Patents by Inventor Swayambhu Prasad BEHERA

Swayambhu Prasad BEHERA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • FILM THICKNESS UNIFORMITY IMPROVEMENT USING EDGE RING AND BIAS ELECTRODE GEOMETRY
    Publication number: 20220301920
    Abstract: Embodiments of the present disclosure generally relate to the fabrication of integrated circuits and to apparatus for use within a substrate processing chamber to improve film thickness uniformity. More specifically, the embodiments of the disclosure relate to an edge ring. The edge ring may include an overhang ring.
    Type: Application
    Filed: June 6, 2022
    Publication date: September 22, 2022
    Inventors: Kin Pong LO, Vladimir NAGORNY, Wei LIU, Theresa Kramer GUARINI, Bernard L. HWANG, Malcolm J. BEVAN, Jacob ABRAHAM, Swayambhu Prasad BEHERA
  • Film thickness uniformity improvement using edge ring and bias electrode geometry
    Patent number: 11380575
    Abstract: Embodiments of the present disclosure generally relate to the fabrication of integrated circuits and to apparatus for use within a substrate processing chamber to improve film thickness uniformity. More specifically, the embodiments of the disclosure relate to an edge ring. The edge ring may include an overhang ring.
    Type: Grant
    Filed: July 27, 2020
    Date of Patent: July 5, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Kin Pong Lo, Vladimir Nagorny, Wei Liu, Theresa Kramer Guarini, Bernard L. Hwang, Malcolm J. Bevan, Jacob Abraham, Swayambhu Prasad Behera
  • FILM THICKNESS UNIFORMITY IMPROVEMENT USING EDGE RING AND BIAS ELECTRODE GEOMETRY
    Publication number: 20220028656
    Abstract: Embodiments of the present disclosure generally relate to the fabrication of integrated circuits and to apparatus for use within a substrate processing chamber to improve film thickness uniformity. More specifically, the embodiments of the disclosure relate to an edge ring. The edge ring may include an overhang ring.
    Type: Application
    Filed: July 27, 2020
    Publication date: January 27, 2022
    Inventors: Kin Pong LO, Vladimir NAGORNY, Wei LIU, Theresa Kramer GUARINI, Bernard L. HWANG, Malcolm J. BEVAN, Jacob ABRAHAM, Swayambhu Prasad BEHERA
  • HIGH TEMPERATURE ELECTROSTATIC CHUCKING WITH DIELECTRIC CONSTANT ENGINEERED IN-SITU CHARGE TRAP MATERIALS
    Publication number: 20190355609
    Abstract: Techniques are disclosed for methods and apparatuses for increasing the breakdown voltage while substantially reducing the voltage leakage of an electrostatic chuck at temperatures exceeding about 300 degrees Celsius in a processing chamber.
    Type: Application
    Filed: June 13, 2019
    Publication date: November 21, 2019
    Inventors: Prashant KULSHRESHTHA, Kwangduk Douglas LEE, Bok Hoen KIM, Zheng John YE, Swayambhu Prasad BEHERA, Ganesh BALASUBRAMANIAN, Juan Carlos ROCHA-ALVAREZ, Jian J. CHEN
  • High temperature electrostatic chucking with dielectric constant engineered in-situ charge trap materials
    Patent number: 10325800
    Abstract: Techniques are disclosed for methods and apparatuses for increasing the breakdown voltage while substantially reducing the voltage leakage of an electrostatic chuck at temperatures exceeding about 300 degrees Celsius in a processing chamber.
    Type: Grant
    Filed: August 26, 2014
    Date of Patent: June 18, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Prashant Kulshreshtha, Kwangduk Douglas Lee, Bok Hoen Kim, Zheng John Ye, Swayambhu Prasad Behera, Ganesh Balasubramanian, Juan Carlos Rocha-Alvarez, Jian J. Chen
  • HIGH TEMPERATURE ELECTROSTATIC CHUCKING WITH DIELECTRIC CONSTANT ENGINEERED IN-SITU CHARGE TRAP MATERIALS
    Publication number: 20160064264
    Abstract: Techniques are disclosed for methods and apparatuses for increasing the breakdown voltage while substantially reducing the voltage leakage of an electrostatic chuck at temperatures exceeding about 300 degrees Celsius in a processing chamber.
    Type: Application
    Filed: August 26, 2014
    Publication date: March 3, 2016
    Inventors: Prashant KULSHRESHTHA, Kwangduk Douglas LEE, Bok Hoen KIM, Zheng John YE, Swayambhu Prasad BEHERA, Ganesh BALASUBRAMANIAN, Juan Carlos ROCHA-ALVAREZ, Jian J. CHEN
  • Edge ring
    Patent number: D1034491
    Type: Grant
    Filed: July 27, 2020
    Date of Patent: July 9, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Kin Pong Lo, Vladimir Nagorny, Wei Liu, Theresa Kramer Guarini, Bernard L. Hwang, Malcolm J. Bevan, Jacob Abraham, Swayambhu Prasad Behera