Abstract: A receiving structure providing real-time information as to the materials constituting its contents includes a box body, a first side plate, and a second side plate. The box body, the first side plate, and the second side plate forming a receiving space, and the receiving space receives materials. A discharge port is formed between the second side plate and the first side plate, the discharge port is in communication with the receiving space, and the discharge port is configured to take out the material. A material checking unit is provided on the first side plate, the material checking unit detects and enables real time identification of the materials in the receiving structure.

Abstract: A detection device includes a substrate, a light source, a detection module, and a heat dissipation module. The substrate includes a first base plate, a second base plate, and at least one connecting portion connecting the first base plate to the second base plate. The light source is disposed on the first base plate. The detection module is disposed on the second base plate. The first base plate has a first surface towards the at least one connecting portion, and the at least one connecting portion has a second surface towards the first base plate. The second surface is connected to a portion of the first surface. The heat dissipation module is disposed on the at least one connecting portion and/or the second base plate, and the influence of heat on proper operation of the detection device is thus prevented.

Abstract: A method for backing up a configuration file of a computer device is implemented by a baseboard management controller, and includes steps of: mounting a first partition, a second partition and a third partition of a flash memory storage device of the computer device; storing a copy of the configuration file in at least one of the first partition, the second partition and the third partition that has been mounted successfully as a backup; running an operating system stored in the flash memory storage device; and neither reading nor writing to the third partition while running the OS.

Abstract: The disclosure provides an electronic device. The electronic device includes a body, a touchpad, and a keyboard module. The body includes a surface, where the surface includes a first portion and a second portion that are adjacent to each other. The touchpad is arranged on the first portion. The keyboard module is arranged on the second portion and includes a first key. The first key includes a base plate, a circuit layer, a resilient structure, a key cap, and a conductor layer. The circuit layer is arranged on the base plate and configured to generate a first input signal. The resilient structure is arranged on the base plate. The key cap is arranged on the resilient structure. The conductor layer is arranged below the key cap and divided into a plurality of regions, where the regions are separated from each other and are configured to generate a plurality of second input signals.

Abstract: The present invention provides a PV sensor including a control circuit, a RC calibration circuit, and a voltage sensor. The control circuit is configured to generate at least one control signal. The RC calibration circuit is configured to receive the at least one control signal to generate a voltage indicates information of (1/R*C). The voltage sensor comprises a comparator, wherein the voltage sensor senses a voltage level of a received signal by using comparator to generate a sensing result, and the comparator is further configured to compare the calibration result within a reference voltage to generate a comparison result to the control circuit.

Abstract: Protective charging case systems usable with electronic devices are provided. The systems may include cases with removable batteries, where the electronic devices can be attached to the cases and be wirelessly charged by the batteries. The batteries can be charged in multiple ways, whether or not they are installed in the cases. The protective charging case system and its components can result in increased user satisfaction and improved working conditions, due to the maximized operation time of the electronic devices.

Abstract: Provided is a package structure and an antenna structure. The package structure includes a die; a first encapsulant, laterally encapsulating the die; a first redistribution structure, disposed on the first encapsulant and the die; a second encapsulant, disposed on the first redistribution structure; an antenna pattern, embedded in the second encapsulant and electrically connected to the first redistribution structure; and a dielectric layer, covering the antenna pattern, wherein an upper surface of the second encapsulant is exposed by the dielectric layer, and a laser mark is formed within the upper surface of the second encapsulant.

Abstract: The present application provides a learning method for plug-in depth including steps of: (a) utilizing a robot arm to take an electronic component with a plurality of pins; (b) utilizing a first visual device to identify a pin distance; (c) utilizing a second visual device to identify a hole distance; (d) inserting the plurality of pins into the corresponding plurality of holes with a predetermined depth according to the pin distance and the hole distance; (e) determining whether the plurality of pins are inserted into the plurality of holes, performing step (f) when the determination result is satisfied, and performing step (g) when the determination result is not satisfied; (f) recording the predetermined depth and performing the step (a) again; (g) calibrating the predetermined depth and performing the step (a) again; and (h) completing the learning of the plug-in depth after the step (f) is performed multiple times successively.

Abstract: An automatic pick-and-place system is provided, including a feeding device, a visual pattern formed on a fixed part of the feeding device, a manipulator, and a processing unit. An electronic component can be held between the fixed part and a gripping part of the feeding device. A visual module on the manipulator captures an image of the visual pattern, and the processing unit calculates the coordinate value of the electronic component. Thus, the manipulator can move to the target position and pick up the electronic element according to the coordinate value.

