Abstract: A package structure, includes a metal layer, an insulating composite layer disposed thereon, a sealant bonded on the insulating composite layer, a chip embedded in the sealant, a circuit layer structure disposed on the sealant and the chip, and a protecting layer. The chip has a plurality of electrode pads exposed from the sealant. The circuit layer structure includes at least one dielectric layer and at least one circuit layer. The dielectric layer has a plurality of conductive blind vias. The dielectric layer and the sealant are made of the same material. The circuit layer is disposed on the dielectric layer and extends into the conductive blind vias, and the bottommost circuit layer is electrically connected to the electrode pads through the conductive blind vias. The protecting layer is formed on the circuit layer structure and has a plurality of openings exposing a portion of the circuit layer structure.

Abstract: A package substrate structure includes a first substrate, a second substrate, a plurality of conductive pillars and an adhesive layer. The first substrate includes a plurality of vias and a plurality of pads. The vias and the pads are disposed on the first substrate, and fills in the vias. The second substrate is disposed opposite to the first substrate. Each conductive pillar is disposed between the first substrate and the second substrate, where each conductive pillar electrically connects each pad and the second substrate, and the adhesive layer fills in the gaps between the conductive pillars. A bonding method of the package substrate structure is also provided.

Abstract: A package structure includes a first substrate, a second substrate, a plurality of conductive pillars and an adhesive layer. The first substrate includes a plurality of vias and a plurality of pads. The pads are disposed on the first substrate, and fill in the vias. The second substrate is disposed opposite to the first substrate. Each conductive pillar electrically connects each pad and the second substrate, and the adhesive layer fills in the gaps between the conductive pillars. A bonding method of the package structure is also provided.

Abstract: A light emitting device package structure includes a substrate, a circuit layer structure, a light emitting device, a first redistribution layer, a conductive connector, a second redistribution layer, and a chip. The circuit layer structure is disposed over the substrate, and the circuit layer structure includes a first circuit layer. The light emitting device is disposed over the circuit layer structure and is electrically connected with the first circuit layer. The first redistribution layer is disposed over the light emitting device and includes a second circuit layer and a conductive contact contacting the second circuit layer. The conductive connector connects the first circuit layer and the second circuit layer. The second redistribution layer is disposed over the first redistribution layer and includes a third circuit layer contacting the conductive contact. The chip is disposed over the second redistribution layer and is electrically connected with the third circuit layer.

Abstract: A stacked structure includes a circuit board, an electronic component, metallic cores, and insulating cladding layers. The circuit board includes first bonding pads. The electronic component includes second bonding pads that are opposite to the first bonding pads. Each metallic core is connected to a corresponding first bonding pad and a corresponding second bonding pad. The metallic cores have a curved surface interposed between the corresponding first bonding pad and the corresponding second bonding pad. The insulating cladding layers are separated from each other and cover the curved surfaces of the metallic cores.

Abstract: A light emitting surgical calibration probe device includes a first optical tracking assembly, a quick disconnect coupler, a second positioning assistance unit, and a probe. The first optical tracking assembly has at least one tracking markers on a surface, and a surgical navigation system converts the position of the tracking markers into an overall position. The quick disconnect coupler is detachably coupled to the first optical tracking assembly and the second positioning assistance unit, and the second positioning assistance unit is capable of emitting an indicating light source with a specific wavelength and provided for a surgical navigation system to perform a non-contact positioning function. The probe is movably coupled to the second positioning assistance unit. The first optical tracking assembly and the second positioning assistance unit allow doctors to know the position of a surgical robot with respect to a patient's trackable housing more accurately.

Abstract: A miniaturized particulate matter detector that includes a filter and a concentration detector is provided. The filter has a plurality of holes, and the concentration detector is correspondingly disposed under the filter. The concentration detector has a detected area used to detect a concentration of at least one miniaturized particulate matter. A manufacturing method of the filter is also provided.

Abstract: A circuit board including an interconnect substrate and a multilayer structure is provided. The interconnect substrate includes a core layer and a conductive structure disposed on the core layer. The multilayer structure is disposed on the conductive structure. The multilayer structure includes a plurality of dielectric layers and a plurality of circuit structures. The circuit structures are disposed in the dielectric layers. A topmost layer in the circuit structures is exposed to the dielectric layers to be in contact with the conductive structure. A pattern of the topmost layer in the circuit structures and a pattern of a top surface of the conductive structure are engaged with each other.

Abstract: A mask structure and a manufacturing method of the mask structure are provided. The mask structure includes a transparent substrate, a patterned metal layer, and a plurality of microlens structures. The patterned metal layer is disposed on the transparent substrate and exposing a portion of the transparent substrate. The microlens structures are disposed on the transparent substrate exposed by a portion of the patterned metal layer and being in contact with the portion of the patterned metal layer.

