Abstract: The present invention relates to a multiphase cleansing bar having a plurality of phases of cleansing material. Adjacent phases preferably have different concentration levels of benefit components respectively and all the phases individually preferably have a substantially similar cleansing base consisting of a syndet base, a soap base, or mixtures thereof. These benefit components are emollients, moisturizers, nutrients, anti-aging materials etc. Segregation of the benefit rich component is expected to result in improved deposition of the benefit components on the skin during the product application, which improves the moisture barrier properties of the skin. Chemical and Theological compatibility between the phases is maximized and recycling of the product during production is facilitated with the use of a uniform cleansing base. Methods of producing the inventive bar by extruding and melt casting are also disclosed.

Abstract: A multi-phase melt cast toilet bar which has at least one interface along a plane perpendicular to the plane formed by the x and y-axis of said bar, and a process of making the bar is described. Each phase, containing a cleansing agent, is reproducibly positioned in the bar to be used simultaneously thereby allowing the user to simultaneously derive benefits from the use of the cleansing agents contained in the bar's layers. The process for making the bar is a continuous one, whereby the molten cleansing agents are simultaneously or separately poured into the mold, simultaneously or separately allowed to harden, and where the mold divider is not removed or removed either after hardening of the adjacent molten cleansing agent but before the pouring of the next molten cleansing agent, or removed while at least one phase remains flowable. The hardened multi-phase toilet bar is finally ejected from the mold.

Abstract: Methods for reducing fluid carryover by microfluidic devices including capillary element and/or fluid motion. Capillary elements coated with hydrophobic or hydrophilic coatings to resist fluid carryover are also provided. Microfluidic device handling systems are additionally included.

Abstract: A bare semiconductor circuit die carrier is provided for use in the test of semiconductor circuits, the carrier, comprising: a substrate defining an opening and an outer perimeter; a multiplicity of I/O pads disposed about the perimeter; an interconnect circuit which includes a composite of a multiplicity of individual electrical conductors which are formed in a polymer dielectric; wherein the interconnect circuit overlays a top surface of the substrate and extends across the opening so as to form a flexible membrane that spans the opening; a multiplicity of die contact pads connected to the conductors are disposed about the flexible membrane with particles deposited on the die contact pads; a fence upstanding from the membrane and sized to receive a test die; a top cap that rests upon the die when the die is received within the fence; a bottom cap that rests against a bottom surface of the substrate; and a fastener for securing the top cap to the bottom cap with the die disposed therebetween.

Abstract: A pumpable, fluid composition of amine oxide, betaine and/or sultaine is prepared with active concentration of about 36-45% of these materials by the addition of alkaline earth or aluminum salts.

Abstract: A solid composition comprisinga. a cleansing effective amount of an anionic surfactant or mixture thereof,b. an alcohol ethoxycarboxylic acid of the formulaR--(OCH.sub.2 CH.sub.2).sub.n --O CH.sub.2 COOHwherein R is an alkyl of an average of about 8 to 20 carbon atoms inclusive and n is a number of 1 to about 20,c. a carbanilide antibacterial agent in antibacterial effective quantities wherein component b is in sufficient quantities to solubilize the carbanilide antibacterial agent.

Abstract: First and second bumps electrically connected at first and second positions along a conductive run borne by a flexible substrate are respectively oriented for contact with a pad of a die under test and a pad of a tester structure. Second and third conductive regions are electrically connected respectively to the power and ground terminals of a power source and an electrical device. The second and third regions are spaced from a first conductive region to filter high-frequency noise components from power and ground potentials provided by the power source.

Abstract: First and second bumps electrically connected at first and second positions along a conductive run borne by a flexible substrate are respectively oriented for contact with a pad of a die under test and a pad of a tester structure. Second and third conductive regions are electrically connected respectively to the power and ground terminals of a power source and an electrical device.

Abstract: An integrated circuit carrier comprising: a substrate defining an opening and an outer perimeter; a multiplicity of I/O pads disposed about the perimeter; an interconnect circuit which includes a composite of a multiplicity of individual electrical conductors which are formed in a polymer dielectric; wherein the interconnect circuit overlays a top surface of the substrate and extends across the opening so as to span the opening; a multiplicity of die contact pads connected to the conductors are disposed about the flexible polymer dielectric with particles deposited on the die contact pads; a polymer dielectric fence upstanding from the membrane and sized to receive an integrated circuit; a top cap that rests upon the integrated circuit when the integrated circuit is received within the fence; a bottom cap that rests against a bottom surface of the substrate; and a fastener for securing the top cap to the bottom cap with the integrated circuit disposed therebetween.

Abstract: An embodiment of the present invention is a system for rinsing and drying items comprising a process chamber for receiving the items; a rinse condenser; a first heater; a vaporizer for vaporizing water and including a second heater; a vacuum system for reducing the pressure within the process chamber; and a valving apparatus for independently coupling the process chamber to the vaporizer and the process chamber to the vacuum system.

Abstract: A dry contact electroplating structure is disclosed. The structure includes a base member for immersion within an electroplating solution. The base member has a central aperture defined by an aperture perimeter formed within the base member. A sealing ring is positioned adjacent to the aperture perimeter. The sealing ring forms a sealing connection with an object to be electroplated. A number of electrical contacts are positioned adjacent to the sealing ring. The electrical contacts form an electrical connection with one side of the object to be electroplated. A lid is positioned on the base member over one side of the central aperture. Thus, the lid protects the electrical contacts and one side of the object to be electroplated, while the other side of the object is exposed to the electroplating solution.

Abstract: A selective plating apparatus having a multipitch centerline feed block for delivering a uniform blade of plating solution to a mask and which provides passageways for the drainage of used electrolyte solution. The delivery of a uniform blade of plating solution to the mask allows the mask to be designed such that it controls both the area of sample to be plated and the pitch of the sample.

Abstract: Apparatus is disclosed for accurately aligning a processing device with respect to a predetermined reference location on semiconductor lead frame. The apparatus is especially suitable for use with a plating head for plating the pads of a lead frame. The apparatus includes a drive motor having a precision lead screw for attachment to the processing device to shift the device through a small distance to accurately position the device with respect to the predetermined reference positions on the lead frame. The drive motor is coupled to a rotary encoder which is rotated in response to the movement of a pin positioned to enter a reference hole in the lead frame. As the lead frame is advanced by an indexing device, the pin enters a reference hole in the lead frame near the end of the travel of the lead frame, causing the rod to rotate the encoder and supply a signal which for comparison with a reference signal.

Abstract: An indexing system adapted to periodically advance a web of metal through a plating line that first advances gently till it engages a hole in the web, then closes clamping members about the web to grasp the web over a distributed region, and only then moves the web at full speed.