Abstract: A chip package structure includes a substrate, at least two chips, a plurality of first pads, a plurality of first micro bumps, and a bridging element. The substrate has a first surface and a second surface opposite to the first surface. The two chips are disposed on the first surface of the substrate and are horizontally adjacent to each other. Each chip has an active surface. The first pads are disposed on the active surface of each of the chips. The first micro bumps are disposed on the first pads and have the same size. The bridging element is disposed on the first micro bumps such that one of the chips is electrically connected to another of the chips through the first pads, the first micro bumps, and the bridging element.

Abstract: A package structure includes a redistribution structure, a chip, one or more structural reinforcing elements, and a protective layer. The redistribution structure includes a first circuit layer and a second circuit layer disposed over the first circuit layer. The first circuit layer is electrically connected to the second circuit layer. The chip is disposed over the redistribution structure and electrically connected to the second circuit layer. The one or more structural reinforcing elements are disposed over the redistribution structure. The structural reinforcing element has a Young's modulus in a range of 30 to 200 GPa. The protective layer overlays the chip and a sidewall of the structural reinforcing element.

Abstract: A package structure includes a redistribution structure, a chip, an inner conductive reinforcing element, and a protective layer. The redistribution structure includes a first circuit layer and a second circuit layer disposed over the first circuit layer. The first circuit layer is electrically connected to the second circuit layer. The chip is disposed over the redistribution structure and electrically connected to the second circuit layer. The inner conductive reinforcing element is disposed over the redistribution structure. The inner conductive reinforcing element has a Young's modulus in a range of from 30 to 200 GPa. The protective layer covers the chip and a sidewall of an opening of the inner conductive reinforcing element.

Abstract: A carrier structure includes a carrier having at least one through hole penetrating the carrier and a build-up circuit layer located on the carrier and including at least one first circuit layer, at least one first dielectric layer, a second circuit layer, a second dielectric layer, and a plurality of conductive vias. The first circuit layer is located on a first surface of the carrier and includes at least one first pad disposed relative to the through hole. The first dielectric layer is located on the first circuit layer. The second circuit layer is located on the first dielectric layer and includes at least one second pad. The second dielectric layer is located on the second circuit layer and includes at least one opening exposing the second pad. The conductive vias penetrate the first dielectric layer and are electrically connected to the first and second circuit layers.

Abstract: A circuit board including an interconnect substrate and a multilayer structure is provided. The interconnect substrate includes a core layer and a conductive structure disposed on the core layer. The multilayer structure is disposed on the conductive structure. The multilayer structure includes a plurality of dielectric layers and a plurality of circuit structures. The circuit structures are disposed in the dielectric layers. A topmost layer in the circuit structures is exposed to the dielectric layers to be in contact with the conductive structure. A pattern of the topmost layer in the circuit structures and a pattern of a top surface of the conductive structure are engaged with each other.

Abstract: A manufacturing method of a light emitting device package structure is provided. The method includes following operations: (i) providing a circuit redistribution structure; (ii) providing a first substrate; (iii) forming a circuit layer structure over the first substrate, wherein the circuit layer structure includes a first circuit layer; (iv) before or after operation (iii), placing a light emitting device between the first substrate and the circuit layer structure or over the circuit layer structure, wherein the light emitting device is electrically connected with the first circuit layer; and (v) placing the circuit redistribution structure over the light emitting device, wherein the circuit redistribution structure includes a first redistribution layer, a second redistribution layer, and a chip, and the first redistribution layer includes a second circuit layer and a conductive contact that contacts the second circuit layer.

Abstract: A touch-sensing display panel includes a substrate, a first circuit layer, a LED chip, a second circuit layer, a blocking wall, a second wire, and a third wire. The first circuit layer is on the substrate, including at least one first electrode, and a first wire. The LED chip is on and electrically connected to the first electrode. The second circuit layer is on the first circuit layer, including a second electrode, a touch sensing line, and a touch driving line. The blocking wall, the second wire, and the third wire are on the second circuit layer. The second wire extends to an inner sidewall and a top surface of the blocking wall, and electrically connects to the touch sensing line. The third wire extends to an outer sidewall of the blocking wall, and electrically connects to the touch driving line.

Abstract: A package structure includes a first substrate, a second substrate, a plurality of conductive pillars and an adhesive layer. The first substrate includes a plurality of vias and a plurality of pads. The pads are disposed on the first substrate, and fill the vias. The second substrate is disposed opposite to the first substrate. Each conductive pillar electrically connects each pad and the second substrate, and the adhesive layer fills the gaps between the conductive pillars. A bonding method of the package structure is also provided.

Abstract: A package structure includes a redistribution structure, a chip, one or more structural reinforcing elements, and a protective layer. The redistribution structure includes a first circuit layer and a second circuit layer disposed over the first circuit layer. The first circuit layer is electrically connected to the second circuit layer. The chip is disposed over the redistribution structure and electrically connected to the second circuit layer. The one or more structural reinforcing elements are disposed over the redistribution structure. The structural reinforcing element has a Young's modulus in a range of 30 to 200 GPa. The protective layer overlays the chip and a sidewall of the structural reinforcing element.

Abstract: A manufacturing method of a light emitting device package structure is provided. The method includes following operations: (i) providing a circuit redistribution structure; (ii) providing a first substrate; (iii) forming a circuit layer structure over the first substrate, wherein the circuit layer structure includes a first circuit layer; (iv) before or after operation (iii), placing a light emitting device between the first substrate and the circuit layer structure or over the circuit layer structure, wherein the light emitting device is electrically connected with the first circuit layer; and (v) placing the circuit redistribution structure over the light emitting device, wherein the circuit redistribution structure includes a first redistribution layer, a second redistribution layer, and a chip, and the first redistribution layer includes a second circuit layer and a conductive contact that contacts the second circuit layer.

