Patents by Inventor Swadesh Choudhary

Swadesh Choudhary has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220308954
    Abstract: In an embodiment, an apparatus includes a receiver circuit to: in response to a determination that the receiver circuit is in a high latency processing mode, transmit a hint signal to a transmitter circuit; receive a response message from the transmitter circuit; process the response message to reduce a current workload of the receiver circuit; and switch the receiver circuit from the high latency processing mode to a low latency processing mode. Other embodiments are described and claimed.
    Type: Application
    Filed: December 23, 2021
    Publication date: September 29, 2022
    Inventors: Swadesh Choudhary, Debendra Das Sharma, Michelle Jen
  • Publication number: 20220271912
    Abstract: Embodiments herein may relate to a die for use in a multi-die package. The die may include clock circuitry that is able to identify a phase of a data signal to be transmitted and a phase of a clock signal to be transmitted on a die-to-die (D2D) link. The clock circuitry may further be configured adjust the phase of the clock signal such that the phase of the clock signal is approximately 90 degrees from the phase of the data signal such that the clock signal and the data signal are received by a receiver die of the D2D link with a 90 degree phase difference. Other embodiments may be described and claimed.
    Type: Application
    Filed: May 12, 2022
    Publication date: August 25, 2022
    Inventors: Gerald Pasdast, Peipei Wang, Lakshmipriya Seshan, Juan Zeng, Zuoguo Wu, Zhiguo Qian, Narasimha Lanka, Debendra Das Sharma, Swadesh Choudhary
  • Publication number: 20220262756
    Abstract: Embodiments herein relate to action that are to be taken on various lanes of a die-to-die (D2D) interconnect in the event of clock-gating. Specifically, based on identification that a clock-gating event is to occur, physical layer (PHY) logic may direct PHY electrical circuitry to set the state of various of the lanes. In some embodiments, different actions may be taken based on whether the D2D interconnect is terminated or unterminated. Other embodiments may be described and claimed.
    Type: Application
    Filed: April 29, 2022
    Publication date: August 18, 2022
    Inventors: Narasimha Lanka, Debendra Das Sharma, Lakshmipriya Seshan, Gerald Pasdast, Zuoguo Wu, Swadesh Choudhary
  • Publication number: 20220261308
    Abstract: Embodiments herein relate to a die of a multi-die package, wherein the die is coupled with another die via a die-to-die (D2D) interconnect link. The die may transmit a data signal to the other die via a data lane of the D2D interconnect link. The die may further transmit, concurrently with the data signal, a valid signal to the other die via a valid lane of the D2D interconnect link. The valid signal may change logical state at least once during the transmission of the data signal. Other embodiments may be described and claimed.
    Type: Application
    Filed: April 29, 2022
    Publication date: August 18, 2022
    Inventors: Narasimha Lanka, Debendra Das Sharma, Lakshmipriya Seshan, Swadesh Choudhary, Zuoguo Wu, Gerald Pasdast
  • Publication number: 20220237138
    Abstract: In one embodiment, an apparatus includes: a die-to-die adapter to communicate with a protocol layer and physical layer circuitry, and the physical layer circuitry coupled to the die-to-die adapter, where the physical layer circuitry is to receive and output first information to a second die via an interconnect. The physical layer circuitry, after a reset flow for the first die, is to: perform a sideband initialization of a sideband interface of the interconnect to detect that the second die has completed a reset flow for the second die; and after the sideband initialization, perform a mainband initialization of a mainband interface of the interconnect at a lowest speed, and thereafter perform a mainband training of the mainband interface at a negotiated data rate. Other embodiments are described and claimed.
    Type: Application
    Filed: March 30, 2022
    Publication date: July 28, 2022
    Inventors: Narasimha Lanka, Lakshmipriya Seshan, Swadesh Choudhary, Debendra Das Sharma, Zuoguo Wu, Gerald Pasdast
  • Publication number: 20220222198
    Abstract: In one embodiment, an apparatus includes: a die-to-die adapter to communicate with protocol layer circuitry and physical layer circuitry; and the physical layer circuitry coupled to the die-to-die adapter, where the physical layer circuitry is to receive and output first information to a second die via an interconnect. The physical layer circuitry may include: a first sideband data receiver to couple to a first sideband data lane and a first sideband clock receiver to couple to a first sideband clock lane; and a second sideband data receiver to couple to a second sideband data lane and a second sideband clock receiver to couple to a second sideband clock lane. The physical layer circuitry may assign a functional sideband comprising: one of the first or second sideband data lanes; and one of the first or second sideband clock lanes. Other embodiments are described and claimed.
