Abstract: A layout for a vertical-cavity surface-emitting laser (VCSEL) is provided. In an example embodiment, the layout comprises a VCSEL, an etched shape around a mesa of the VCSEL, a signal contact layer deposited on section of the mesa, and a ground contact layer. The ground contact layer comprises three parts and is positioned around a first section of the etched shape. The first part of the ground contact layer is deposited on a second section of the etched shape. The second and third parts of the ground contact layer comprise two legs off of the first part. The two legs are symmetrically positioned about two sides of the signal contact layer to form a ground-signal-ground configuration.

Abstract: A vertical-cavity surface-emitting laser (VSCEL) and method for producing a VCSEL are described, the VCSEL including an undercut active region. The active region of the VCSEL is undercut relative to current-spreading layers of the VCSEL, such that a width of a tunnel junction of the VCSEL overgrown by a current spreading layer is less than a width of an active region of the VCSEL, and a width of the active region of the VCSEL is less than a width of the overgrown current-spreading layer, such that the VCSEL including the undercut active region is configured to transmit data at speeds greater than 25 gigabits/second.

Abstract: An optical component assembly is provided including a substrate. The assembly includes an optical transmitter configured to transmit an optical signal, an optical receiver configured to receive the optical signal, and an optical waveguide extending between the optical transmitter and the optical receiver. The assembly further includes a frangible region defining a first portion of the substrate and a second portion of the substrate, wherein the frangible region is configured to allow the first portion to be separated from the second portion. The assembly may be configured to be modified from a testing configuration, in which the first portion is integrally connected to the second portion via the frangible region, to an operational configuration, in which the first portion is separated from the second portion such that communication of optical signals between the optical transmitter and the optical receiver is precluded.

Abstract: An method for characterizing a modulator for fabricating a silicon photonics circuit and an apparatus (e.g., a silicon photonics wafer) made via the method are described. The method includes determining an absorption spectrum of a modulator and determining, based at least on the determined absorption spectrum, an operational bandwidth of the modulator. The method further includes selecting a laser for coupling with the modulator using the operational bandwidth of the modulator. In this way, the laser is selected such that it has an emission bandwidth that corresponds to the operational bandwidth of the modulator.

Abstract: An printed circuit board (PCB) assembly and method of assembling the same for a high-speed, short-reach communication link are described that provide a mechanism for transmitting radio frequency (RF) waves from one digital electronic component of the PCB assembly to another, where the second digital electronic component is located either on the same PCB assembly or on a second PCB assembly. The assembly includes a PCB having multiple layers and a digital electronic component supported by the PCB. At least one of the layers defines a channel that confines RF waves therein. An RF antenna in communication with the digital electronic component extends into the channel, and the RF antenna transmits RF signals generated by the digital electronic component into the channel as RF waves or receives RF waves via the channel and conveys corresponding RF signals to the digital electronic component.

Abstract: An opto-mechanical coupler and corresponding method are provided. The coupler may include a first end and a second end configured to receive optical fibers and a top surface and bottomed surface defining a through hole extending between the top and bottom surfaces. The coupler may include a reflective surface that redirects the optical signals between a first direction and a second direction substantially perpendicular to the first direction. The coupler may position one or more optical fibers along a second direction such that an optical signal from the plurality of optoelectronic transceivers is directed into one or more optical fibers or an optical signal from the one or more optical fibers is directed into a plurality of the optoelectronic transceivers, with the coupler accommodating different diameters of optical fiber including POF, SMF, and/or MMF fiber.

Abstract: A optical assembly and a method of reducing interference using the same may be provided. The optical assembly may include an optical cable and an optical transceiver module. The optical transceiver module may include a socket configured to receive the optical cable, an electro-optical transducer configured to generate an optical signal, and an optical lantern. The optical lantern may include an optical prism that may receive the optical signal via a first surface, disperse the optical signal into a plurality of modes of the optical signal, and output the plurality of modes via a second surface. A mirror may reflect the optical signal from a first direction extending between the first surface and the mirror to a second direction extending between the mirror and the second surface. The optical lantern may direct at least one of the plurality of modes of the optical signal into the optical cable.

