Abstract: A method of producing a laser chip includes providing a semiconductor wafer; creating a plurality of depressions arranged one behind another along a breaking direction on a top side of the semiconductor wafer, wherein 1) each depression includes a front boundary face and a rear boundary face successively in the breaking direction, 2) in at least one depression, the rear boundary face is inclined by an angle of 95° to 170° relative to the top side of the semiconductor wafer, 3) at least one depression includes a shoulder adjacent to the rear boundary face, and 4) the shoulder includes a shoulder face parallel to the top side of the semiconductor wafer and adjacent to the rear boundary face; and breaking the semiconductor wafer in the breaking direction at a breaking plane oriented perpendicularly to the top side of the semiconductor wafer and which runs through the depressions.

Abstract: An arrangement includes a confining layer, a metallization layer and a semiconductor component, wherein the metallization layer is arranged on the semiconductor component, and the confining layer is arranged on the metallization layer, the confining layer spatially establishes a reservoir for the marker material at least partially in a defined manner, the confining layer and the metallization layer include an identical material, and the marker material is arranged in the reservoir of the arrangement.

Abstract: A device under test, such as a point machine, which is screwed to two longitudinal supports, which can be individually moved horizontally and vertically is provided. Thus, a highly flexible solution is created, because even devices under test having unknown or asymmetric dimensions can be fittingly accommodated and positioned. Linear drives enable highly accurate positioning of the supports, in particular even if the supports are have high inherent weight or are already loaded with the device under test. According to one embodiment, the mechanical system is designed to grasp and/or to lift a mounting cart by means of the supports, on which mounting cart the device under test is fastened by screwing. This provides the advantage that the device under test can be tested while mounted directly to the mounting cart without separate transferring and screwing of the device under test being required.

Abstract: An optoelectronic component and a method for producing an optoelectronic component are disclosed. In an embodiment the optoelectronic component includes a layer structure having an active zone for producing electromagnetic radiation, wherein the active zone is arranged in a first plane, wherein a recess is introduced into the surface of the layer structure, wherein the recess adjoins an end surface of the component, wherein the end surface is arranged in a second plane, wherein the second plane is arranged substantially perpendicularly to the first plane, wherein the recess has a bottom surface and a lateral surface wherein the lateral surface is arranged substantially perpendicularly to the end surface, wherein the lateral surface is arranged tilted at an angle not equal to 90° to the first plane of the active zone, and wherein the bottom surface is arranged in the region of the first plane of the active zone.

Abstract: A method for patterning a sequence of layers and a semiconductor laser device are disclosed. In an embodiment the method creates at least one trench in the sequence of layers by two plasma etching methods. The semiconductor laser device comprises a sequence of layers including a semiconductor material and two trenches in the sequence of layers. The trenches laterally delimit a ridge waveguide. Each of the trenches is delimited on the side facing away from the ridge waveguide by a region of the sequence of layers.

Abstract: A method of producing a laser chip includes providing a semiconductor wafer; creating a plurality of depressions arranged one behind another along a breaking direction on a top side of the semiconductor wafer, wherein 1) each depression includes a front boundary face and a rear boundary face successively in the breaking direction, 2) in at least one depression, the rear boundary face is inclined by an angle of 95° to 170° relative to the top side of the semiconductor wafer, 3) at least one depression includes a shoulder adjacent to the rear boundary face, and 4) the shoulder includes a shoulder face parallel to the top side of the semiconductor wafer and adjacent to the rear boundary face; and breaking the semiconductor wafer in the breaking direction at a breaking plane oriented perpendicularly to the top side of the semiconductor wafer and which runs through the depressions.

Abstract: A device under test, such as a point machine, which is screwed to two longitudinal supports, which can be individually moved horizontally and vertically—is provided. Thus, a highly flexible solution is created, because even devices under test having unknown or asymmetric dimensions can be fittingly accommodated and positioned. Linear drives enable highly accurate positioning of the supports, in particular even if the supports are have high inherent weight or are already loaded with the device under test. According to one embodiment, the mechanical system is designed to grasp and/or to lift a mounting cart by means of the supports, on which mounting cart the device under test is fastened by screwing. This provides the advantage that the device under test can be tested while mounted directly to the mounting cart without separate transferring and screwing of the device under test being required.

