Abstract: Provided is a neuromorphic system for synaptic learning in a spiking neural network (SNN)-based neuromorphic array structure. Control blocks including a post-synaptic neuron, which generates a post-neuron spike, are disposed on output lines of a synapse array to implement a spike timing dependent plasticity (STDP) operation such that synaptic learning can be stably implemented in an SNN neuromorphic array. Also, a lateral inhibition circuit may be added. When a post-neuron spike is generated by an STDP control block connected to any one output line, the lateral inhibition circuit inhibits STDP control blocks connected to other output lines from generating spikes. Accordingly, learning selectivity can be improved, and thus the performance of an STDP algorithm can be improved.

Abstract: Provided are an autonomous driving system and a correction learning method for autonomous driving. The autonomous driving system includes a sensor configured to collect and output data required for autonomous driving, a first processor configured to output autonomous driving data on the basis of data input from the sensor, a second processor configured to output a driving data adjustment value on the basis of differences between the data input from the sensor, the autonomous driving data input from the first processor, and driving data input from driving by a human driver, and a driving part configured to perform driving on the basis of the autonomous driving data output from the first processor and the driving data adjustment value output from the second processor.

Abstract: A neuromorphic device includes: a neuron block unit including a plurality of neurons; a synapse block unit including a plurality of synapses; and a topology block unit including a plurality of parallel Look-Up Table (LUT) modules including pre and post neuron elements configured with addresses of a presynaptic neuron and a postsynaptic neuron. Each of the plurality of neurons has an intrinsic address, each of the plurality of synapses has an intrinsic address. The parallel LUT module is partitioned based on a first synapse address among synapse addresses, and each of the partitions is indexed based on a second synapse address among the synapse addresses.

Abstract: Provided is a method of operating a neuron in a neuromorphic system. The method includes evaluating a membrane potential value at a corresponding time when receiving an input spike, time-modulating a synaptic weight of the membrane potential value and converting the time-modulated synaptic weight into a membrane potential value at a reference time, and generating an output spike when the membrane potential value at the reference time exceeds a certain threshold value. The membrane potential value at the reference time is represented by a floating point number including a predetermined bit of exponent and mantissa, and the floating point number includes time information. The method further includes accessing a memory and scanning a neural state variable when a timer is updated to “0” to update the neural state variable to an updated value at a reference time.

Abstract: The present invention relates to a non-invasive health indicator monitoring system including a sensing module, an electric power storage module, and a circuit module to collect health indicator information by contacting with a subject. In addition, the present invention also relates to a method for monitoring health indicator continuously by using the health indicator monitoring system.

Abstract: A color image sensor is disclosed. In one aspect, the color image sensor includes: a photo-sensitive cell having a lower electrode, an upper electrode, and a chalcogenide material located between the lower electrode and the upper electrode; and an image sensing circuit for measuring the wavelength or intensity of incident light based on an electric characteristic value generated from the photo-sensitive cell.

Abstract: The present invention relates to a non-invasive health indicator monitoring system including a sensing module, an electric power storage module, and a circuit module to collect health indicator information by contacting with a subject. In addition, the present invention also relates to a method for monitoring health indicator continuously by using the health indicator monitoring system.

Abstract: A color image sensor is disclosed. In one aspect, the color image sensor includes: a photo-sensitive cell having a lower electrode, an upper electrode, and a chalcogenide material located between the lower electrode and the upper electrode; and an image sensing circuit for measuring the wavelength or intensity of incident light based on an electric characteristic value generated from the photo-sensitive cell.

Abstract: A phase-change memory device has an oxidation barrier layer to protect against memory cell contamination or oxidation. In one embodiment, a semiconductor memory device includes a molding layer disposed over semiconductor substrate, a phase-changeable material pattern, and an oxidation barrier of electrically insulative material. The molding layer has a protrusion at its upper portion. One portion of the phase-changeable material pattern overlies the protrusion of the molding layer, and another portion of the phase-changeable material pattern extends through the protrusion. The electrically insulative material of the oxidation barrier may cover the phase-changeable material pattern and/or extend along and cover the entire area at which the protrusion of the molding layer and the portion of the phase-change material pattern disposed on the protrusion adjoin.

Abstract: A phase change memory device includes a mold layer disposed on a substrate, a heating electrode, a filling insulation pattern and a phase change material pattern. The heating electrode is disposed in an opening exposing the substrate through the mold layer. The heating electrode is formed in a substantially cylindrical shape, having its sidewalls conformally disposed on the lower inner walls of the opening. The filling insulation pattern fills an empty region surrounded by the sidewalls of the heating electrode. The phase change material pattern is disposed on the mold layer and downwardly extended to fill the empty part of the opening. The phase change material pattern contacts the top surfaces of the sidewalls of the heating electrode.

Abstract: In one embodiment, a phase-change memory device has an oxidation barrier layer to protect against memory cell contamination or oxidation and a method of manufacturing the same. In one embodiment, a semiconductor memory device comprises a molding layer overlying a semiconductor substrate. The molding layer has a protrusion portion vertically extending from a top surface thereof. The device further includes a phase-changeable material pattern adjacent the protrusion portion and a lower electrode electrically connected to the phase-changeable material pattern.