Abstract: The present invention provides a surgical navigation system including a positioning device, a processing device and a display device. The positioning device includes an auxiliary positioning assembly capable of wearing or fixing around a patient's affected part and an optics positioning assembly. The optics positioning assembly can sense the position of the auxiliary positioning assembly to form a positioning information. The processing device can receive the positioning information and integrate the positioning information with a medical image to form a navigation information, so that the navigation information is displayed on the display device through a stereoscopic image or a sectional image. Therefore, the doctor can accurately perform the relevant surgical operations on the patient's affected part through the displayed information.

Abstract: A package structure includes a redistribution structure, a chip, one or more structural reinforcing elements, and a protective layer. The redistribution structure includes a first circuit layer and a second circuit layer disposed over the first circuit layer. The first circuit layer is electrically connected to the second circuit layer. The chip is disposed over the redistribution structure and electrically connected to the second circuit layer. The one or more structural reinforcing elements are disposed over the redistribution structure. The structural reinforcing element has a Young's modulus in a range of of 30 to 200 GPa. The protective layer overlays the chip and a sidewall of the structural reinforcing element.

Abstract: A package structure includes a redistribution structure, a chip, an inner conductive reinforcing element, and a protective layer. The redistribution structure includes a first circuit layer and a second circuit layer disposed over the first circuit layer. The first circuit layer is electrically connected to the second circuit layer. The chip is disposed over the redistribution structure and electrically connected to the second circuit layer. The inner conductive reinforcing element is disposed over the redistribution structure. The inner conductive reinforcing element has a Young's modulus in a range of from 30 to 200 GPa. The protective layer covers the chip and a sidewall of an opening of the inner conductive reinforcing element.

Abstract: Disclosed is a clinical dental education and training method. The method collects and records a learner's operating conduct during learning or related data during a dental surgery practice, and generates an analysis result by various operating indexes of a data analysis, and provides the analysis result for the learner to know if there is any deficiency of the learner during the operation process, so as to enhance technical deficiency and improve teaching performance.

Abstract: A package substrate structure includes a first substrate, a second substrate, a plurality of conductive pillars and an adhesive layer. The first substrate includes a plurality of vias and a plurality of pads. The vias and the pads are disposed on the first substrate, and fills the vias. The second substrate is disposed opposite to the first substrate. Each conductive pillar is disposed between the first substrate and the second substrate, where each conductive pillar electrically connects each pad and the second substrate, and the adhesive layer fills the gaps between the conductive pillars. A bonding method of the package substrate structure is also provided.

Abstract: A light emitting device package structure includes a substrate, a circuit layer structure, a light emitting device, a first redistribution layer, a conductive connector, a second redistribution layer, and a chip. The circuit layer structure is disposed over the substrate, and the circuit layer structure includes a first circuit layer. The light emitting device is disposed over the circuit layer structure and is electrically connected with the first circuit layer. The first redistribution layer is disposed over the light emitting device and includes a second circuit layer and a conductive contact contacting the second circuit layer. The conductive connector connects the first circuit layer and the second circuit layer. The second redistribution layer is disposed over the first redistribution layer and includes a third circuit layer contacting the conductive contact. The chip is disposed over the second redistribution layer and is electrically connected with the third circuit layer.

Abstract: A multi-pouch container or carrier for imaging plates which includes multiple pockets which are overlapped, in which multiple relatively small plates can be inserted, sequenced and aligned in a defined overlapping such that simultaneously exposed plates in the pockets form overlapped images which can be stitched together by application software to provide a larger variable sized single contiguous image of a region of interest.

Abstract: A light emitting device package structure includes: a substrate structure including a substrate and a first circuit layer, the substrate having a first surface, the first circuit layer over the first surface; a chip over the substrate structure and electrically connected to the first circuit layer; a conductive connector over the substrate structure and electrically connected to the first circuit layer; a redistribution structure over the conductive connector, the redistribution structure including a first redistribution layer and a second redistribution layer over the first redistribution layer, the first redistribution layer including a second circuit layer electrically connected to the first circuit layer and a conductive contact in contact with the second circuit layer, the second redistribution layer including a third circuit layer in contact with the conductive contact; and a light emitting device over the redistribution structure and electrically connected to the third circuit layer.

Abstract: An active detection self-propelled artificial intelligence surgery navigation cart applied in medical institutes includes a cart body, a control unit, a signal transmission unit, a detection unit, a robotic arm and/or an optical navigation host. The cart can travel to a designated place or follow a counterpart (based on a stored map path) according to a predetermined schedule or an inputted instruction, or the cart can be controlled by an external remote control system or a counterpart to be followed, so as to achieve the effect of reducing the burden of medical staff while they are walking around, so that the medical staff can concentrate on the care of patients or improve the quality of surgical operations.

Abstract: A stacked structure includes a circuit board, an electronic component, metallic cores, and insulating cladding layers. The circuit board includes first bonding pads. The electronic component includes second bonding pads that are opposite to the first bonding pads. Each metallic core is connected to a corresponding first bonding pad and a corresponding second bonding pad. The metallic cores have a curved surface interposed between the corresponding first bonding pad and the corresponding second bonding pad. The insulating cladding layers are separated from each other and cover the curved surfaces of the metallic cores.