Abstract: A junction body has a first member and a second member each of which is provided with a joining surface whose main component is copper. A solder member containing, in a tin-base solder material, a three-dimensional web structure whose main component is copper is provided between the first member and the second member. A copper-tin alloy whose average thickness is 2 ?m or more but 20 ?m or less is provided between the joining surfaces and the three-dimensional web structure.

Abstract: There is provided an electronic component which comprises an insulating member on which an electronic element is mounted, and a thermal diffusion member on which the insulating member is mounted, wherein a thermal expansion coefficient of the insulating member is lower than a thermal expansion coefficient of the thermal diffusion member, and the insulating member is mounted in an embedded manner in a recess formed on a surface of the thermal diffusion member.

Abstract: In a drive apparatus having an integrated structure where a rotating electric machine and an inverter and a voltage converter for driving the rotating electric machine are integrally stored in a case, lubricant oil carried up by the rotation of the motor-generator flows into a storage chamber for a reactor from an opening. The lubricant oil flown from the opening is stored inside the storage chamber with the use of a dividing wall provided between a portion where the motor-generator is stored and the storage chamber, whereby at least part of reactor is immersed in the lubricant oil. Thus, the performance of cooling the reactor is ensured.

Abstract: A driving device (100) is provided with first and second rotating electrical machines (MG1, MG2); an inverter (30); a first storing case (23) having a first rotating electrical machine storing section (21) for storing the first rotating electrical machine (MG2), and an inverter storing section (300) for storing the inverter (30); and a second storing case (13) which can store the second rotating electrical machine (MG1) and can be attached to the first storing case (23); a first terminal section (121) connected to the inverter; and a second terminal section (15) which is arranged on the second storing case (13) and is connected to the second rotating electrical machine (MG1). The first terminal section (121) and the second terminal section (15) are arranged so that one protrudes toward the other.

Abstract: A semiconductor element cooling apparatus includes: a first member whose first surface on which a semiconductor element is mounted, and whose second surface has fins that define coolant flow paths, and that extend in a first direction, and that stand from the second surface to a predetermined height, and that are spaced from each other by predetermined intervals; and a second member that defines the coolant flow paths that extend in the first direction. The fins have grooves which extend in a second direction that intersects the first direction, and which have a depth that extends from the distal end side of the fins toward the second surface. The depth of the grooves is smaller than the height of the fins. A protrusion-forming member is disposed in the grooves, and extends across adjacent fins, and forms protrusions in the coolant flow paths defined by the adjacent fins.

Abstract: A heat sink includes a plurality of fins. The fins are formed to serve as partition walls of flow paths of a coolant. The fins are formed such that the coolant flows along a surface thereof. A merge space is formed to allow the coolant in the flow paths separated by the fins to merge. The merge space is formed in the flow paths formed by the fins.

Abstract: A power module includes a pair of power devices that are stacked with a plate-shaped output electrode arranged therebetween, and an N-electrode and a P-electrode that are stacked with the pair of power devices arranged therebetween. The output electrode is anisotropic such that the thermal conductivity in a direction orthogonal to the stacking direction is greater than the thermal conductivity in the stacking direction. Also, the output electrode extends in the orthogonal direction from a stacked area where the pair of power devices are stacked. The N-electrode and the P-electrode extend in the orthogonal direction while maintaining an opposing positional relationship.

Abstract: A vehicle drive system includes a battery, motor generators driving the vehicle using electric power from the battery or driven by the vehicle, a PCU integrated with the motor generators, having inverters and controlling the motor generator, cooling water cooling inverters, and oil cooling motor generators. The PCU includes a smoothing capacitor and a filter capacitor provided electrically closer to the battery than the smoothing capacitor. Here, the smoothing capacitor is cooled by the cooing water, while the filter capacitor is cooled by the oil.

Abstract: A cooling device including a heat absorbing unit, provided with an inflow port of a coolant medium and a discharge port for discharging the coolant medium, sealing the coolant medium in parts other than the inflow port and the discharge port, wherein the heat absorbing unit includes an upper member having an installation surface where semiconductor elements serving as an object to be cooled are installed and a cooling surface serving as a back surface of installation surface, and a lower member forming a chamber having cooling surface as a part of a inner wall surface together with upper member. Injection ports communicating with inflow port for injecting the coolant medium toward cooling surface are provided and the discharge port is provided at a position lower than opening positions of injection ports in lower member.

Abstract: A semiconductor element cooling structure includes a plurality of semiconductor elements, and electrode structure, which has cooling medium channels therein and is electrically connected to the plurality of semiconductor elements. The electrode structure includes an alternating current electrode having the semiconductor elements on each of opposite surfaces, and a plurality of direct current electrodes holding therebetween the alternating current electrode and the semiconductor elements respectively mounted on the opposite surfaces of the alternating current electrode. Each of the alternating current electrode and the direct current electrodes has the cooling medium channels therein.