    Type: Application
    Filed: March 30, 2022
    Publication date: July 14, 2022
    Inventors: Narasimha Lanka, Swadesh Choudhary, Debendra Das Sharma, Lakshmipriya Seshan, Zuoguo Wu, Gerald Pasdast
  • Patent number: 11294850
    Abstract: In one embodiment, a system on chip includes: a plurality of intellectual property (IP) agents formed on a semiconductor die; a mesh interconnect formed on the semiconductor die to couple the plurality of IP agents, and a plurality of mesh stops each to couple one or more of the plurality of IP agents to the mesh interconnect. The mesh interconnect may be formed of a plurality of rows each having one of a plurality of horizontal interconnects and a plurality of columns each having one of a plurality of vertical interconnects;, where at least one of the plurality of rows includes an asymmetrical number of mesh stops. Other embodiments are described and claimed.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: April 5, 2022
    Assignee: Intel Corporation
    Inventors: Brinda Ganesh, Yen-Cheng Liu, Swadesh Choudhary, Tejpal Singh, Pradeep Prabhakaran, Monam Agarwal
  • Patent number: 11281562
    Abstract: In one embodiment, a processor comprises a fabric interconnect to couple a first cache agent to at least one of a memory controller or an input/output (I/O) controller; and a first cache agent comprising a cache controller coupled to a cache; and a trace and capture engine to periodically capture a snapshot of state information associated with the first cache agent; trace events to occur at the first cache agent in between captured snapshots; and send the captured snapshots and traced events via the fabric interconnect to the memory controller or I/O controller for storage at a system memory or storage device.
    Type: Grant
    Filed: December 19, 2019
    Date of Patent: March 22, 2022
    Assignee: INTEL CORPORATION
    Inventors: Bahaa Fahim, Swadesh Choudhary
  • Publication number: 20220012140
    Abstract: A device includes a port with a replay buffer and protocol logic to receive a flit in a sequence of flits to be sent on a point-to-point link and determine an error in the flit. Based on the error, a copy of the flit is stored in a first position within the replay buffer as well as a copy of a next flit received in the sequence of flits, which is stored in a second position within the replay buffer. The copies of the flits are then written to a register for access by software.
    Type: Application
    Filed: September 24, 2021
    Publication date: January 13, 2022
    Inventors: Debendra Das Sharma, Michelle C. Jen, Swadesh Choudhary, Raghucharan Boddupalli
  • Publication number: 20210409351
    Abstract: Systems, methods, and computer-readable media are disclosed for an apparatus coupled to a communication bus, where the apparatus includes a queue and a controller to manage operations of the queue. The queue includes a first space to store a first information for a first traffic type, with a first flow class, and for a first virtual channel of communication between a first communicating entity and a second communicating entity. The queue further includes a second space to store a second information for a second traffic type, with a second flow class, and for a second virtual channel of communication between a third communicating entity and a fourth communicating entity. The first traffic type is different from the second traffic type, the first flow class is different from the second flow class, or the first virtual channel is different from the second virtual channel. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: July 13, 2021
    Publication date: December 30, 2021
    Applicant: Intel Corporation
    Inventors: Debendra Das Sharma, Swadesh Choudhary
  • Patent number: 11088967
    Abstract: Systems, methods, and computer-readable media are disclosed for an apparatus coupled to a communication bus, where the apparatus includes a queue and a controller to manage operations of the queue. The queue includes a first space to store a first information for a first traffic type, with a first flow class, and for a first virtual channel of communication between a first communicating entity and a second communicating entity. The queue further includes a second space to store a second information for a second traffic type, with a second flow class, and for a second virtual channel of communication between a third communicating entity and a fourth communicating entity. The first traffic type is different from the second traffic type, the first flow class is different from the second flow class, or the first virtual channel is different from the second virtual channel. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: July 29, 2019
    Date of Patent: August 10, 2021
    Assignee: Intel Corporation
    Inventors: Debendra Das Sharma, Swadesh Choudhary
  • Publication number: 20210232520
    Abstract: In one embodiment, an apparatus includes: a first link layer circuit to perform link layer functionality for a first communication protocol; and a logical physical (logPHY) circuit coupled to the first link layer circuit via a logical PHY interface (LPIF) link, the logPHY circuit to communicate with the first link layer circuit in a flit mode in which the first information is communicated in a fixed width size and to communicate with another link layer circuit in a non-flit mode. Other embodiments are described and claimed.
    Type: Application
    Filed: April 15, 2021
    Publication date: July 29, 2021
    Inventors: Swadesh Choudhary, Mahesh Wagh, Debendra Das Sharma
  • Publication number: 20210119730
    Abstract: Systems, methods, and apparatuses can include transmission-side protocol stack circuitry comprising first cyclic redundancy check (CRC) circuitry to determine first CRC code for a first set of information and to determine second CRC code for a second set of information; and Flit encoding circuitry to encode a first portion of a Flit with the first set of information and the first CRC code, the Flit encoding circuitry to encode a second portion of the Flit with the second set of information and the second CRC code. Receiver-side protocol stack circuitry can include a low-latency path comprising first CRC check circuitry to perform a CRC check on a first portion of a received Flit. Receiver-side protocol stack circuitry can include a non-low-latency path comprising forward error correction (FEC) decoder circuitry to perform FEC on received Flits, and second CRC check circuitry to perform CRC check on received Flits that pass FEC.
