Abstract: Optical components and associated methods of manufacturing are provided. An example optical component includes a body defined by an optical interposer substrate and a passivation layer applied to the optical interposer substrate. The optical interposer substrate defines a first surface of the body, and the passivation layer defines a second surface of the body opposite the first surface. The passivation layer includes a metallic shielding element configured to prevent interference between the first surface and the second surface. The optical component further includes an opening extending from the second surface to the optical interposer substrate, the opening defining an optical path through the passivation layer. The optical interposer substrate receives an optical signal from an optical transmitter supported by the second surface via the optical path.

Abstract: Optical components and associated methods of manufacturing are provided. An example optical component includes a body defined by an optical interposer substrate and a passivation layer applied to the optical interposer substrate. The optical interposer substrate defines a first surface of the body, and the passivation layer defines a second surface of the body opposite the first surface. The passivation layer includes a metallic shielding element configured to prevent interference between the first surface and the second surface. The optical component further includes an opening extending from the second surface to the optical interposer substrate, the opening defining an optical path through the passivation layer. The optical interposer substrate receives an optical signal from an optical transmitter supported by the second surface via the optical path.

Abstract: A layout for a vertical-cavity surface-emitting laser (VCSEL) is provided. In an example embodiment, the layout comprises a VCSEL, an etched shape around a mesa of the VCSEL, a signal contact layer deposited on section of the mesa, and a ground contact layer. The ground contact layer comprises three parts and is positioned around a first section of the etched shape. The first part of the ground contact layer is deposited on a second section of the etched shape. The second and third parts of the ground contact layer comprise two legs off of the first part. The two legs are symmetrically positioned about two sides of the signal contact layer to form a ground-signal-ground configuration.

Abstract: An optical coupler and method of assembly are described that provide efficient coupling from the photonic integrated circuit (PIC) waveguide layer to external components, such as optical fibers, VCSELs, photodetectors, and gain blocks, among others. The optical coupler includes a PIC that can be supported by a printed circuit board, an optoelectronic transducer supported by the PIC that can convert between optical signals and corresponding electrical signals, and a coupled waveguide assembly. The coupled waveguide assembly includes a low-index waveguide, a high-index waveguide, and a reflective surface that changes a pathway of the optical signals to direct the optical signals from the optoelectronic transducer into the low-index waveguide or from the low-index waveguide into the optoelectronic transducer.

Abstract: An optical coupler and method of assembly are described that provide efficient coupling from the photonic integrated circuit (PIC) waveguide layer to external components, such as optical fibers, VCSELs, photodetectors, and gain blocks, among others. The optical coupler includes a PIC that can be supported by a printed circuit board, an optoelectronic transducer supported by the PIC that can convert between optical signals and corresponding electrical signals, and a coupled waveguide assembly. The coupled waveguide assembly includes a low-index waveguide, a high-index waveguide, and a reflective surface that changes a pathway of the optical signals to direct the optical signals from the optoelectronic transducer into the low-index waveguide or from the low-index waveguide into the optoelectronic transducer.

Abstract: An printed circuit board (PCB) assembly and method of assembling the same for a high-speed, short-reach communication link are described that provide a mechanism for transmitting radio frequency (RF) waves from one digital electronic component of the PCB assembly to another, where the second digital electronic component is located either on the same PCB assembly or on a second PCB assembly. The assembly includes a PCB having multiple layers and a digital electronic component supported by the PCB. At least one of the layers defines a channel that confines RF waves therein. An RF antenna in communication with the digital electronic component extends into the channel, and the RF antenna transmits RF signals generated by the digital electronic component into the channel as RF waves or receives RF waves via the channel and conveys corresponding RF signals to the digital electronic component.

Abstract: An optical component assembly is provided including a substrate. The assembly includes an optical transmitter configured to transmit an optical signal, an optical receiver configured to receive the optical signal, and an optical waveguide extending between the optical transmitter and the optical receiver. The assembly further includes a frangible region defining a first portion of the substrate and a second portion of the substrate, wherein the frangible region is configured to allow the first portion to be separated from the second portion. The assembly may be configured to be modified from a testing configuration, in which the first portion is integrally connected to the second portion via the frangible region, to an operational configuration, in which the first portion is separated from the second portion such that communication of optical signals between the optical transmitter and the optical receiver is precluded.

Abstract: A vertical cavity surface emitting laser (VCSEL) array is provided. Each tunable VCSEL includes an output coupling mirror; a high reflectivity mirror; an active cavity material structure disposed between the output coupling mirror and the high reflectivity mirror; and a spacer layer disposed between the output coupling mirror and the active cavity material. A tuning cavity is defined within the spacer layer. Each VCSEL further includes a first contact pad and a second contact pad designed to receive a driving voltage; a tuning electrode on a first surface of the output coupling mirror for tuning the emission wavelength to a distinct wavelength.

Abstract: An electro-optical link is provided. In an example embodiment, the electro-optical link includes a number of vertical cavity surface emitting lasers (VCSELs); one or more drivers that operate the VCSELs such that each of the VCSELs selectively emits an optical signal; one or more multiplexers that multiplex a number of optical signals into an optical fiber, each optical signal emitted by one of the VCSELs; and one or more optical fibers. At least two optical signals are multiplexed into each optical fiber of the one or more optical fibers. In some example configurations eight or sixteen optical signals are multiplexed into one optical fiber.