Abstract: A stereoscopic marker device includes: a polyhedral cube, including at least four flat surfaces, wherein the at least four flat surfaces are used as one primary marker and at least three secondary markers respectively, the primary marker includes a primary graphic code, the three secondary markers individually include a first secondary graphic code, a second secondary graphic code, and a third secondary graphic code, and the primary graphic code is used for providing spatial coordinate information, which is used for calculating six degrees of freedom (DOF) attitude data; and a spike-shaped body, combined with the polyhedral cube and configured to be fixed on a surgery site.

Abstract: Provided is a package structure and an antenna structure. The package structure includes a die; a first encapsulant, laterally encapsulating the die; a first redistribution structure, disposed on the first encapsulant and the die; a second encapsulant, disposed on the first redistribution structure; an antenna pattern, embedded in the second encapsulant and electrically connected to the first redistribution structure; and a dielectric layer, covering the antenna pattern, wherein an upper surface of the second encapsulant is exposed by the dielectric layer, and a laser mark is formed within the upper surface of the second encapsulant.

Abstract: Embodiments include a crack stopper structure surrounding an embedded integrated circuit die, and the formation thereof. The crack stopper structure may include multiple layers separated by a fill layer. The layers of the crack stopper may include multiple sublayers, some of the sublayers providing adhesion, hardness buffering, and material gradients for transitioning from one layer of the crack stopper structure to another layer of the crack stopper structure.

Abstract: A system for extended reality interaction includes a sender device and a recipient device. The sender device generates a data block based on action data corresponding to a virtual object and transmits the data block to a recipient device. The data block includes tag information for indicating the device generated the action data, object information corresponding to the virtual object, and motion information for describing motions of the virtual object in a first XR environment. The recipient device then presents the motions of the virtual object in a second XR environment according to the tag information, the object information, and the motion information.

Abstract: A touch pad structure including a carrier, a frame, a touch pad, a switch and four first springs is provided. The frame is disposed above the carrier. The touch pad is disposed on the frame, and the frame is located between the carrier and the touch pad. The switch is disposed on the touch pad and penetrates through the frame and thus faces the carrier. The first springs are distributed at a peripheral of the touch pad. Two opposite ends of each of the first springs respectively contact the carrier and the frame. Two longest connecting lines between the first springs are defined as a first connecting line and a second connecting line. The switch is seated on an intersection point of the first connecting line and the second connecting line. An electronic device is also provided.

Abstract: A base station management system is provided in the invention. The base station management system includes a base station management device and a first base station. The base station management device manages a plurality of base stations. The first base station sends a first link request to the base station management device based on a default port number and a base station management device address through a communication interface. After the base station management device receives the first link request, the base station management device establishes a link with the first base station based on the first link request, and changes the port number corresponding to the first base station from the default number to an unused first port number to release the default port number. The first base station establishes the link with the base station management device again based on the first port number.

Abstract: A touch method applied to an electronic device is provided. The electronic device includes a touchpad and a screen, the touchpad has a plurality of operating functions. The touch method includes: receiving an input gesture through the touchpad; determining whether the input gesture matches with a preset gesture command or not; maintaining an original setting of the touchpad, in response to the input gesture does not match with the preset gesture command; dividing the touchpad into a non-dominant hand operating area and a dominant hand operating area in response to the input gesture matches with the preset gesture command, and after receiving a selecting command in the non-dominant hand operating area, selecting one of the operating functions according to the selecting command; and executing selected the operating function in the dominant hand operation area. An electronic device for executing the touch method is also provided.

Abstract: In a method of manufacturing a semiconductor device, a gate space is formed by removing a sacrificial gate electrode formed over a channel region, a first gate dielectric layer is formed over the channel region in the gate space, a second gate dielectric layer is formed over the first gate dielectric layer, one or more conductive layers is formed on the second gate dielectric layer, the second gate dielectric layer and the one or more conductive layers are recessed, an annealing operation is performed to diffuse an element of the second gate dielectric layer into the first gate dielectric layer, and one or more metal layers are formed in the gate space.

Abstract: A method for forming a semiconductor device structure includes forming first nanostructures and second nanostructures over a substrate. The method also includes forming a first metal gate layer surrounding the first nanostructures and over the first nanostructures and the second nanostructures. The method also includes etching back the first metal gate layer over the first nanostructures and the second nanostructures. The method also includes removing the first metal gate layer over the second nanostructures. The method also includes forming a second metal gate layer surrounding the second nanostructures and over the first nanostructures and the second nanostructures.