Abstract: A semiconductor device includes a semiconductor element having an upper surface where an imaging area is formed; a transparent member separated from the semiconductor element by a designated distance and facing the semiconductor element; and a sealing member configured to seal an edge part of the semiconductor element and an edge surface of the transparent member; wherein a groove forming part is formed in the transparent member, the groove forming part being situated at an edge surface side of the transparent member outside of an external edge of the imaging area of the semiconductor element.

Abstract: A method of resin sealing an electronic part, includes the steps of: providing a board where one or more of the electronic parts are mounted in an upper mold; melting a resin material received in a cavity forming part of a lower mold; and dipping the electronic part held by the upper mold into the molten resin so that the resin sealing is achieved. The resin material is received in the cavity forming part of the lower mold after the resin material is pressurized and dispersed in a sealing resin supply apparatus.

Abstract: In a camera module of a so-called multi-chip type, an imaging device and a semiconductor element for processing are mounted. The semiconductor element is encapsulated by a mold resin. Protruding parts are formed by the mold resin on a mounting surface of the mold resin. A metal film forming a pattern wiring is formed on the mounting surface of the mold resin. The metal film is also formed on the protruding parts so as to constitute external connection terminals together with the protruding parts. Electrodes of the semiconductor element are electrically connected to the pattern wiring. The protruding parts include first protruding parts positioned around the semiconductor element and second protruding parts formed in a mounting area of the semiconductor element on the mounting surface.

Abstract: In an imaging apparatus constituted of a case body for mounting an imaging device and a flexible substrate bonding to an external connection terminal provided on the case body, the flexible substrate is bent along each face of case body 41 so as to surround case body 41. By bending the flexible substrate, a load applied to the flexible substrate is received at the bent portion of the flexible substrate, there is formed a structure hard to transmit the load to the bonding portion to the external connection terminal. Further, by fixing the case body to a portion of the flexible substrate with an adhesive agent, etc., there is formed a structure not to transmit a stress to the direction of peeling the flexible substrate from the external connection terminal. Also, the case body is covered with the flexible substrate equipped with an electromagnetic wave shield material.

Abstract: In a camera module of a so-called multi-chip type, an imaging device and a semiconductor element for processing are mounted. The semiconductor element is encapsulated by a mold resin. Protruding parts are formed by the mold resin on a mounting surface of the mold resin. A metal film forming a pattern wiring is formed on the mounting surface of the mold resin. The metal film is also formed on the protruding parts so as to constitute external connection terminals together with the protruding parts. Electrodes of the semiconductor element are electrically connected to the pattern wiring. The protruding parts include first protruding parts positioned around the semiconductor element and second protruding parts formed in a mounting area of the semiconductor element on the mounting surface.

Abstract: An integrated circuit contactor includes a base of an insulating material, the base being elastically deformable. A plurality of pads of a first conductive material are bonded to the base at positions corresponding to positions of terminals on an integrated circuit. A plurality of contacts of a second conductive material are bonded to the plurality of pads, respectively, the terminals of the integrated circuit being electrically connected to the contacts only when a pressure is exerted onto the contacts by the terminals of the integrated circuit, each contact having a projecting edge with a roughness produced by pulling a wire of the second conductive material apart from a corresponding one of the plurality of pads after the wire is bonded to the corresponding pad.

Abstract: A camera module includes a module structure constituted by a lens unit to which an image pickup lens is attached and a package to which an imaging element is attached so as to be opposite to the image pickup lens. An optical filter is arranged between the imaging element and the image pickup lens. A portion of a flat surface of the optical filter is fixed to a filter fixing portion via an adhesive. The optical filter is adhered to the filter fixing portion in a state in which an end portion formed by a side surface of the optical filter and the flat surface is in noncontact with the filter fixing portion or the adhesive. Minute particles generated from a cut surface of the optical filter fall outside the filer fixing portion.

Abstract: A cassette storage equipment. The cassette storage equipment comprises a cassette storage spatially storing a cassette receiving a plurality of substrates in multiple levels, a transporting unit moving along the cassette storage, comprising a elevating structure and a cassette moving device disposed thereon, and a substrate transporting device transporting the substrate piece by piece to the processing device from the transporting unit. A substrate detecting device is disposed on the elevating structure to obtain a mapping data from the substrates transported form the cassette storage to a cassette on the elevating structure.

Abstract: It is an object to provide a plate-shaped work piece transporting apparatus provided with a blowing mechanism for contactlessly supporting a plate-shaped work piece that is transported, where the blowing mechanism is provided with a dust-removal filter and a blowing mechanism for sending air to the lower surface of the plate-shaped work piece via the dust-removal filter. In a first embodiment, a driving mechanism for contacting the plate-shaped work piece and moving it in the transporting direction is provided.

