Abstract: The attaching-and-detaching operation of a lid unit is automated using an existing attaching-and-detaching device. A lid unit for closing a container body of a thin-plate supporting container for use in storing semiconductor wafers therein is provided. A simplified attaching-and-detaching mechanism allows the lid unit to be attached and detached by easy locking and unlocking with respect to the container body. The simplified attaching-and-detaching mechanism includes a locking member engageable with a second receiving device of the container body, and a guiding member disposed at the extremity of the locking member, which guiding member reaches the second receiving device and guides the locking member into the second receiving device in a state in which the main body fits lightly in the container body. The guiding member includes a reaching portion that first reaches the second receiving device, and a guiding portion that guides the locking member to the second receiving device.

Abstract: The present invention is directed to a lid unit having a latching mechanism for firmly fixing the lid unit to a container body for containing semiconductor wafers and the like, which latching mechanism can be easily disassembled for cleaning and drying of its components, and to a wafer presser for retaining the semiconductor wafers in position when the container is shaken. The latching mechanism includes a locking member which, when projected, secures the lid unit to the container body; an actuator for moving the locking member between projected and retracted positions; a tip-side cam for pressing a tip portion of the locking member in one direction relative to the lid unit when the locking member is projected by the actuator; a base-end lower cam for pressing a base-end of the locking member in a second direction, opposite the one direction; and a base-end upper cam and a cam projection follower for pressing the base-end in the second direction.

Abstract: The present invention provides a lid unit for closing the container body 2 that is transported with thin-plates such as semiconductor wafers or the like accommodated therein. Simplified attaching/detaching mechanisms 32 for the production line are provided at the centers of the respective sides opposing with respect to each other. The simplified attaching/detaching mechanism 32 for the production line includes a locking plate 34 for locking the second fitted portion 21 and a drive-out member 35 for allowing the drive-out member 35 to rise and set by being engaged with the locking plate 34. A locking arm 57 for fixing the drive-out member 35 is provided on the drive-out member 35 at the end in the direction of rotation. A supporting rail 56 for controlling the rising and setting movement of the locking plate 34 is provided on the drive-out member 35.

Abstract: The invention provides a thin plate supporting container clamping device for fixing a thin plate supporting container when the thin plate supporting container in which semiconductor wafers are stored therein for transportation is placed on a loading port at a destination thereof for unloading and loading the semiconductor wafers automatically, including a hook member to be engaged with a retaining member of the thin plate supporting container; a drive unit for supporting the retracted thin plate supporting container in a state in which the hook member is supported so as to be capable of moving in the vertical direction and the hook member is engaged with the retaining member; and a control unit for adjusting a force to retract the hook member. The control unit adjusts the force to retract the hook member on the basis of detection values of a thickness sensor, a position sensor, and a retracting force detection sensor.

Abstract: A single thin plate storage container 1 includes a main body 2 for storing one thin wafer A4 inside and a lid attached to the main body 2. The single thin plate storage container 1 includes a bottom side support member 35 that is located on the main body 2 side and supports the lid 3 from the bottom side, and a front side support member 36 that is located on the lid 3 side and supports the thin wafer 4A from the upper front side. The bottom side support member 35 includes a center support part 37, an outer periphery support part 38, a peripheral edge support part 39, and a ring plate 40 for combining integrally the center support part 37 and the outer support part 38. The front side support member 36 includes a disc 43 for covering the thin wafer 4A from the upper side and abutting parts 44, 45 to sandwich the thin wafer 4A between the two abutting parts and the bottom side support member 35.

Abstract: A thin plate supporting container includes a container body for housing therein semiconductor wafers, a lid unit for closing the container body, and slotted plates for supporting the semiconductor wafers from opposing sides. There are provided an upper fitting portion for supporting an upper portion of the slotted plate, and a lower fitting portion for supporting a lower portion of the slotted plate. An upper fitting piece of the upper fitting portion has a planar contact face which comes into contact with the slotted plate to thereby position the slotted plate in the front/rear direction while suppressing swing of the slotted plate. The upper receiving element on the slotted plate has a planar contact face. The lower fitting portion provides vertical, horizontal and front/rear positioning.

Abstract: A thin plate supporting container includes a container body for housing therein semiconductor wafers, a lid unit for closing the container body, and slotted plates for supporting the semiconductor wafers from opposing sides. There are provided an upper fitting portion for supporting an upper portion of the slotted plate, and a lower fitting portion for supporting a lower portion of the slotted plate. An upper fitting piece of the upper fitting portion has a planar contact face which comes into contact with the slotted plate to thereby position the slotted plate in the front/rear direction while suppressing swing of the slotted plate. The upper receiving element on the slotted plate has a planar contact face. The lower fitting portion provides vertical, horizontal and front/rear positioning.

