Patents by Inventor Ta-Ko Chuang
Ta-Ko Chuang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10017849Abstract: A method of forming a hermetic barrier layer comprises sputtering a thin film from a sputtering target, wherein the sputtering target includes a sputtering material such as a low Tg glass, a precursor of a low Tg glass, or an oxide of copper or tin. During the sputtering, the formation of defects in the barrier layer are constrained to within a narrow range and the sputtering material is maintained at a temperature of less than 200° C.Type: GrantFiled: March 15, 2013Date of Patent: July 10, 2018Assignee: Corning IncorporatedInventors: Robert Alan Bellman, Ta-Ko Chuang, Robert George Manley, Mark Alejandro Quesada, Paul Arthur Sachenik
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Publication number: 20170218503Abstract: A method of forming a hermetic barrier layer comprises sputtering a thin film from a sputtering target, wherein the sputtering target includes a sputtering material such as a low Tg glass, a precursor of a low Tg glass, or an oxide of copper or tin. During the sputtering, the formation of defects in the barrier layer are constrained to within a narrow range and the sputtering material is maintained at a temperature of less than 200° C.Type: ApplicationFiled: February 14, 2017Publication date: August 3, 2017Inventors: Robert Alan Bellman, Ta-Ko Chuang, Robert George Manley, Mark Alejandro Quesada, Paul Arthur Sachenik
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Patent number: 9722084Abstract: There is disclosed a method for chemically treating a display glass substrate by treating at least one surface of the glass substrate with a heated solution containing HCl to form a depletion layer at the surface and under the surface of the glass substrate. The disclosure also relates to display glass substrates containing the depletion layer made by the disclosed process. In addition, the disclosure relates to methods of making thin-film transistors (“TFTs”) on these display glass substrates by depositing a Si layer directly on the chemically treated surface of the glass substrate, and annealing the Si layer to form polycrystalline silicon.Type: GrantFiled: April 25, 2014Date of Patent: August 1, 2017Assignee: Corning IncorporatedInventors: Ta-Ko Chuang, Yunfeng Gu, Robert George Manley
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Patent number: 9321680Abstract: A method for fabricating a high-density array of holes in glass comprises providing a glass sheet having a front surface and irradiating the glass sheet with a laser beam so as to produce open holes extending into the glass sheet from the front surface of the glass sheet. The beam creates thermally induced residual stress within the glass around the holes, and after irradiating, the glass sheet is annealed to eliminate or reduce thermal stress caused by the step of irradiating. The glass sheet is then etched to produce the final hole size. Preferably, the glass sheet is also annealed before the step of irradiating, at sufficiently high temperature for a sufficient time to render the glass sheet dimensionally stable during the step of annealing after irradiating.Type: GrantFiled: May 30, 2012Date of Patent: April 26, 2016Assignee: CORNING INCORPORATEDInventors: Ta-Ko Chuang, Daniel Ralph Harvey, Alexander Mikhailovich Streltsov
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Publication number: 20160071981Abstract: There is disclosed a method for chemically treating a display glass substrate by treating at least one surface of the glass substrate with a heated solution containing HCl to form a depletion layer at the surface and under the surface of the glass substrate. The disclosure also relates to display glass substrates containing the depletion layer made by the disclosed process. In addition, the disclosure relates to methods of making thin-film transistors (“TFTs”) on these display glass substrates by depositing a Si layer directly on the chemically treated surface of the glass substrate, and annealing the Si layer to form polycrystalline silicon.Type: ApplicationFiled: April 25, 2014Publication date: March 10, 2016Applicant: Corning IncorporatedInventors: Ta-Ko Chuang, Yunfeng Gu, Robert George Manley
