Abstract: Disclosed are a chip performance monitoring system, method and a computer program product, wherein a performance monitor output signal is propagated through an adjacent scan chain to avoid signal degradation incident to across-chip transmission of high frequency signals. Since the clock signal frequency used to control signal propagation through the scan chain will typically be less than twice the performance monitor output signal frequency, frequency sub-sampling with aliasing occurs. To compensate, signal propagation through the scan chain can be controlled during different time periods using different clock signals having different clock signal frequencies and, during these different time periods, different data outputs can be captured at an output node of the scan chain. The data output frequencies of these different data outputs can be measured and the performance monitor output signal frequency can be determined based on the different data output frequencies given the different clock signal frequencies.

Abstract: Disclosed are a chip performance monitoring system, method and a computer program product, wherein a performance monitor output signal is propagated through an adjacent scan chain to avoid signal degradation incident to across-chip transmission of high frequency signals. Since the clock signal frequency used to control signal propagation through the scan chain will typically be less than twice the performance monitor output signal frequency, frequency sub-sampling with aliasing occurs. To compensate, signal propagation through the scan chain can be controlled during different time periods using different clock signals having different clock signal frequencies and, during these different time periods, different data outputs can be captured at an output node of the scan chain. The data output frequencies of these different data outputs can be measured and the performance monitor output signal frequency can be determined based on the different data output frequencies given the different clock signal frequencies.

Abstract: Aspects of the invention provide for a flexible performance screen ring oscillator (PSRO) integrated within a scan chain. In one embodiment, a circuit structure to create the flexible PSRO includes: a plurality of programmable scan chain elements; and a forward test scan chain path through the plurality of scan chain elements; wherein each of the programmable scan chain elements includes additional circuitry for a backward path, such that the backward path and the forward test scan chain path are combined to create the PSRO.

Abstract: A plurality of digital circuits are manufactured from an identical circuit design. A power controller is operatively connected to the digital circuits, and a non-transitory storage medium is operatively connected to the power controller. The digital circuits are classified into different voltage bins, and each of the voltage bins has a current leakage limit. Each of the digital circuits has been previously tested to operate within a corresponding current leakage limit of a corresponding voltage bin into which each of the digital circuits has been classified. The non-transitory storage medium stores boundaries of the voltage bins as speed-binning test data. The power controller controls power-supply signals applied differently for each of the digital circuits based on which bin each of the digital circuit has been classified and the speed-binning test data.

Abstract: A performance screen ring oscillator (PSRO) formed from paired scan chains is disclosed. A circuit structure comprises scan chains each having scan chain elements. A scan chain link is configured to pair at least one scan chain element from a first scan chain with at least one scan chain element of a second scan chain to form a PSRO. A forward path associated with data flow through the at least one scan chain element of the first scan chain becomes a backward path of the at least one scan chain element of the second scan chain, and a forward path associated with data flow through the at least one scan chain element of the second scan chain becomes a backward path of the at least one scan chain element of the first scan chain.

Abstract: A performance screen ring oscillator (PSRO) is formed from multi-dimensional pairings of scan chains. In one embodiment, there is a multi-dimensional arrangement of scan chains in an integrated circuit. Each of the scan chains has interconnected scan chain elements that form a shift register to apply test patterns to inputs of combinational logic in the integrated circuit and read outputs from the combinational logic based on the inputted test patterns. A scan chain link links selected scan chain elements from the scan chains to form at least one PSRO loop within the multi-dimensional arrangement of the scan chains.

Abstract: Disclosed are a chip performance monitoring system, method and a computer program product, wherein a performance monitor output signal is propagated through an adjacent scan chain to avoid signal degradation incident to across-chip transmission of high frequency signals. Since the clock signal frequency used to control signal propagation through the scan chain will typically be less than twice the performance monitor output signal frequency, frequency sub-sampling with aliasing occurs. To compensate, signal propagation through the scan chain can be controlled during different time periods using different clock signals having different clock signal frequencies and, during these different time periods, different data outputs can be captured at an output node of the scan chain. The data output frequencies of these different data outputs can be measured and the performance monitor output signal frequency can be determined based on the different data output frequencies given the different clock signal frequencies.

Abstract: Aspects of the invention provide a circuit structure that automatically monitors a plurality of ring oscillators and dynamically selects the fastest or the slowest ring oscillator for feedback into the plurality of ring oscillators. In one embodiment, a circuit includes: a plurality of delay elements, each delay element associated with a ring oscillator; a first logic gate for receiving outputs of each of the delay elements; a second logic gate for receiving outputs of each of the delay elements; and a multiplexer for receiving an output of the first logic gate and an output of the second logic gate and choosing one of the outputs, wherein a selection for the multiplexer is based on an output of the multiplexer. To select the fastest ring oscillator, a second multiplexer is provided.

Abstract: Aspects of the invention provide for a flexible performance screen ring oscillator (PSRO) integrated within a scan chain. In one embodiment, a circuit structure to create the flexible PSRO includes: a plurality of programmable scan chain elements; and a forward test scan chain path through the plurality of scan chain elements; wherein each of the programmable scan chain elements includes additional circuitry for a backward path, such that the backward path and the forward test scan chain path are combined to create the PSRO.