Abstract: The present invention is directed to a lid unit having a latching mechanism for firmly fixing the lid unit to a container body for containing semiconductor wafers and the like, which latching mechanism can be easily disassembled for cleaning and drying of its components, and to a wafer presser for retaining the semiconductor wafers in position when the container is shaken. The latching mechanism includes a locking member which, when projected, secures the lid unit to the container body; an actuator for moving the locking member between projected and retracted positions; a tip-side cam for pressing a tip portion of the locking member in one direction relative to the lid unit when the locking member is projected by the actuator; a base-end lower cam for pressing a base-end of the locking member in a second direction, opposite the one direction; and a base-end upper cam and a cam projection follower for pressing the base-end in the second direction.

Abstract: The present invention is directed to a lid unit having a latching mechanism for firmly fixing the lid unit to a container body for containing semiconductor wafers and the like, which latching mechanism can be easily disassembled for cleaning and drying of its components, and to a wafer presser for retaining the semiconductor wafers in position when the container is shaken. The latching mechanism includes a locking member which, when projected, secures the lid unit to the container body; an actuator for moving the locking member between projected and retracted positions; a tip-side cam for pressing a tip portion of the locking member in one direction relative to the lid unit when the locking member is projected by the actuator; a base-end lower cam for pressing a base-end of the locking member in a second direction, opposite the one direction; and a base-end upper cam and a cam projection follower for pressing the base-end in the second direction.

Abstract: A thin plate supporting container includes a container body for housing therein semiconductor wafers, a lid unit for closing the container body, and slotted plates for supporting the semiconductor wafers from opposing sides. There are provided an upper fitting portion for supporting an upper portion of the slotted plate, and a lower fitting portion for supporting a lower portion of the slotted plate. An upper fitting piece of the upper fitting portion has a planar contact face which comes into contact with the slotted plate to thereby position the slotted plate in the front/rear direction while suppressing swing of the slotted plate. The upper receiving element on the slotted plate has a planar contact face. The lower fitting portion provides vertical, horizontal and front/rear positioning.

Abstract: A thin plate supporting container includes a container body for housing therein semiconductor wafers, a lid unit for closing the container body, and slotted plates for supporting the semiconductor wafers from opposing sides. There are provided an upper fitting portion for supporting an upper portion of the slotted plate, and a lower fitting portion for supporting a lower portion of the slotted plate. An upper fitting piece of the upper fitting portion has a planar contact face which comes into contact with the slotted plate to thereby position the slotted plate in the front/rear direction while suppressing swing of the slotted plate. The upper receiving element on the slotted plate has a planar contact face. The lower fitting portion provides vertical, horizontal and front/rear positioning.

Abstract: A thin plate supporting container includes a container body for housing therein semiconductor wafers, a lid unit for closing the container body, and slotted plates for supporting the semiconductor wafers from opposing sides. There are provided an upper fitting portion for supporting an upper portion of the slotted plate, and a lower fitting portion for supporting a lower portion of the slotted plate. An upper fitting piece of the upper fitting portion has a planar contact face which comes into contact with the slotted plate to thereby position the slotted plate in the front/rear direction while suppressing swing of the slotted plate. The upper receiving element on the slotted plate has a planar contact face. The lower fitting portion provides vertical, horizontal and front/rear positioning.

Abstract: The attaching-and-detaching operation of a lid unit, and the operation of taking in and out semiconductor wafers stored in a container body are facilitated. Thin-plate supporting units for supporting semiconductor wafers are provided in the container body of a thin-plate supporting container, and wafer holding units for pressing and supporting the semiconductor wafers, supported by the thin-plate supporting units, from a lid unit side are provided inside a lid unit. The area of a lower surface of a V-shaped groove of the wafer holding unit is increased. The V-shaped groove easily fits the peripheral portion of the semiconductor wafer when attaching the lid unit to the container body. The lower surface of a V-shaped groove of the thin-plate supporting portion is roughened to enhance slipping property with respect to the semiconductor wafer. The angle of inclination of a ridge is determined to be 2 to 5 degrees with respect to the horizontal direction.