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Patent number: 8772875Abstract: A semiconductor-on-glass substrate having a relatively stiff (e.g. relatively high Young's modulus of 125 or higher) stiffening layer or layers placed between the silicon film and the glass in order to eliminate the canyons and pin holes that otherwise form in the surface of the transferred silicon film during the ion implantation thin film transfer process. The new stiffening layer may be formed of a material, such as silicon nitride, that also serves as an efficient barrier against penetration of sodium and other harmful impurities from the glass substrate into the silicon film.Type: GrantFiled: August 22, 2013Date of Patent: July 8, 2014Assignees: Corning Incorporated, SOITECInventors: Nadia Ben Mohamed, Ta-ko Chuang, Jeffrey Scott Cites, Daniel Delprat, Alexander Usenko
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Publication number: 20140144772Abstract: A method of forming a hermetic barrier layer comprises sputtering a thin film from a sputtering target, wherein the sputtering target includes a sputtering material such as a low Tg glass, a precursor of a low Tg glass, or an oxide of copper or tin. During the sputtering, the formation of defects in the barrier layer are constrained to within a narrow range and the sputtering material is maintained at a temperature of less than 200° C.Type: ApplicationFiled: March 15, 2013Publication date: May 29, 2014Inventors: Robert Alan Bellman, Ta-Ko Chuang, Robert George Manley, Mark Alejandro Quesada, Paul Arthur Sachenik
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Publication number: 20140116091Abstract: A method for fabricating a high-density array of holes in glass comprises providing a glass sheet having a front surface and irradiating the glass sheet with a laser beam so as to produce open holes extending into the glass sheet from the front surface of the glass sheet. The beam creates thermally induced residual stress within the glass around the holes, and after irradiating, the glass sheet is annealed to eliminate or reduce thermal stress caused by the step of irradiating. The glass sheet is then etched to produce the final hole size. Preferably, the glass sheet is also annealed before the step of irradiating, at sufficiently high temperature for a sufficient time to render the glass sheet dimensionally stable during the step of annealing after irradiating.Type: ApplicationFiled: May 30, 2012Publication date: May 1, 2014Inventors: Ta-Ko Chuang, Daniel Ralph Harvey, Alexander Mikhailovich Streltsov
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Publication number: 20130341756Abstract: A semiconductor-on-glass substrate having a relatively stiff (e.g. relatively high Young's modulus of 125 or higher) stiffening layer or layers placed between the silicon film and the glass in order to eliminate the canyons and pin holes that otherwise form in the surface of the transferred silicon film during the ion implantation thin film transfer process. The new stiffening layer may be formed of a material, such as silicon nitride, that also serves as an efficient barrier against penetration of sodium and other harmful impurities from the glass substrate into the silicon film.Type: ApplicationFiled: August 22, 2013Publication date: December 26, 2013Applicants: SOITEC, CORNING INCORPORATEDInventors: Nadia Ben Mohamed, Ta-Ko Chuang, Jeffrey Scott Cites, Daniel Delprat, Alexander Usenko
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Patent number: 8557679Abstract: A process for preparing a surface of a material that is not bondable to make it bondable to the surface of another material. A non-bondable surface of a semiconductor wafer is treated with oxygen plasma to oxidize the surface of the wafer and make the surface smoother, hydrophilic and bondable to the surface of another substrate, such as a glass substrate. The semiconductor wafer may have a barrier layer thereon formed of a material, such as SixNy or SiNxOy that is not bondable to another substrate, such as a glass substrate. In which case, the oxygen plasma treatment converts the surface of the barrier layer to oxide, such as SiO2, smoothing the surface and making the surface hydrophilic and bondable to the surface of another substrate, such as a glass substrate.Type: GrantFiled: June 30, 2010Date of Patent: October 15, 2013Assignee: Corning IncorporatedInventors: Ta Ko Chuang, Alex Usenko
