Patents by Inventor Swadesh Choudhary
Swadesh Choudhary has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11971841Abstract: An adapter is provided that includes a first interface to couple to a particular device, where link layer data is to be communicated over the first interface, and a second interface to couple to a physical layer (PHY) device. The PHY device includes wires to implement a physical layer of a link, and the link couples the adapter to another adapter via the PHY device. The second interface includes a data channel to communicate the link layer data over the physical layer, and a sideband channel to communicate sideband messages between the adapter and the other adapter over the physical layer. The adapter is to implement a logical PHY for the link.Type: GrantFiled: August 31, 2020Date of Patent: April 30, 2024Assignee: Intel CorporationInventors: Narasimha Lanka, Swadesh Choudhary, Mahesh Wagh, Lakshmipriya Seshan
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Publication number: 20230370095Abstract: Embodiments herein describe a FEC codec for generating a check byte for a message. The FEC codec includes a port encoder having a storage unit, a Galois field multiplier, and a sum unit. The storage unit stores a first staged result, which is accumulated based on previous sets of input bytes of the message for all clock cycles from a first clock cycle to a clock cycle immediately prior to the current clock cycle. The Galois field multiplier performs a Galois field multiplication of the first staged result and a power of the alpha to generate a Galois field product. The sum unit performs a Galois field addition on an internal input based on a consolidated byte for the current clock cycle and the Galois field product to generate a second staged result for subsequent use to generate the check byte. Other embodiments may be described and/or claimed.Type: ApplicationFiled: July 19, 2023Publication date: November 16, 2023Inventors: Debendra Das Sharma, Swadesh Choudhary
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Patent number: 11818058Abstract: Systems, methods, and computer-readable media are disclosed for an apparatus coupled to a communication bus, where the apparatus includes a queue and a controller to manage operations of the queue. The queue includes a first space to store a first information for a first traffic type, with a first flow class, and for a first virtual channel of communication between a first communicating entity and a second communicating entity. The queue further includes a second space to store a second information for a second traffic type, with a second flow class, and for a second virtual channel of communication between a third communicating entity and a fourth communicating entity. The first traffic type is different from the second traffic type, the first flow class is different from the second flow class, or the first virtual channel is different from the second virtual channel. Other embodiments may be described and/or claimed.Type: GrantFiled: July 13, 2021Date of Patent: November 14, 2023Assignee: Intel CorporationInventors: Debendra Das Sharma, Swadesh Choudhary
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Publication number: 20230350829Abstract: An interface for coupling an agent to a fabric supports a set of coherent interconnect protocols and includes a global channel to communicate control signals to support the interface, a request channel to communicate messages associated with requests to other agents on the fabric, a response channel to communicate responses to other agents on the fabric, and a data channel to couple to communicate messages associated with data transfers to other agents on the fabric, where the data transfers include payload data.Type: ApplicationFiled: July 7, 2023Publication date: November 2, 2023Applicant: Intel CorporationInventors: Swadesh Choudhary, Robert G. Blankenship, Siva Prasad Gadey, Sailesh Kumar, Vinit Mathew Abraham, Yen-Cheng Liu
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Publication number: 20230342323Abstract: An interface for coupling an agent to a fabric supports a load/store interconnect protocol, where the I/O interconnect protocol includes a flit mode and a non-flit mode. A set of flit mode header formats are used when in the flit mode and a set of non-flit mode header formats are used when in the non-flit mode, the set of non-flit mode header formats including one or more non-flit mode fields. Interface logic determines that a link is trained to the non-flit mode and generates a header according to the set of flit mode header formats, where the header includes a field to indicate that a corresponding packet originated as a non-flit mode packet. One or more fields of the set of flit mode header formats are repurposed in the header to carry the one or more non-flit mode fields before sending the modified header over the interface.Type: ApplicationFiled: June 30, 2023Publication date: October 26, 2023Inventors: Mohannad Fahim Ali, Swadesh Choudhary, Joji Philip, David J. Harriman