Abstract: An image capturing device is disclosed that includes a light receiving element having a light receiving surface, a plate-like transparent member provided on the light receiving surface of the light receiving element, and resin provided to at least the periphery of the plate-like transparent member. The plate-like transparent member includes a first principal plane positioned on the light receiving element side and a second principal plane opposite the first principal plane. The first principal plane is greater in area than the second principal plane.

Abstract: An image pickup device is disclosed that has little deformation caused by thermal expansion of a transparent resin for sealing an image pickup element. The image pickup device includes an image pickup element having a light receiving surface, a micro-lens for condensing incident light to the image pickup element, a first transparent plate disposed on the light receiving surface of the image pickup element with the micro-lens in between, a transparent resin that seals the image pickup element and the first transparent plate, and a second transparent plate disposed on the transparent resin to face the first transparent plate.

Abstract: Glass substrates are transported to a plurality of processing devices to be processed. Certain of the processing devices have associated storage shelf for storing glass substrates and a transfer device. The transfer device is adapted to move the glass substrate between the processing device and the storage shelf and between the storage shelf and the transporting device.

Abstract: In a camera module of a so-called multi-chip type, an imaging device and a semiconductor element for processing are mounted. The semiconductor element is encapsulated by a mold resin. Protruding parts are formed by the mold resin on a mounting surface of the mold resin. A metal film forming a pattern wiring is formed on the mounting surface of the mold resin. The metal film is also formed on the protruding parts so as to constitute external connection terminals together with the protruding parts. Electrodes of the semiconductor element are electrically connected to the pattern wiring. The protruding parts include first protruding parts positioned around the semiconductor element and second protruding parts formed in a mounting area of the semiconductor element on the mounting surface.

Abstract: It is an object of the present invention to provide a plate-shaped work piece transporting apparatus that has a fan, a dust-removal filter disposed above this fan, and a plate-shape porous member disposed above the dust-removal filter. By forming a chamber in which air can accumulate between the porous member and the dust-removal filter, it is possible to suppress air pulsations. Further, by providing support members on the porous member, the plate-shaped work piece can be supported and damage thereto can be avoided when the plate-shaped work piece, which is supported by air from the fan, drops to below a set height.

Abstract: It is an object to provide a plate-shaped work piece transporting apparatus provided with a blowing mechanism for contactlessly supporting a plate-shaped work piece that is transported, where the blowing mechanism is provided with a dust-removal filter and a blowing mechanism for sending air to the lower surface of the plate-shaped work piece via the dust-removal filter. In a first embodiment, a driving mechanism for contacting the plate-shaped work piece and moving it in the transporting direction is provided.

Abstract: A semiconductor device includes a resin housing provided with a functional part, a wire pattern made of a conductive material and molded in the resin housing, a part of the wire pattern being exposed from the resin housing, an electronic part connected with the wire pattern in a state where the electronic parts is molded in the resin housing, and a semiconductor element connected to the part of the wire pattern being exposed from the resin housing. The semiconductor element provides a designated function in cooperation with a functional part of the resin housing.

Abstract: An integrated circuit contactor includes a base of an insulating material, the base being elastically deformable. A plurality of pads of a first conductive material are bonded to the base at positions corresponding to positions of terminals on an integrated circuit. A plurality of contacts of a second conductive material are bonded to the plurality of pads, respectively, the terminals of the integrated circuit being electrically connected to the contacts only when a pressure is exerted onto the contacts by the terminals of the integrated circuit, each contact having a projecting edge with a roughness produced by pulling a wire of the second conductive material apart from a corresponding one of the plurality of pads after the wire is bonded to the corresponding pad.

Abstract: An integrated circuit contactor includes a base of an insulating material, the base being elastically deformable. A plurality of pads of a first conductive material are bonded to the base at positions corresponding to positions of terminals on an integrated circuit. A plurality of contacts of a second conductive material are bonded to the plurality of pads, respectively, the terminals of the integrated circuit being electrically connected to the contacts only when a pressure is exerted onto the contacts by the terminals of the integrated circuit, each contact having a projecting edge with a roughness produced by pulling a wire of the second conductive material apart from a corresponding one of the plurality of pads after the wire is bonded to the corresponding pad.

Abstract: A semiconductor device includes a resin housing provided with a functional part, a wire pattern made of a conductive material and molded in the resin housing, a part of the wire pattern being exposed from the resin housing, an electronic part connected with the wire pattern in a state where the electronic parts is molded in the resin housing, and a semiconductor element connected to the part of the wire pattern being exposed from the resin housing. The semiconductor element provides a designated function in cooperation with a functional part of the resin housing.

Abstract: A semiconductor device includes a resin housing provided with a functional part, a wire pattern made of a conductive material and molded in the resin housing, a part of the wire pattern being exposed from the resin housing, an electronic part connected with the wire pattern in a state where the electronic parts is molded in the resin housing, and a semiconductor element connected to the part of the wire pattern being exposed from the resin housing. The semiconductor element provides a designated function in cooperation with a functional part of the resin housing.