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Patent number: 8518799Abstract: A process of making semiconductor-on-glass substrates having a relatively stiff (e.g. relatively high Young's modulus of 125 or higher) stiffening layer between the silicon film and the glass in an ion implantation thin film transfer process by depositing a stiffening layer or layers on one of the donor wafer or the glass substrate in order to eliminate the canyons and pin holes that otherwise form in the surface of the transferred silicon film during the thin film transfer process. The new stiffening layer may be formed of a material, such as silicon nitride, that also serves as an efficient barrier against penetration of sodium and other harmful impurities from the glass substrate into the silicon film.Type: GrantFiled: December 14, 2012Date of Patent: August 27, 2013Assignees: Corning Incorporated, S.O.I TEC Silicon on Insulator TechnologiesInventors: Nadia Ben Mohamed, Ta-Ko Chuang, Jeffrey Scott Cites, Daniel Delprat, Alex Usenko
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Publication number: 20130130473Abstract: A semiconductor-on-glass substrate having a relatively stiff (e.g. relatively high Young's modulus of 125 or higher) stiffening layer or layers placed between the silicon film and the glass in order to eliminate the canyons and pin holes that otherwise form in the surface of the transferred silicon film during the ion implantation thin film transfer process. The new stiffening layer may be formed of a material, such as silicon nitride, that also serves as an efficient barrier against penetration of sodium and other harmful impurities from the glass substrate into the silicon film.Type: ApplicationFiled: December 14, 2012Publication date: May 23, 2013Inventors: Nadia Ben Mohamed, Ta-Ko Chuang, Jeffrey Scott Cites, Daniel Delprat, Alex Usenko
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Patent number: 8357974Abstract: A semiconductor-on-glass substrate having a relatively stiff (e.g. relatively high Young's modulus of 125 or higher) stiffening layer or layers placed between the silicon film and the glass in order to eliminate the canyons and pin holes that otherwise form in the surface of the transferred silicon film during the ion implantation thin film transfer process. The new stiffening layer may be formed of a material, such as silicon nitride, that also serves as an efficient barrier against penetration of sodium and other harmful impurities from the glass substrate into the silicon film.Type: GrantFiled: June 30, 2010Date of Patent: January 22, 2013Assignees: Corning Incorporated, SOITECInventors: Nadia Ben Mohamed, Ta Ko Chuang, Jeffrey Scott Cites, Daniel Delprat, Alex Usenko
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Publication number: 20120001293Abstract: A semiconductor-on-glass substrate having a relatively stiff (e.g. relatively high Young's modulus of 125 or higher) stiffening layer or layers placed between the silicon film and the glass in order to eliminate the canyons and pin holes that otherwise form in the surface of the transferred silicon film during the ion implantation thin film transfer process. The new stiffening layer may be formed of a material, such as silicon nitride, that also serves as an efficient barrier against penetration of sodium and other harmful impurities from the glass substrate into the silicon film.Type: ApplicationFiled: June 30, 2010Publication date: January 5, 2012Inventors: Nadia Ben Mohamed, Ta Ko Chuang, Jeffrey Scott Cites, Daniel Delprat, Alex Usenko
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Publication number: 20120003813Abstract: A process for preparing a surface of a material that is not bondable to make it bondable to the surface of another material. A non-bondable surface of a semiconductor wafer is treated with oxygen plasma to oxidize the surface of the wafer and make the surface smoother, hydrophilic and bondable to the surface of another substrate, such as a glass substrate. The semiconductor wafer may have a barrier layer thereon formed of a material, such as SixNy or SiNxOy that is not bondable to another substrate, such as a glass substrate. In which case, the oxygen plasma treatment converts the surface of the barrier layer to oxide, such as SiO2, smoothing the surface and making the surface hydrophilic and bondable to the surface of another substrate, such as a glass substrate.Type: ApplicationFiled: June 30, 2010Publication date: January 5, 2012Inventors: Ta Ko Chuang, Alex Usenko
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Patent number: 7145172Abstract: A thin film transistor array substrate of a thin film transistor liquid crystal display (TFT-LCD) is provided. The gate dielectric layer of the TFT includes a silicon nitride layer, a dielectric layer and a silicon nitride layer, and the etching selectivity of the amorphous silicon layer over the dielectric layer is not less than about 5.0. Therefore, the dielectric layer can be an etching stop layer when doped and undoped amorphous silicon layers are etched to form source/drain stacked layers or a conductive layer is etched to form a gate on the gate dielectric layer. Hence, the dielectric layer thickness can be controlled, and thereby the capacitance of the storage capacitor can be controlled.Type: GrantFiled: September 2, 2004Date of Patent: December 5, 2006Assignee: Hannstar Display CorporationInventors: Chih-Yu Peng, Wei-Chuan Lin, Chian-Chih Hsiao, Ta-Ko Chuang, Chun-Hung Chu, Chih-Lung Lin, Chin-Mao Lin