Abstract: A casing for integrally accommodating a motor generator and an inverter includes an accommodating portion forming an inverter accommodating space, and an accommodating portion forming a motor accommodating space. The casing has a structure wherein the accommodating portions are integrally formed. Thereby, a drive device for a hybrid vehicle having the inverter and the motor generator accommodated in an integrated fashion prevents external leakage of electromagnetic noises of the inverter from the drive device.

Abstract: Inside a housing, there are provided a motor generator (MG), an IPM, and a smoothing capacitor. Between the MG and the IPM, there is provided a cooler through which a coolant liquid flows, provided in an inclined manner to form contact with the top face of the IPM. Between the MG and the smoothing capacitor, there are provided a first communication channel through which an LLC flows from a region outside the housing into the cooler, brought into contact with a lateral face of the smoothing capacitor, and a second communication channel through which the LLC flows from the interior of the cooler to the region outside the housing.

Abstract: A semiconductor element cooling structure includes first and second semiconductor elements; a heat sink having a mounting surface on which the semiconductor elements are mounted and a cooling medium channel formed inside, through which a cooling medium for cooling the semiconductor elements flows; and a protruded portion provided at a position opposite to the mounting surface of the heat sink, extending in a direction intersecting flow direction of the cooling medium (direction of arrow DR1) and protruding from a bottom surface of the cooling medium channel to the inside of cooling medium channel. The semiconductor elements are arranged side by side in the direction of arrow DR1, such that the first semiconductor element is positioned upstream side than the second semiconductor element.

Abstract: A junction body has a first member and a second member each of which is provided with a joining surface whose main component is copper. A solder member containing, in a tin-base solder material, a three-dimensional web structure whose main component is copper is provided between the first member and the second member. A copper-tin alloy whose average thickness is 2 ?m or more but 20 ?m or less is provided between the joining surfaces and the three-dimensional web structure.

Abstract: A vehicle drive mechanism includes a power transmission mechanism which has a rotary electric motor and a gear mechanism for transmitting mechanical power from the rotary electric motor to a drive shaft disposed coaxially with an output shaft of the rotary electric motor, and a control unit formed of a plurality of elements and controlling an operation of the rotary electric motor. At least one of the elements which constitute the control unit is disposed on a periphery of at least one of the rotary electric motor, the drive shaft, and the gear mechanism.

Abstract: A control device converts a torque instruction value of an AC motor into a current instruction of AC motor, and employs current control in which feedback is performed by PI control to match an actual current value with the current instruction. Further, the control device sets a target flow rate of cooling water flowing through a coolant passage based on the converted current instruction, produces a signal for driving a water pump to circulate the cooling water at the target flow rate thus set and provides the signal to the water pump. A revolution speed of the water pump is restricted according to a signal of the control device such that the cooling water circulates through the coolant passage at the flow rate matching with the target flow rate.

Abstract: A driving apparatus includes: a rotating electrical machine; an inverter capable of supplying electric power to the rotating electrical machine; an electrical device connected to the inverter; a containing case capable of containing the rotating electrical machine, the inverter, and the electrical device; and a cooling coolant circulation circuit, distributing cooling coolant capable of cooling the inverter and the electrical device, which allows the inverter to be cooled at an upstream side relative to the electrical device in a direction in which the cooling coolant is distributed.

Abstract: A mounting structure for a vehicle driving apparatus includes a housing fixed to a vehicle body and including a first internal space and a second internal space formed below the first internal space in the state of being separated from the first internal space; a motor generator provided in the first internal space of the housing; an inverter provided in the second internal space of the housing; and a terminal electrically connecting the motor generator and the inverter. Oil used for cooling the motor generator is stored in the bottom of the first internal space. The portion in the terminal located in the first internal space is located above the highest liquid level of the oil stored in the first internal space.

Abstract: A radiator having a radiator fin sandwiched between and joined to a top plate and a bottom plate is provided on an insulating substrate, which has a semiconductor element arranged on one face side thereof, on the other face side thereof. The radiator fin is a corrugated fin that includes a first region that includes a joint peak portion joined to the bottom plate and has a height in an amplitude direction which is substantially equal to a distance between the top plate and the bottom plate, and a second region that includes a non-joint peak portion separated from the bottom plate by a predetermined gap and has a height in the amplitude direction which is smaller than the distance between the top plate and the bottom plate.

Abstract: A semiconductor element cooling apparatus includes: a first member whose first surface on which a semiconductor element is mounted, and whose second surface has fins that define coolant flow paths, and that extend in a first direction, and that stand from the second surface to a predetermined height, and that are spaced from each other by predetermined intervals; and a second member that defines the coolant flow paths that extend in the first direction. The fins have grooves which extend in a second direction that intersects the first direction, and which have a depth that extends from the distal end side of the fins toward the second surface. The depth of the grooves is smaller than the height of the fins. A protrusion-forming member is disposed in the grooves, and extends across adjacent fins, and forms protrusions in the coolant flow paths defined by the adjacent fins.