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Patent number: 11770138Abstract: Embodiments herein describe a FEC codec for generating a check byte for a message. The FEC codec includes a port encoder having a storage unit, a Galois field multiplier, and a sum unit. The storage unit stores a first staged result, which is accumulated based on previous sets of input bytes of the message for all clock cycles from a first clock cycle to a clock cycle immediately prior to the current clock cycle. The Galois field multiplier performs a Galois field multiplication of the first staged result and a power of the alpha to generate a Galois field product. The sum unit performs a Galois field addition on an internal input based on a consolidated byte for the current clock cycle and the Galois field product to generate a second staged result for subsequent use to generate the check byte. Other embodiments may be described and/or claimed.Type: GrantFiled: June 12, 2020Date of Patent: September 26, 2023Assignee: Intel CorporationInventors: Debendra Das Sharma, Swadesh Choudhary
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Patent number: 11762802Abstract: An interface for coupling an agent to a fabric supports a load/store interconnect protocol and includes a header channel implemented on a first subset of a plurality of physical lanes, the first subset of lanes including first lanes to carry a header of a packet based on the interconnect protocol and second lanes to carry metadata for the header. The interface additionally includes a data channel implemented on a separate second subset of the plurality of physical lanes, the second subset of lanes including third lanes to carry a payload of the packet and fourth lanes to carry metadata for the payload.Type: GrantFiled: June 27, 2020Date of Patent: September 19, 2023Assignee: Intel CorporationInventors: Swadesh Choudhary, Debendra Das Sharma, Lee Albion
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Publication number: 20230258716Abstract: Techniques to perform semiconductor testing are described. Test equipment may test a chiplet for compliance with a semiconductor specification. A test device may connect to a test package with a model chiplet and a device under test (DUT) chiplet. The model chiplet may comprise a known good model (KGM) of the semiconductor specification. The test device may use the model chiplet to test the DUT chiplet. Other embodiments are described and claimed.Type: ApplicationFiled: March 31, 2023Publication date: August 17, 2023Applicant: Intel CorporationInventors: Swadesh Choudhary, Debendra Das Sharma, Gerald Pasdast, Zuogo Wu, Narasimha Lanka, Lakshmipriya Seshan
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Publication number: 20230237168Abstract: Embodiments herein relate to an electronic device with an interface an interface to communicatively couple with a second electronic device via a communication link, and a link controller. The link controller may be configured to identify, from the second electronic device over the communication link, a flit related to a request from the second electronic device to access a resource of the first electronic device, wherein the flit is an element of a message authentication code (MAC) epoch; generate, based on the flit, a cache/mem interface message related to the request, wherein the cache/mem interface message includes an indication of the MAC epoch; and transmit, to a device fabric of the first electronic device, the cache/mem interface message prior to receipt of a MAC related to the MAC epoch. Other embodiments may be described and/or claimed.Type: ApplicationFiled: March 30, 2023Publication date: July 27, 2023Inventors: Swadesh Choudhary, Robert Blankenship, Mohannad Fahim Ali, Raghunandan Makaram
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Publication number: 20230236651Abstract: A single communication fabric for a data processing apparatus is provided. The fabric has an interconnection network to provide a topology of data communication channels between a plurality of data-handling functional units. The interconnection network has a first interconnection domain to provide data communication between a first subset of the data-handling functional units and a second interconnection domain to provide data communication between a second subset of the data-handling functional units. The power management circuitry is arranged to control a first performance level for the first interconnection domain independently from control of a second performance level for the second interconnection domain. Machine readable instructions and a method are provided to concurrently set performance levels of two different fabric domains to respective different operating frequencies.Type: ApplicationFiled: June 26, 2020Publication date: July 27, 2023Inventors: UJJWAL GUPTA, ANKUSH VARMA, LAKSHMIPRIYA SESHAN, NIKETHAN SHIVANAND BALIGAR, NIKHIL GUPTA, SWADESH CHOUDHARY, YOGESH BANSAL