    Type: Application
    Filed: December 25, 2020
    Publication date: April 22, 2021
    Applicant: Intel Corporation
    Inventors: Debendra Das Sharma, Swadesh Choudhary
  • Publication number: 20210112132
    Abstract: In one embodiment, an apparatus includes: a transaction layer circuit to output transaction layer information; and a link layer circuit coupled to the transaction layer circuit, the link layer circuit to receive and process the transaction layer information and to output link layer information to a physical circuit. The link layer circuit may include a first selection circuit to receive and direct cache memory protocol traffic to a selected one of a first logical port and a second logical port. Other embodiments are described and claimed.
    Type: Application
    Filed: December 21, 2020
    Publication date: April 15, 2021
    Inventors: NITISH PALIWAL, PEEYUSH PUROHIT, SWADESH CHOUDHARY, MANJULA PEDDIREDDY, MAHESH NATU, MAHESH WAGH
  • Publication number: 20210013999
    Abstract: Systems and devices can include protocol stack circuitry to perform certain methods, including receiving a flow control unit (flit) header and a transaction layer packet (TLP) payload, the TLP payload comprising a first portion and a second portion, determining that the flit header is free from errors, forwarding the flit header and the first portion of the TLP payload to a link partner based on the flit header being free from errors, identifying that the flit contains an error from the second portion of the TLP payload, and sending a data link layer packet (DLLP) to the link partner to indicate the error in the TLP payload.
    Type: Application
    Filed: September 24, 2020
    Publication date: January 14, 2021
    Applicant: Intel Corporation
    Inventors: Swadesh Choudhary, Debendra Das Sharma, Mahesh Wagh
  • Publication number: 20200409880
    Abstract: In one embodiment, a fabric circuit is to receive requests for ownership and data commits from an agent. The fabric circuit includes a control circuit to maintain statistics regarding the requests for ownership and the data commits and throttle the fabric circuit based at least in part on the statistics. Other embodiments are described and claimed.
    Type: Application
    Filed: September 16, 2020
    Publication date: December 31, 2020
    Inventors: SWADESH CHOUDHARY, AJIT KRISSHNA NANDYAL LAKSHMAN, DODDABALLAPUR JAYASIMHA
  • Publication number: 20200394150
    Abstract: An adapter is provided that includes a first interface to couple to a particular device, where link layer data is to be communicated over the first interface, and a second interface to couple to a physical layer (PHY) device. The PHY device includes wires to implement a physical layer of a link, and the link couples the adapter to another adapter via the PHY device. The second interface includes a data channel to communicate the link layer data over the physical layer, and a sideband channel to communicate sideband messages between the adapter and the other adapter over the physical layer. The adapter is to implement a logical PHY for the link.
    Type: Application
    Filed: August 31, 2020
    Publication date: December 17, 2020
    Applicant: Intel Corporation
    Inventors: Narasimha Lanka, Swadesh Choudhary, Mahesh Wagh, Lakshmipriya Seshan
  • Patent number: 10860515
    Abstract: Herein is disclosed an integrated input/output (“I/O”) processing system, comprising an I/O port, configured to receive I/O data and to deliver the I/O data to one or more processors; one or more processors, further comprising a first processing logic and a second processing logic, wherein the one or more processors are configured to deliver the received I/O data to the first processing logic and to the second processing logic, and wherein the first processing logic and the second processing logic are configured to redundantly process the I/O data; and a comparator, configured to compare an output of the first processing logic and an output of the second processing logic.
    Type: Grant
    Filed: June 21, 2018
    Date of Patent: December 8, 2020
    Assignee: INTEL CORPORATION
    Inventors: Swadesh Choudhary, Bahaa Fahim, Mahesh Wagh
  • Publication number: 20200327088
    Abstract: An interface for coupling an agent to a fabric supports a load/store interconnect protocol and includes a header channel implemented on a first subset of a plurality of physical lanes, the first subset of lanes including first lanes to carry a header of a packet based on the interconnect protocol and second lanes to carry metadata for the header. The interface additionally includes a data channel implemented on a separate second subset of the plurality of physical lanes, the second subset of lanes including third lanes to carry a payload of the packet and fourth lanes to carry metadata for the payload.
    Type: Application
    Filed: June 27, 2020
    Publication date: October 15, 2020
    Inventors: Swadesh Choudhary, Debendra Das Sharma, Lee Albion
  • Publication number: 20200327084
    Abstract: An interface for coupling an agent to a fabric supports a set of coherent interconnect protocols and includes a global channel to communicate control signals to support the interface, a request channel to communicate messages associated with requests to other agents on the fabric, a response channel to communicate responses to other agents on the fabric, and a data channel to couple to communicate messages associated with data transfers to other agents on the fabric, where the data transfers include payload data.
    Type: Application
    Filed: June 27, 2020
    Publication date: October 15, 2020
    Inventors: Swadesh Choudhary, Robert G. Blankenship, Siva Prasad Gadey, Sailesh Kumar, Vinit Mathew Abraham, Yen-Cheng Liu