Abstract: An apparatus and method of assembly are described that provide an improved printed circuit board (PCB) assembly for an electro-optical interface, where more accurate positioning and alignment of electro-optical components can be achieved in an active part of the PCB assembly that is used for the electro-optical interface to meet tighter tolerances in an easier and more cost efficient manner. In particular, a photonic integrated circuit (PIC) is received in a cavity defined in a PCB that includes conductive elements for transmitting electrical signals. An optoelectronic transducer is connected to the PIC to convert between the optical signals and the corresponding electrical signals, and an optical coupler is secured to the optoelectronic transducer and supported by the PIC and/or PCB, where the optical coupler is configured to transmit the optical signals between the optoelectronic transducer and an optical fiber.

Abstract: An apparatus and method of assembly are described that provide improved mechanisms for cooling an optoelectronic transducer in a fiber optic system. The apparatus includes a thermoelectric cooler (TEC) secured to the optoelectronic transducer for removing heat from the optoelectronic transducer in response to instructions from a TEC driver, as well as a microcontroller electrically connected to the TEC driver for monitoring temperature and communicating with the TEC driver to selectively activate and deactivate the TEC at least partially based on the monitored temperature and/or other measured/detected data to effect a more efficient cooling mechanism for optoelectronic transducers, such as VCSELs. In addition, the user may be able to configure the system to maintain the optoelectronic transducer within a user-defined range of temperatures.

Abstract: An optoelectronic configuration method is provided. The method includes determining a baseline link budget value for the VCSEL. The method applies a constant input value to a VCSEL and monitors the output of the VCSEL. The method calculates a first link budget value from the inputs and outputs of the VCSEL and compares the first link budget value with the baseline link budget value to determine either a pass state of the VCSEL or a fail state of the VCSEL. If a fail state of the VCSEL is determined, the method may iteratively apply modified inputs to the VCSEL until the desired relationship between the first link budget value and the baseline link budget value is obtained.

Abstract: An optoelectronic device includes an optoelectronic die, a laser die, and electrical interconnects. The optoelectronic device has a surface. A trench having first and second walls and a floor is formed in the surface, and an electrically conductive layer extends from the floor, via the first wall, to the surface. The laser die includes first and second electrodes and a laser output aperture. The laser die is mounted in the trench and is configured to emit a laser beam. The first electrode is coupled to the electrically conductive layer and the laser output aperture is mechanically aligned with a waveguide that extends from the second wall. The interconnects are formed on the second electrode of the laser die and on selected locations on the surface of the optoelectronic die. The interconnects are coupled to a substrate, and are configured to conduct electrical signals between the optoelectronic die and the substrate.

Abstract: A transducer reliability testing and VCSEL failure prediction method are provided. The method includes applying a testing temperature and a constant current to a VCSEL for a testing time. The method monitors a forward voltage of the VCSEL and determines if a first change in forward voltage is above a first predetermined threshold over the testing time and if a second change in forward voltage is above a second predetermined threshold over a portion of the testing time. The method determines failure of the VCSEL if either of these predetermined thresholds are exceeded. The method determines passage of the VCSEL if the first change in the forward voltage and the second change in the forward voltage are both below the first predetermined threshold and the second predetermined threshold, respectively.

Abstract: An opto-mechanical coupler and corresponding method of manufacture are provided. The coupler may include a body defining a bottom surface, a receiving surface, and a reflective surface. The reflective surface may redirect optical signals between a first direction and a second direction. The receiving surface may position one or more optical fibers along the second direction such that an optical signal from the plurality of optoelectronic transceivers may be directed into the one or more optical fibers or an optical signal received from the one or more optical fibers may be directed into the plurality of the optoelectronic transceivers. The receiving surface may also define grooves to locate each optical fiber at a height relative to a first optical path in the second direction.