Abstract: A plurality of digital circuits are manufactured from an identical circuit design. A power controller is operatively connected to the digital circuits, and a non-transitory storage medium is operatively connected to the power controller. The digital circuits are classified into different voltage bins, and each of the voltage bins has a current leakage limit. Each of the digital circuits has been previously tested to operate within a corresponding current leakage limit of a corresponding voltage bin into which each of the digital circuits has been classified. The non-transitory storage medium stores boundaries of the voltage bins as speed-binning test data. The power controller controls power-supply signals applied differently for each of the digital circuits based on which bin each of the digital circuit has been classified and the speed-binning test data.

Abstract: Aspects of the invention provide a circuit structure that automatically monitors a plurality of ring oscillators and dynamically selects the fastest or the slowest ring oscillator for feedback into the plurality of ring oscillators. In one embodiment, a circuit includes: a plurality of delay elements, each delay element associated with a ring oscillator; a first logic gate for receiving outputs of each of the delay elements; a second logic gate for receiving outputs of each of the delay elements; and a multiplexer for receiving an output of the first logic gate and an output of the second logic gate and choosing one of the outputs, wherein a selection for the multiplexer is based on an output of the multiplexer. To select the fastest ring oscillator, a second multiplexer is provided.

Abstract: A method for designing an integrated circuit. A computer determines, for one or more paths in a circuit design, for a value of a design variable at which timing closure of the circuit design is achieved, an approximate slope of a function representing path delay as a function of the design variable. When the computer determines that one of the approximate slopes is not within a defined slope range, the computer determines an adjustment direction and an adjustment value based in part on the magnitude by which the slope is not within the defined slope range. The computer changes the circuit design of the path associated with the out-of-range slope, based in part on the adjustment direction and the adjustment value, so as to bring the slope within the defined slope range.

Abstract: The invention disclosed herein provides increased effectiveness of delay and transition fault testing. The method of delay fault testing integrated circuits comprises the steps of creating a plurality of test clock gating groups. The plurality of test clock gating groups comprising elements defining inter-element signal paths within the integrated circuit. Each of the elements of the plurality of test clock gating groups share clock frequency and additional shared characteristics. At least one test signal is commonly and selectively connected through at least one low-speed gate transistor to each of the elements comprising each of the plurality of test clock gating groups based on membership in the test clock gating group. This invention can also be practiced using scan-enable gating groups for the same purposes.

Abstract: Embodiments of the invention provide a method, system, and program product for predicting a delay of a critical path. In one embodiment, the invention provides a method of predicting a delay of at least one critical path of an integrated circuit, the method comprising: determining a delay of at least one ring oscillator on the integrated circuit; and calculating a predicted delay for the at least one critical path delay based on a delay of components of the critical path at a corner condition, a wire delay of the at least one critical path, a delay of the at least one ring oscillator at a corner condition, and the determined delay of the at least one ring oscillator.

Abstract: A method of forming and electrical structure. The method includes determining that a first semiconductor device requires an engineering change order (ECO). An additional structure layer required to implement the ECO is determined. A first insertion point location for inserting the additional structure layer within the first semiconductor device is selected. The first insertion point location is associated with a second insertion point location within a design for a second semiconductor device. The second semiconductor device is generated in accordance with the first ECO. The second semiconductor device comprises second structures. The second structures comprise same structures as first structures in the first semiconductor device. The second structures are formed in locations within the second semiconductor device that are associated with locations in the first semiconductor device comprising the first structures.

Abstract: A method of integrated circuit design and, more particularly, a method and system to optimize semiconductor products for power, performance, noise, die area, and cost through use of variable power supply voltage compression. The method is implemented in a computer-based tool and includes: embedding relationships in an optimization tool running on a computing device, wherein the relationships are based at least partly on performance, power-supply noise, die area, and power; inputting a set of product data and a set of technology data in the optimization tool running on the computing device; and determining product design parameters including power supply voltage, switching-noise-induced power supply voltage variation, and decap area. The determining is based on the relationships, the product data, and the technology data and is performed using the computing device running the optimization tool.

Abstract: A chip design methodology and an integrated circuit chip. The methodology includes identifying engineering changeable logic, and replacing the identified engineering changeable logic with flexible logic blocks (FLB).

Abstract: A chip design methodology. The methodology includes identifying engineering changeable logic, and replacing the identified engineering changeable logic with flexible logic blocks (FLB).

Abstract: A method of forming and electrical structure. The method includes determining that a first semiconductor device requires an engineering change order (ECO). An additional structure layer required to implement the ECO is determined. A first insertion point location for inserting the additional structure layer within the first semiconductor device is selected. The first insertion point location is associated with a second insertion point location within a design for a second semiconductor device. The second semiconductor device is generated in accordance with the first ECO. The second semiconductor device comprises second structures. The second structures comprise same structures as first structures in the first semiconductor device. The second structures are formed in locations within the second semiconductor device that are associated with locations in the first semiconductor device comprising the first structures.

Abstract: A design structure for identifying engineering changeable logic, and replacing the identified engineering changeable logic with flexible logic blocks (FLB). The design structure is embodied in a machine readable medium for designing, manufacturing, or testing an integrated circuit.