Abstract: A optical assembly and a method of reducing interference using the same may be provided. The optical assembly may include an optical cable and an optical transceiver module. The optical transceiver module may include a socket configured to receive the optical cable, an electro-optical transducer configured to generate an optical signal, and an optical lantern. The optical lantern may include an optical prism that may receive the optical signal via a first surface, disperse the optical signal into a plurality of modes of the optical signal, and output the plurality of modes via a second surface. A mirror may reflect the optical signal from a first direction extending between the first surface and the mirror to a second direction extending between the mirror and the second surface. The optical lantern may direct at least one of the plurality of modes of the optical signal into the optical cable.

Abstract: An internally wireless datacenter rack configured to support datacenter computing equipment is provided. The datacenter rack includes a housing configured to receive a first networking box including a printed circuit board assembly and one or more wireless connectors in electrical communication with the printed circuit board assembly. The housing includes a second networking box including a printed circuit board assembly and one or more wireless connectors in electrical communication with the printed circuit board assembly. The one or more wireless connectors convert between electrical signals and optical signals. The datacenter rack includes a wireless free space region within the housing, and the wireless free space region includes a wireless reflective backplane that allows free space wireless communication between the first networking box and the second networking box.

Abstract: A waveguide having a gradient-index (GRIN) waveguide lateral coupler is provided. In an example embodiment, the waveguide comprises an active region. The refractive index profile of the active region is non-constant.

Abstract: A vertical-cavity surface-emitting laser (VSCEL) and method for producing a VCSEL are described, the VCSEL including an undercut active region. The active region of the VCSEL is undercut relative to current-spreading layers of the VCSEL, such that a width of a tunnel junction of the VCSEL overgrown by a current spreading layer is less than a width of an active region of the VCSEL, and a width of the active region of the VCSEL is less than a width of the overgrown current-spreading layer, such that the VCSEL including the undercut active region is configured to transmit data at speeds greater than 25 gigabits/second.

Abstract: An method for characterizing a modulator for fabricating a silicon photonics circuit and an apparatus (e.g., a silicon photonics wafer) made via the method are described. The method includes determining an absorption spectrum of a modulator and determining, based at least on the determined absorption spectrum, an operational bandwidth of the modulator. The method further includes selecting a laser for coupling with the modulator using the operational bandwidth of the modulator. In this way, the laser is selected such that it has an emission bandwidth that corresponds to the operational bandwidth of the modulator.

Abstract: An opto-mechanical coupler and corresponding method of manufacture are provided. The coupler may include a body defining a bottom surface, a receiving surface, and a reflective surface. The reflective surface may redirect optical signals between a first direction and a second direction. The receiving surface may position one or more optical fibers along the second direction such that an optical signal from the plurality of optoelectronic transceivers may be directed into the one or more optical fibers or an optical signal received from the one or more optical fibers may be directed into the plurality of the optoelectronic transceivers. The receiving surface may also define grooves to locate each optical fiber at a height relative to a first optical path in the second direction.

Abstract: An optoelectronic device includes an optoelectronic die, a laser die, and electrical interconnects. The optoelectronic device has a surface. A trench having first and second walls and a floor is formed in the surface, and an electrically conductive layer extends from the floor, via the first wall, to the surface. The laser die includes first and second electrodes and a laser output aperture. The laser die is mounted in the trench and is configured to emit a laser beam. The first electrode is coupled to the electrically conductive layer and the laser output aperture is mechanically aligned with a waveguide that extends from the second wall. The interconnects are formed on the second electrode of the laser die and on selected locations on the surface of the optoelectronic die. The interconnects are coupled to a substrate, and are configured to conduct electrical signals between the optoelectronic die and the substrate.

Abstract: An internally wireless datacenter rack configured to support datacenter computing equipment is provided. The datacenter rack includes a housing configured to receive a first networking box including a printed circuit board assembly and one or more wireless connectors in electrical communication with the printed circuit board assembly. The housing includes a second networking box including a printed circuit board assembly and one or more wireless connectors in electrical communication with the printed circuit board assembly. The one or more wireless connectors convert between electrical signals and optical signals. The datacenter rack includes a wireless free space region within the housing, and the wireless free space region includes a wireless reflective backplane that allows free space wireless communication between the first networking box and the second networking box.

Abstract: A transducer reliability testing and VCSEL failure prediction method are provided. The method includes applying a testing temperature and a constant current to a VCSEL for a testing time. The method monitors a forward voltage of the VCSEL and determines if a first change in forward voltage is above a first predetermined threshold over the testing time and if a second change in forward voltage is above a second predetermined threshold over a portion of the testing time. The method determines failure of the VCSEL if either of these predetermined thresholds are exceeded. The method determines passage of the VCSEL if the first change in the forward voltage and the second change in the forward voltage are both below the first predetermined threshold and the second predetermined threshold, respectively.

Abstract: A waveguide having a gradient-index (GRIN) waveguide lateral coupler is provided. In an example embodiment, the waveguide comprises an active region. The refractive index profile of the active region is non-constant.

Abstract: An electro-optic transceiver module, method of manufacturing, and method of transmitting signals are provided that allow multiple optical signals at different wavelengths (e.g., according to CWDM) to be combined for transmission via a number of optical fibers that is smaller than the number of electrical channels according to which the optical signals were generated. Thus, CWDM may be used in connection with lower-cost VCSEL technology (e.g., as opposed to higher-cost edge-emitting lasers) by providing for wavelength compensation at the VCSEL driver to offset any changes in wavelength that may have otherwise occurred at the VCSELs. In particular, a microcontroller of the electro-optic transceiver module correlates a monitored temperature of the VCSELs to an actual wavelength of the corresponding optical signals transmitted by the respective VCSELS and determined an adjustment in a current supplied by the VCSEL driver to each VCSEL to achieve more precise and consistent wavelengths at the VCSELs.