Abstract: A single thin plate storage container is provided so that an extremely thin wafer can be safely and reliably supported for easy insertion and removal. A single thin plate storage container 1 includes a main body 2 for storing one thin wafer A4 inside and a lid attached to the main body 2. The single thin plate storage container 1 includes a bottom side support member 35 that is located on the main body 2 side and supports the lid 3 from the bottom side, and a front side support member 36 that is located on the lid 3 side and supports the thin wafer 4A from the upper front side. The bottom side support member 35 includes a center support part 37 for supporting a center of the thin wafer 4A, an outer periphery support part 38 for supporting an outer periphery of the same, a peripheral edge support part 39 for supporting the same radially from outside, and a ring plate 40 for combining integrally the center support part 37 and the outer support part 38.

Abstract: When a thin-plate supporting container is placed on a placement table, a displacement is corrected and the thin-plate supporting container is precisely positioned. The thin-plate supporting container includes a container body 22 for housing therein a semiconductor wafer and the like and positioning means 23 provided to the container body 22 for positioning the container body at a set position on a placement table to place the container body on the placement table and take in and out the semiconductor wafer and the like. The positioning means 23 includes an engagement groove 24 for engaging an engagement protrusion provided on the placement table, and an inclined plane 25 to be in contact with the engagement protrusion in a state the engagement groove engages with the engagement protrusion. The inclined plane is treated so as to reduce a contact area with the engagement protrusion to decrease the friction resistance by embossing.

Abstract: A thin plate supporting container includes a container body for housing therein semiconductor wafers, a lid unit for closing the container body, and slotted plates for supporting the semiconductor wafers from opposing sides. There are provided an upper fitting portion for supporting an upper portion of the slotted plate, and a lower fitting portion for supporting a lower portion of the slotted plate. An upper fitting piece of the upper fitting portion has a planar contact face which comes into contact with the slotted plate to thereby position the slotted plate in the front/rear direction while suppressing swing of the slotted plate. The upper receiving element on the slotted plate has a planar contact face. The lower fitting portion provides vertical, horizontal and front/rear positioning.

Abstract: The present invention is directed to realize accurate positioning of a slotted plate. Disclosed is a thin plate supporting container having a container body for housing therein semiconductor wafers, a lid unit for closing the container body, and slotted plates for supporting the semiconductor wafers from both sides. There are provided an upper fitting portion for supporting an upper portion of the slotted plate, and a lower fitting portion for supporting a lower portion of the slotted plate. An upper fitting piece of the upper fitting portion has a contact face having a flat plane shape which comes into contact with the slotted plate side to thereby position the slotted plate in the front/rear direction while suppressing swing of the slotted plate, and a supporting face. The upper receiving piece has a face to be contacted having a flat plane shape, and a face to be supported.

Abstract: A thin plate supporting container includes a container body for housing therein semiconductor wafers, a lid unit for closing the container body, and slotted plates for supporting the semiconductor wafers from opposing sides. There are provided an upper fitting portion for supporting an upper portion of the slotted plate, and a lower fitting portion for supporting a lower portion of the slotted plate. An upper fitting piece of the upper fitting portion has a planar contact face which comes into contact with the slotted plate to thereby position the slotted plate in the front/rear direction while suppressing swing of the slotted plate. The upper receiving element on the slotted plate has a planar contact face. The lower fitting portion provides vertical, horizontal and front/rear positioning.

Abstract: A thin plate supporting container includes a container body for housing therein semiconductor wafers, a lid unit for closing the container body, and slotted plates for supporting the semiconductor wafers from opposing sides. There are provided an upper fitting portion for supporting an upper portion of the slotted plate, and a lower fitting portion for supporting a lower portion of the slotted plate. An upper fitting piece of the upper fitting portion has a planar contact face which comes into contact with the slotted plate to thereby position the slotted plate in the front/rear direction while suppressing swing of the slotted plate. The upper receiving element on the slotted plate has a planar contact face. The lower fitting portion provides vertical, horizontal and front/rear positioning.

Abstract: A thin plate supporting container includes a container body for housing therein semiconductor wafers, a lid unit for closing the container body, and slotted plates for supporting the semiconductor wafers from opposing sides. There are provided an upper fitting portion for supporting an upper portion of the slotted plate, and a lower fitting portion for supporting a lower portion of the slotted plate. An upper fitting piece of the upper fitting portion has a planar contact face which comes into contact with the slotted plate to thereby position the slotted plate in the front/rear direction while suppressing swing of the slotted plate. The upper receiving element on the slotted plate has a planar contact face. The lower fitting portion provides vertical, horizontal and front/rear positioning.