Abstract: A switch mechanism serves for changing over the path traveled by a rail vehicle on a track. The switch mechanism has an electric motor, the rotational movement of which is converted into a linear movement by way of a spindle rod or toothed rack. Part of the mechanical system is usually also a coupling, which prevents excessive force from being exerted on the track. A flexible adaptation for the test slider of a switch drive enables complete testing of the switch drive on a test bench. The switch drive can be tested in the final state because the test slider does not need to first be removed and then reinstalled only after testing. Separate testing of the test slider in terms of its function and its high voltage strength is therefore no longer necessary. After the testing, no additional steps need to be carried out on the switch drive.

Abstract: A semiconductor laser includes a layer structure with superimposed layers with at least the following layer structure: an n-doped outer layer, a third wave-guiding layer, an active zone in which light-generating structures are arranged, a second wave-guiding layer, a blocking layer, a first wave-guiding layer, a p-doped outer layer. The first, second and third wave-guiding layers have at least AlxInyGa (1?x?y) N. The blocking layer has an Al content which is at least 2% greater than the Al content of the adjacent first wave-guiding layer. The Al content of the blocking layer increases from the first wave-guiding layer towards the second wave-guiding layer. The layer structure has a double-sided gradation. The double-side gradation is arranged at the height of the blocking layer such that at least one part of the blocking layer or the entire blocking layer is of greater width than the first wave-guiding layer.

Abstract: A semiconductor laser includes a layer structure with superimposed layers with at least the following layer structure: an n-doped outer layer, a third wave-guiding layer, an active zone in which light-generating structures are arranged, a second wave-guiding layer, a blocking layer, a first wave-guiding layer, a p-doped outer layer. The first, second and third wave-guiding layers have at least AlxInyGa (1?x?y) N. The blocking layer has an Al content which is at least 2% greater than the Al content of the adjacent first wave-guiding layer. The Al content of the blocking layer increases from the first wave-guiding layer towards the second wave-guiding layer. The layer structure has a double-sided gradation. The double-side gradation is arranged at the height of the blocking layer such that at least one part of the blocking layer or the entire blocking layer is of greater width than the first wave-guiding layer.

Abstract: In a method and apparatus for assisting the driver of a vehicle in maintaining a traffic lane limited by traffic lane markings, the traffic lane markings and the position of the vehicle in the traffic lane are detected. Upon an actual or impending change of traffic lanes a lane change warning is output to the driver of the vehicle in a first step, and a course correcting actuating intervention counteracting the lane change is carried out in a second step. The actuating intervention is carried out only if the change of traffic lanes is impermissible due to the type of traffic lane marking to be crossed during the traffic lane change, or if the lane change is not possible without danger due to collision-endangering objects present on the side of the traffic lane.

Abstract: In a method and apparatus for assisting the driver of a vehicle in maintaining a traffic lane limited by traffic lane markings, the traffic lane markings and the position of the vehicle in the traffic lane are detected. Upon an actual or impending change of traffic lanes a lane change warning is output to the driver of the vehicle in a first step, and a course correcting actuating intervention counteracting the lane change is carried out in a second step. The actuating intervention is carried out only if the change of traffic lanes is impermissible due to the type of traffic lane marking to be crossed during the traffic lane change, or if the lane change is not possible without danger due to collision-endangering objects present on the side of the traffic lane.

Abstract: Apparatus for automatically manufacturing an annular ribbon from stock as, for example, from a reel or roll of such ribbon. A feeding device cuts a length of ribbon dependent upon the preselected size of the annular ribbon, and the apparatus includes a pair of grip members which selectively hold the ends of the ribbon both during the formation of the loop and while the ribbon is being cut from the stock. The grip member rotates so as to cause the two free ends of the ribbon to overlap, thereby permitting the free ends to be secured together as by sewing.