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Publication number: 20230230923Abstract: A microelectronic device, a semiconductor package including the device, an IC device assembly including the package, and a method of making the device. The device includes a substrate; physical layer (PHY) circuitry on the substrate including a plurality of receive (RX) circuits and a plurality of transmit (TX) circuits; electrical contact structures at a bottom surface of the device; signal routing paths extending between the electrical contact structures on one hand, and, on another hand, at least some of the RX circuits or at least some of the TX circuits; and electrical pathways leading to the PHY circuitry and configured such that at least one of: an enable signal input to the device is to travel through at least some of the electrical pathways to enable a portion of the PHY circuitry; or a disable signal input to the device is to travel through at least some of the electrical pathways to disable a corresponding portion of the PHY circuitry.Type: ApplicationFiled: May 26, 2022Publication date: July 20, 2023Applicant: Intel CorporationInventors: Gerald Pasdast, Zhiguo Qian, Sathya Narasimman Tiagaraj, Lakshmipriya Seshan, Peipei Wang, Debendra Das Sharma, Srikanth Nimmagadda, Zuoguo Wu, Swadesh Choudhary, Narasimha Lanka
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Patent number: 11698879Abstract: An interface for coupling an agent to a fabric supports a set of coherent interconnect protocols and includes a global channel to communicate control signals to support the interface, a request channel to communicate messages associated with requests to other agents on the fabric, a response channel to communicate responses to other agents on the fabric, and a data channel to couple to communicate messages associated with data transfers to other agents on the fabric, where the data transfers include payload data.Type: GrantFiled: June 27, 2020Date of Patent: July 11, 2023Assignee: Intel CorporationInventors: Swadesh Choudhary, Robert G. Blankenship, Siva Prasad Gadey, Sailesh Kumar, Vinit Mathew Abraham, Yen-Cheng Liu
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Publication number: 20220342841Abstract: A die-to-die (D2D) adapter couples to a protocol layer block using a first interface to couple to a protocol layer block and couples to a physical layer (PHY) block using a second interface. The D2D adapter is to determine parameters of a D2D link to couple a first die to a second die and select, based on the parameters, a particular one of a plurality of different data formats for use on the D2D link. Protocol layer data is received at the D2D adapter over the first interface from the protocol layer block. The D2D adapter passes the protocol layer data over the second interface to the PHY block based on the particular data format.Type: ApplicationFiled: July 1, 2022Publication date: October 27, 2022Inventors: Swadesh Choudhary, Debendra Das Sharma, Narasimha Lanka, Lakshmipriya Seshan, Gerald Pasdast, Zuoguo Wu
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Publication number: 20220342840Abstract: A port is to couple to another die over a die-to-die (D2D) link and includes physical layer (PHY) circuitry including a first number of sideband lanes to carry data for use in training and management of the D2D link, and a second number of mainband lanes to implement a main data path of the D2D link. The mainband lanes include a forwarded clock lane, a valid lane, and a plurality of data lanes. A logical PHY coordinates functions of the sideband lanes and the mainband lanes.Type: ApplicationFiled: June 29, 2022Publication date: October 27, 2022Applicant: Intel CorporationInventors: Debendra Das Sharma, Swadesh Choudhary, Narasimha Lanka, Lakshmipriya Seshan, Gerald Pasdast, Zuoguo Wu
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Publication number: 20220334932Abstract: A retimer includes a first port to couple to a die over a first interconnect, where the first interconnect includes a defined set of lanes and utilizes a first communication technology, and the die is located on a first package with the retimer. The retimer further includes a second port to couple to another retimer over a second interconnect, where the second interconnect utilizes a different second communication technology, and the second retimer is located on a different, second package to facilitate a longer reach communication channel.Type: ApplicationFiled: June 30, 2022Publication date: October 20, 2022Inventors: Debendra Das Sharma, Swadesh Choudhary, Sridhar Muthrasanallur, Narasimha Lanka, Zuoguo Wu, Gerald Pasdast, Lakshmipriya Seshan