Abstract: An opto-mechanical coupler and corresponding method are provided. The coupler may include a first end and a second end configured to receive optical fibers and a top surface and bottomed surface defining a through hole extending between the top and bottom surfaces. The coupler may include a reflective surface that redirects the optical signals between a first direction and a second direction substantially perpendicular to the first direction. The coupler may position one or more optical fibers along a second direction such that an optical signal from the plurality of optoelectronic transceivers is directed into one or more optical fibers or an optical signal from the one or more optical fibers is directed into a plurality of the optoelectronic transceivers, with the coupler accommodating different diameters of optical fiber including POF, SMF, and/or MMF fiber.

Abstract: An apparatus and method of assembly are described that provide an improved printed circuit board (PCB) assembly for an electro-optical interface, where more accurate positioning and alignment of electro-optical components can be achieved in an active part of the PCB assembly that is used for the electro-optical interface to meet tighter tolerances in an easier and more cost efficient manner. In particular, a photonic integrated circuit (PIC) is received in a cavity defined in a PCB that includes conductive elements for transmitting electrical signals. An optoelectronic transducer is connected to the PIC to convert between the optical signals and the corresponding electrical signals, and an optical coupler is secured to the optoelectronic transducer and supported by the PIC and/or PCB, where the optical coupler is configured to transmit the optical signals between the optoelectronic transducer and an optical fiber.

Abstract: An optical apparatus, comprising a Silicon Photonics (SiP) device, with multiple optical waveguides and an array of collimating lenses, configured to receive light from the multiple optical waveguides in paths not including optical fibers and to collimate the light of the multiple optical waveguides into collimated beams. A receptacle is configured to receive an external optical device in an orientation aligned with the collimated beams from the array of collimating lenses.

Abstract: An electro-optic transceiver module, method of manufacturing, and method of transmitting signals are provided that allow multiple optical signals at different wavelengths (e.g., according to CWDM) to be combined for transmission via a number of optical fibers that is smaller than the number of electrical channels according to which the optical signals were generated. Thus, CWDM may be used in connection with lower-cost VCSEL technology (e.g., as opposed to higher-cost edge-emitting lasers) by providing for wavelength compensation at the VCSEL driver to offset any changes in wavelength that may have otherwise occurred at the VCSELs. In particular, a microcontroller of the electro-optic transceiver module correlates a monitored temperature of the VCSELs to an actual wavelength of the corresponding optical signals transmitted by the respective VCSELS and determined an adjustment in a current supplied by the VCSEL driver to each VCSEL to achieve more precise and consistent wavelengths at the VCSELs.

Abstract: An apparatus and method of assembly are described that provide improved mechanisms for cooling an optoelectronic transducer in a fiber optic system. The apparatus includes a thermoelectric cooler (TEC) secured to the optoelectronic transducer for removing heat from the optoelectronic transducer in response to instructions from a TEC driver, as well as a microcontroller electrically connected to the TEC driver for monitoring temperature and communicating with the TEC driver to selectively activate and deactivate the TEC at least partially based on the monitored temperature and/or other measured/detected data to effect a more efficient cooling mechanism for optoelectronic transducers, such as VCSELs. In addition, the user may be able to configure the system to maintain the optoelectronic transducer within a user-defined range of temperatures.

Abstract: A reconfigurable and redundant electro-optical connector and corresponding method are provided. The connector may include a first plurality of transducers in communication with a first port and a second plurality of transducers in communication with a second port, the first port and the first transducers defining a first channel and the second port and the second transducers defining a second channel. The connector may include a selective combiner to combine the first optical signals and the second optical signals, and a controller in communication with each of the transducers. The controller may transmit at least a first portion of a first datalink on at least the first channel in a first configuration. The controller may redistribute the first portion of the first datalink onto at least the second channel in a second configuration.

Abstract: An optical apparatus, comprising a Silicon Photonics (SiP) device, with multiple optical waveguides and an array of collimating lenses, configured to receive light from the multiple optical waveguides in paths not including optical fibers and to collimate the light of the multiple optical waveguides into collimated beams. A receptacle is configured to receive an external optical device in an orientation aligned with the collimated beams from the array of collimating lenses.