Abstract: Phase-changeable memory devices include non-volatile memory cells. Each of these non-volatile memory cells may include a phase-changeable diode on a semiconductor substrate and a phase-changeable memory element having a first terminal electrically coupled to a terminal of the phase-changeable diode. This phase-changeable diode may include a lower electrode pattern on the semiconductor substrate, a first phase-changeable pattern on the lower electrode pattern and a gate switching layer pattern on the first phase-changeable pattern. The phase-changeable memory element includes a second phase-changeable pattern electrically coupled to the terminal of the phase-changeable diode and a memory switching layer pattern on the second phase-changeable pattern. The memory switching layer pattern may include a composite of a titanium layer pattern contacting the phase-changeable memory element and a titanium nitride layer pattern contacting the titanium layer pattern.

Abstract: In one embodiment, a phase-change memory device has an oxidation barrier layer to protect against memory cell contamination or oxidation and a method of manufacturing the same. In one embodiment, a semiconductor memory device comprises a molding layer overlying a semiconductor substrate. The molding layer has a protrusion portion vertically extending from a top surface thereof. The device further includes a phase-changeable material pattern adjacent the protrusion portion and a lower electrode electrically connected to the phase-changeable material pattern.

Abstract: A phase-change random access memory device may include a phase-change pattern, a first electrode structure connected to the phase-change pattern, and a second electrode structure spaced apart from the first electrode structure and connected to the phase-change pattern, wherein at least one of the first electrode structure and the second electrode structure includes a plurality of resistor patterns connected to the phase-change pattern in parallel.

Abstract: A phase-change memory device has an oxidation barrier layer to protect against memory cell contamination or oxidation and a method of manufacturing the same. In one embodiment, a semiconductor memory device comprises a molding layer overlying a semiconductor substrate. The molding layer has a protrusion portion vertically extending from a top surface thereof. The device further includes a phase-changeable material pattern adjacent the protrusion portion and a lower electrode electrically connected to the phase-changeable material pattern.

Abstract: A phase change memory device includes a mold layer disposed on a substrate, a heating electrode, a filling insulation pattern and a phase change material pattern. The heating electrode is disposed in an opening exposing the substrate through the mold layer. The heating electrode is formed in a substantially cylindrical shape, having its sidewalls conformally disposed on the lower inner walls of the opening. The filling insulation pattern fills an empty region surrounded by the sidewalls of the heating electrode. The phase change material pattern is disposed on the mold layer and downwardly extended to fill the empty part of the opening. The phase change material pattern contacts the top surfaces of the sidewalls of the heating electrode.

Abstract: A phase change memory device includes a mold layer disposed on a substrate, a heating electrode, a filling insulation pattern and a phase change material pattern. The heating electrode is disposed in an opening exposing the substrate through the mold layer. The heating electrode is formed in a substantially cylindrical shape, having its sidewalls conformally disposed on the lower inner walls of the opening. The filling insulation pattern fills an empty region surrounded by the sidewalls of the heating electrode. The phase change material pattern is disposed on the mold layer and downwardly extended to fill the empty part of the opening. The phase change material pattern contacts the top surfaces of the sidewalls of the heating electrode.

Abstract: A phase-change random access memory device may include a phase-change pattern, a first electrode structure connected to the phase-change pattern, and a second electrode structure spaced apart from the first electrode structure and connected to the phase-change pattern, wherein at least one of the first electrode structure and the second electrode structure includes a plurality of resistor patterns connected to the phase-change pattern in parallel.

Abstract: According to some embodiments of the present invention, there are provided PRAMS having a phase-change layer pattern interposed between a molding layer and a forming layer pattern, and methods of forming the same that include a node conductive layer pattern, a molding layer, a forming layer pattern and a protecting layer. The molding layer, the forming layer pattern and the protecting layer are formed to cover the planarized interlayer insulating layer and the node conductive layer pattern. A lower electrode is interposed between the molding layer and the planarized interlayer insulating layer. A phase-change layer pattern is formed on the planarized interlayer insulating layer. A spacer pattern is disposed between the phase-change layer pattern and the molding layer.

Abstract: Phase-changeable memory devices include non-volatile memory cells. Each of these non-volatile memory cells may include a phase-changeable diode on a semiconductor substrate and a phase-changeable memory element having a first terminal electrically coupled to a terminal of the phase-changeable diode. This phase-changeable diode may include a lower electrode pattern on the semiconductor substrate, a first phase-changeable pattern on the lower electrode pattern and a gate switching layer pattern on the first phase-changeable pattern. The phase-changeable memory element includes a second phase-changeable pattern electrically coupled to the terminal of the phase-changeable diode and a memory switching layer pattern on the second phase-changeable pattern. The memory switching layer pattern may include a composite of a titanium layer pattern contacting the phase-changeable memory element and a titanium nitride layer pattern contacting the titanium layer pattern.