin provided to at least the periphery of the plate-like transparent member. The plate-like transparent member includes a first principal plane positioned on the light receiving element side and a second principal plane opposite the first principal plane. The first principal plane is greater in area than the second principal plane.Type: GrantFiled: November 23, 2004Date of Patent: November 10, 2009Assignee: Fujitsu Microelectronics LimitedInventors: Naoyuki Watanabe, Toshiyuki Honda, Yoshito Akutagawa, Susumu Moriya, Izumi Kobayashi
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Publication number: 20090236700Abstract: A semiconductor device includes a wiring board, a semiconductor element mounted on the wiring board, a sealing resin configured to cover the semiconductor element, a ground electrode having an end connected to a wiring layer of the wiring board and an exposing part exposed at a surface of the sealing resin, and a shielding member configured to cover the sealing resin and be connected to the ground electrode.Type: ApplicationFiled: June 8, 2009Publication date: September 24, 2009Applicant: FUJITSU MICROELECTRONICS LIMITEDInventor: Susumu MORIYA
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Publication number: 20090230493Abstract: A solid-state imaging device includes: a solid-state imaging element having a light-receiving area; a transparent member disposed so as to oppose the light-receiving area; a supporting member configured to support the transparent member; a first mark disposed at either an upper surface of the transparent member or an upper surface of the supporting member; and a second mark disposed at an outer side of the light-receiving area, at an upper surface of the solid-state imaging element.Type: ApplicationFiled: March 10, 2009Publication date: September 17, 2009Applicant: FUJITSU MICROELECTRONICS LIMITEDInventors: Naoyuki WATANABE, Takao OHNO, Susumu MORIYA, Izumi KOBAYASHI
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Patent number: 7564111Abstract: In an imaging apparatus constituted of a case body for mounting an imaging device and a flexible substrate bonding to an external connection terminal provided on the case body, the flexible substrate is bent along each face of case body 41 so as to surround case body 41. By bending the flexible substrate, a load applied to the flexible substrate is received at the bent portion of the flexible substrate, there is formed a structure hard to transmit the load to the bonding portion to the external connection terminal. Further, by fixing the case body to a portion of the flexible substrate with an adhesive agent, etc., there is formed a structure not to transmit a stress to the direction of peeling the flexible substrate from the external connection terminal. Also, the case body is covered with the flexible substrate equipped with an electromagnetic wave shield material.Type: GrantFiled: January 25, 2007Date of Patent: July 21, 2009Assignee: Fujitsu Microelectronics LimitedInventors: Koji Sawahata, Susumu Moriya, Hiroshi Aoki, Izumi Kobayashi, Toshiyuki Honda, Shigeo Iriguchi, Masashi Takenaka
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Patent number: 7364028Abstract: Glass substrates are transported to a plurality of processing devices to be processed. Certain of the processing devices have associated storage shelf for storing glass substrates and a transfer device. The transfer device is adapted to move the glass substrate between the processing device and the storage shelf and between the storage shelf and the transporting device.Type: GrantFiled: November 15, 2004Date of Patent: April 29, 2008Assignee: Daifuku Co., Ltd.Inventors: Susumu Moriya, Katsuhiko Ueda
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Publication number: 20080089765Abstract: The method for processing substrates for substrate processing facility includes the steps of performing ventilation a the fan filter unit while putting a lid of a container in a closed state, when the container is stored in a storage shelf, and is transferred with a substrate transfer device, and ventilating the container with the fan filter with the lid of the container in an open state, when substrates are transferred in a substrate loading/unloading section with the substrate transfer device.Type: ApplicationFiled: September 12, 2007Publication date: April 17, 2008Applicant: DAIFUKU CO., LTD.Inventors: Susumu Moriya, Yoshiteru Ikehata
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Patent number: 7329299Abstract: It is an object of the present invention to provide a plate-shaped work piece transporting apparatus that has a fan, a dust-removal filter disposed above this fan, and a plate-shape porous member disposed above the dust-removal filter. By forming a chamber in which air can accumulate between the porous member and the dust-removal filter, it is possible to suppress air pulsations. Further, by providing support members on the porous member, the plate-shaped work piece can be supported and damage thereto can be avoided when the plate-shaped work piece, which is supported by air from the fan, drops to below a set height.Type: GrantFiled: July 6, 2004Date of Patent: February 12, 2008Assignee: Daifuku Co., Ltd.Inventors: Susumu Moriya, Shigeto Murayama, Yuichi Morimoto, Yoshiteru Ikehata, Takayoshi Ono
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Patent number: 7282693Abstract: In a camera module of a so-called multi-chip type, an imaging device and a semiconductor element for processing are mounted. The semiconductor element is encapsulated by a mold resin. Protruding parts are formed by the mold resin on a mounting surface of the mold resin. A metal film forming a pattern wiring is formed on the mounting surface of the mold resin. The metal film is also formed on the protruding parts so as to constitute external connection terminals together with the protruding parts. Electrodes of the semiconductor element are electrically connected to the pattern wiring. The protruding parts include first protruding parts positioned around the semiconductor element and second protruding parts formed in a mounting area of the semiconductor element on the mounting surface.Type: GrantFiled: February 26, 2007Date of Patent: October 16, 2007Assignee: Fujitsu LimitedInventors: Masanori Onodera, Susumu Moriya, Izumi Kobayashi, Hiroshi Aoki, Toshiyuki Honda