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Publication number: 20220334995Abstract: A port is to couple to another die over a die-to-die (D2D) link and includes a die-tio-die (D2D) adapter to determine, from a set of registers, a set of capabilities of the D2D adapter to advertise in a negotiation with a link partner D2D adapter, where the D2D adapter is on a die and the link partner D2D adapter is located on a remote link partner die. A first capabilities advertisement message is sent to the link partner D2D adapter to advertise the set of capabilities to the link partner D2D adapter. A second capabilities advertisement message is received from the link partner D2D adapter, wherein the second capabilities advertisement message identifies a set of capabilities of the link partner D2D adapter. A final configuration of a D2D link is determined to couple the die to the link partner die.Type: ApplicationFiled: June 30, 2022Publication date: October 20, 2022Inventors: Debendra Das Sharma, Mahesh S. Natu, Sridhar Muthrasanallur, Swadesh Choudhary, Narasimha Lanka, Lakshmipriya Seshan
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Publication number: 20220327084Abstract: Protocol layer logic in a protocol stack receives an indication that a particular mode is to be utilized on a die-to-die (D2D) link connecting a first device to a second device. The protocol layer logic generates data to be sent on the D2D link to adapt the particular data format to a flit format defined for use on the D2D link in the particular mode, the flit format comprises providing a set of reserved fields to be completed by an adapter block positioned between the protocol circuitry and a physical layer block. The data in the flit format is sent to the data to the adapter block to prepare the data for transmission over the D2D link.Type: ApplicationFiled: June 29, 2022Publication date: October 13, 2022Applicant: Intel CorporationInventors: Debendra Das Sharma, Swadesh Choudhary, Narasimha Lanka, Lakshmipriya Seshan, Gerald Pasdast, Zuoguo Wu
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Publication number: 20220327276Abstract: In one embodiment, an apparatus includes a first die comprising: a die-to-die adapter to communicate with protocol layer circuitry and physical layer circuitry, where the die-to-die adapter is to receive first information of a first interconnect protocol; and the physical layer circuitry coupled to the die-to-die adapter. The physical layer circuitry is configured to receive and output the first information to a second die via an interconnect and comprises: a first plurality of transmitters to transmit data via a first plurality of data lanes; and at least one redundant transmitter. The physical layer circuitry may be configured to remap a first data lane of the first plurality of data lanes to the at least one redundant transmitter. Other embodiments are described and claimed.Type: ApplicationFiled: June 20, 2022Publication date: October 13, 2022Inventors: Lakshmipriya Seshan, Gerald Pasdast, Peipei Wang, Narasimha Lanka, Swadesh Choudhary, Zuoguo Wu, Debendra Das Sharma
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Publication number: 20220327083Abstract: In one embodiment, a first die comprises: a first die-to-die adapter to communicate with first protocol layer circuitry via a flit-aware die-to-die interface (FDI) and first physical layer circuitry via a raw die-to-die interface (RDI), where the first die-to-die adapter is to receive message information comprising first information of a first interconnect protocol; and the first physical layer circuitry coupled to the first die-to-die adapter. The first physical layer circuitry may be configured to receive and output the first information to a second die via an interconnect, the first physical layer circuitry comprising a plurality of modules, each of the plurality of modules comprising an analog front end having transmitter circuitry and receiver circuitry. Other embodiments are described and claimed.Type: ApplicationFiled: June 20, 2022Publication date: October 13, 2022Inventors: Debendra Das Sharma, Swadesh Choudhary, Narasimha Lanka, Zuoguo Wu, Gerald Pasdast, Lakshmipriya Seshan
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Publication number: 20220318111Abstract: In one embodiment, an apparatus comprises a first die that includes: a die-to-die adapter comprising a plurality of first registers, the die-to-die adapter to communicate with protocol layer circuitry via a flit-aware die-to-die interface (FDI) and physical layer circuitry via a raw die-to-die interface (RDI), wherein the die-to-die adapter is to receive message information of a first interconnect protocol; and the physical layer circuitry coupled to the die-to-die adapter, the physical layer circuity comprising a plurality of second registers, where the physical layer circuitry is to receive and output the message information to a second die via an interconnect having a mainband and a sideband. During a test of the apparatus, the sideband is to enable access to information in at least one of the plurality of first registers or at least one of the plurality of second registers. Other embodiments are described and claimed.Type: ApplicationFiled: June 20, 2022Publication date: October 6, 2022Inventors: Swadesh Choudhary, Narasimha Lanka, Debendra Das Sharma, Lakshmipriya Seshan, Zuoguo Wu, Gerald Pasdast