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Patent number: 7087469Abstract: A method of controlling the capacitance of a thin film transistor liquid crystal display (TFT-LCD) storage capacitor is disclosed. In certain embodiments, the method includes i) forming a silicon island and a bottom electrode on the transparent substrate, the silicon island having an undoped region located on the central portion, and two doped regions respectively located on both sides, ii) forming a first silicon nitride layer on the transparent substrate, and iii) forming a stacked layer comprising a second silicon nitride layer and a conductive layer on the undoped region of the silicon island, and the first conductive layer of the stacked layer serving as a gate of a thin film transistor, wherein an etching selectivity ratio of the conductive layer over the dielectric layer is not less than about 5.0.Type: GrantFiled: September 3, 2004Date of Patent: August 8, 2006Assignee: Hannstar Display Corp.Inventors: Chih-Yu Peng, Wei-Chuan Lin, Chian-Chih Hsiao, Ta-Ko Chuang, Chun-Hung Chu, Chih-Lung Lin, Chin-Mao Lin
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Patent number: 6953715Abstract: A method of controlling the capacitance of a thin film transistor liquid crystal display (TFT-LCD) storage capacitor is disclosed. In certain embodiments, the method includes i) forming an undoped amorphous silicon layer on a silicon nitride layer, ii) forming an etching mask on the undoped amorphous silicon layer, and iii) forming two doped amorphous silicon layers on portion of the undoped amorphous silicon layer and the etching mask, the two doped amorphous silicon layers being spaced apart and located on either side of the gate, wherein an etching selectivity ratio of the undpoed and doped amorphous silicon layers over the dielectric layer being not less than about 5.0.Type: GrantFiled: September 3, 2004Date of Patent: October 11, 2005Assignee: HannStar Display CorporationInventors: Chih-Yu Peng, Wei-Chuan Lin, Chian-Chih Hsiao, Ta-Ko Chuang, Chun-Hung Chu, Chih-Lung Lin, Chin-Mao Lin
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Publication number: 20050037533Abstract: A method of controlling the capacitance of a thin film transistor liquid crystal display (TFT-LCD) storage capacitor is disclosed. In certain embodiments, the method includes i) forming an undoped amorphous silicon layer on a silicon nitride layer, ii) forming an etching mask on the undoped amorphous silicon layer, and iii) forming two doped amorphous silicon layers on portion of the undoped amorphous silicon layer and the etching mask, the two doped amorphous silicon layers being spaced apart and located on either side of the gate, wherein an etching selectivity ratio of the undpoed and doped amorphous silicon layers over the dielectric layer being not less than about 5.0.Type: ApplicationFiled: September 3, 2004Publication date: February 17, 2005Inventors: Chih-Yu Peng, Wei-Chuan Lin, Chian-Chih Hsiao, Ta-Ko Chuang, Chun-Hung Chu, Chih-Lung Lin, Chin-Mao Lin
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Publication number: 20050032263Abstract: A method of controlling the capacitance of a thin film transistor liquid crystal display (TFT-LCD) storage capacitor is disclosed. In certain embodiments, the method includes i) forming a silicon island and a bottom electrode on the transparent substrate, the silicon island having an undoped region located on the central portion, and two doped regions respectively located on both sides, ii) forming a first silicon nitride layer on the transparent substrate, and iii) forming a stacked layer comprising a second silicon nitride layer and a conductive layer on the undoped region of the silicon island, and the first conductive layer of the stacked layer serving as a gate of a thin film transistor, wherein an etching selectivity ratio of the conductive layer over the dielectric layer is not less than about 5.0.Type: ApplicationFiled: September 3, 2004Publication date: February 10, 2005Inventors: Chih-Yu Peng, Wei-Chuan Lin, Chian-Chih Hsiao, Ta-Ko Chuang, Chun-Hung Chu, Chih-Lung Lin, Chin-Mao Lin