Abstract: A package structure is disclosed herein. The package structure includes an insulating composite layer, a sealant disposed on the insulating composite layer, a first chip embedded in the sealant and having a plurality of first conductive pads exposed through the sealant, a circuit layer module having a plurality of circuit layers and a plurality of dielectric layers having a plurality of conductive vias, a second chip embedded in the circuit layer module and has a plurality of second conductive pads electrically connected to the circuit layers through the conductive vias, and a protecting layer having a plurality of openings disposed on the circuit layer module, in which the openings expose a portion of the circuit layer module.

Abstract: A surgical instrument positioning system and a positioning method thereof are provided. The natural feature information datum a of the human body presented by a medical image (for example, CT) taken before surgery is first input into the positioning system, and 3D datum reconstruction is performed. The position information of the hand-held instrument, obtained by the light sensing element, is then transmitted back to the positioning system. Then, the feature points can be automatically suggested via the positioning system or the feature points can be automatically designated or the feature points can be manually selected by the operator to establish the coordinate relationship between the patient position and the hand-held instrument, thereby solving the problem of the impact of the prior art on the surgical operation.

Abstract: A manufacturing method of a circuit substrate is provided. A substrate is provided. A positive photoresist layer is coated on the substrate. Once exposure process is performed on the positive photoresist layer disposed on the substrate so as to simultaneously form concaves with at least two different depths.

Abstract: A package structure includes a redistribution structure, a chip, one or more structural reinforcing elements, and a protective layer. The redistribution structure includes a first circuit layer and a second circuit layer disposed over the first circuit layer. The first circuit layer is electrically connected to the second circuit layer. The chip is disposed over the redistribution structure and electrically connected to the second circuit layer. The one or more structural reinforcing elements are disposed over the redistribution structure. The structural reinforcing element has a Young's modulus in a range of of 30 to 200 GPa. The protective layer overlays the chip and a sidewall of the structural reinforcing element.

Abstract: An assistant clamper having lens and adapted to clamp at an apparatus is provided, which includes a tube, an optical lens, at least one light emitting element and a working channel. The tube extends along a lengthwise direction. The optical lens is disposed at the tube. The light emitting element is disposed at the tube and located on the same side of the optical lens. The working channel is disposed in the tube and penetrates two opposite sides of the tube along the axial direction of the tube, and the working channel is communicated to an opening portion of a side of the tube, and the apparatus is capable of passing into the working channel through the opening portion.

Abstract: The present invention provides a surgical navigation system including a positioning device, a processing device and a display device. The positioning device includes an auxiliary positioning assembly capable of wearing or fixing around a patient's affected part and an optics positioning assembly. The optics positioning assembly can sense the position of the auxiliary positioning assembly to form a positioning information. The processing device can receive the positioning information and integrate the positioning information with a medical image to form a navigation information, so that the navigation information is displayed on the display device through a stereoscopic image or a sectional image. Therefore, the doctor can accurately perform the relevant surgical operations on the patient's affected part through the displayed information.

Abstract: In an embodiment, a miniaturize particulate matter detector includes a filter having a plurality of holes, and a concentration detector correspondingly disposed under the filter. The concentration detector has a detect area used for detecting a concentration of at least one miniaturize particulate matter. A manufacturing method of the filter is also provided.

Abstract: A method for manufacturing a circuit redistribution structure includes the following steps. A first dielectric is formed on a carrier. Conductive blind vias are formed in the first dielectric. A first circuit redistribution layer is formed on the first dielectric. A second dielectric is formed on the first dielectric. First and second holes are formed on the second dielectric. A trench is formed in the second dielectric to divide the second dielectric into first and second portions. A first portion of the first circuit redistribution layer and the first hole are disposed in the first portion of the second dielectric, and a second portion of the first circuit redistribution layer and the second hole are disposed in the second portion of the second dielectric. Conductive blind vias are formed in the first and second holes, and a second circuit redistribution layer is formed on the second dielectric.

Abstract: The present invention provides a handpiece register for positioning an instrument in a medical surgery. The handpiece register comprises a plate body, more than three optical measurement units and a positioning block. Therefore, the handpiece register of the present invention may accomplish relative position of the instrument to assist a doctor to achieve an immediate relative position of the instrument and a surgical site in the surgery.

Abstract: A method of forming a hermetic barrier layer comprises sputtering a thin film from a sputtering target, wherein the sputtering target includes a sputtering material such as a low Tg glass, a precursor of a low Tg glass, or an oxide of copper or tin. During the sputtering, the formation of defects in the barrier layer are constrained to within a narrow range and the sputtering material is maintained at a temperature of less than 200° C.