Abstract: A single thin plate storage container is provided so that a housed semiconductor wafer is capable of easy insertion and removal. The single thin plate storage container includes a container body which houses a single semiconductor wafer therein and a lid unit attached to the container body. The container body includes a bottom plate on which the semiconductor wafer is placed and a peripheral wall portion formed around the bottom plate, and the bottom plate is formed by protruding up to a position higher than the peripheral wall portion. The bottom plate of the container body is provided with a plurality of thin plate supporting convex strips for supporting the semiconductor wafer in a state where a space is provided between the semiconductor wafer and the bottom plate. The inner side surface of the top plate of the lid unit is provided with a plurality of retainers which support a peripheral portion of the semiconductor wafer placed on the bottom plate of the container body.

Abstract: A lid unit for closing a container body of a thin-plate supporting container for use in storing semiconductor wafers therein is provided. A simplified attaching-and-detaching mechanism of the lid unit includes a locking member extending from the main body engageable with a receiving device on the container body; a guiding member that reaches the receiving device in a state in which the main body fits lightly in the container body, and guides the locking member into the receiving device; and a feed member that rotates by engaging with the locking member, extends the locking member from the main body to be engageable with the receiving device on the container body. A rotation region of the feed member is divided into a rotation region for engaging the locking member with the receiving device on the container body and fixing the lid unit to the container body, and a rotation region for further rotating the feed member and fixing the feed member with the lid unit fixed to the container body.

Abstract: The invention is a storage container in which semiconductor wafers and the like are stored in a container main body 11. The container main body 11 includes an attaching/detaching mechanism portion 23 in which a handle 21 and a top flange 13 are provided while detachably mounted onto the container main body 11. The attaching/detaching mechanism portion 23 includes a fitting plate 27 and a lock portion 28. The fitting plate 27 is directly fitted in a fitted portion on the side of the container main body 11, and the lock portion 28 fixes the fitting plate 27 while the fitting plate 27 is fitted in the fitted portion. The lock portion 28 includes a fitting hole 34, a rocking piece 36, and a stopper 37. The fitting hole 34 is provided on the side of the container main body 11. The rocking piece 36 is rockably provided on the side of the fitting plate 27, and the rocking piece 36 has a fitting pawl 35 in one end portion. The fitting pawl 35 is fitted in the fitting hole 34.

Abstract: The present invention provides a lid unit for closing a container body used to transport thin-plates such as semiconductor wafers or the like accommodated therein. Simplified attaching/detaching mechanisms are provided at the centers of the respective sides of the lid unit. The attaching/detaching mechanism includes a locking plate, for locking within a second recess, a lid receiving portion of the container body and a drive-out member for raising and locking the locking plate. A locking arm for fixing the drive-out member is provided on its leading side in the direction of engaging rotation. A supporting rail for guiding the raising and locking/unlocking movement of the locking plate is provided on the drive-out member. The locking plate is mounted for pivoting and sliding movement, and is provided with a holding claw for engagement within a second recess at the distal end thereof.

Abstract: The attaching-and-detaching operation of a lid unit is automated using an existing attaching-and-detaching device. A lid unit for closing a container body of a thin-plate supporting container for use in storing semiconductor wafers therein is provided. A simplified attaching-and-detaching mechanism allows the lid unit to be attached and detached by easy locking and unlocking with respect to the container body. The simplified attaching-and-detaching mechanism includes a locking member engageable with a second receiving device of the container body, and a guiding member disposed at the extremity of the locking member, which guiding member reaches the second receiving device and guides the locking member into the second receiving device in a state in which the main body fits lightly in the container body. The guiding member includes a reaching portion that first reaches the second receiving device, and a guiding portion that guides the locking member to the second receiving device.

Abstract: To prevent a sealing member from falling off, facilitate attachment of the sealing member, and improve the sealing property of the sealing member. The sealing member of the present invention includes a plurality of individually deformable portions fitted into fitting groove portions separated across a protrusion in the fitting groove formed in one of a container main body and a cover member, a coupling portion connecting the individually deformable portions, and a sealing piece abutting against a wall surface of the other one of the container main body and the cover member to seal a space, the sealing piece being integrated with the coupling portion connecting the individually deformable portions. Convex ribs are respectively formed on opposite sides of the individually deformable portions to elastically come into close contact with the wall surface of the protrusion.

Abstract: The invention provides a thin plate supporting container clamping device for fixing a thin plate supporting container when the thin plate supporting container in which semiconductor wafers are stored therein for transportation is placed on a loading port at a destination thereof for unloading and loading the semiconductor wafers automatically, including a hook member to be engaged with a retaining member of the thin plate supporting container; a drive unit for supporting the retracted thin plate supporting container in a state in which the hook member is supported so as to be capable of moving in the vertical direction and the hook member is engaged with the retaining member; and a control unit for adjusting a force to retract the hook member. The control unit adjusts the force to retract the hook member on the basis of detection values of a thickness sensor, a position sensor, and a retracting force detection sensor.

Abstract: Particle adhesion to a gap between a container main body and a lid unit is reduced to prevent the particle intrusion into the container main body. The inside of a thin plate supporting container is kept clean, and semiconductor wafers and the like are stored in the thin plate supporting container. The thin plate supporting container includes the container main body in which the semiconductor wafers are stored and the lid unit which blocks the container main body. In the thin plate supporting container, a protection film is provided while the gap between the lid unit and the container main body is covered with the protection film. Adhesion properties are imparted to the protection film, so that the protection film is easy to attach and detach. The protection film is formed in a size in which the entire side surface of the lid unit of the container main body is covered with the protection film. The lid unit is attached to the entire side surface of the container main body.

Abstract: The present invention provides a lid unit for closing the container body 2 that is transported with thin-plates such as semiconductor wafers or the like accommodated therein. Simplified attaching/detaching mechanisms 32 for the production line are provided at the centers of the respective sides opposing with respect to each other. The simplified attaching/detaching mechanism 32 for the production line includes a locking plate 34 for locking the second fitted portion 21 and a drive-out member 35 for allowing the drive-out member 35 to rise and set by being engaged with the locking plate 34. A locking arm 57 for fixing the drive-out member 35 is provided on the drive-out member 35 at the end in the direction of rotation. A supporting rail 56 for controlling the rising and setting movement of the locking plate 34 is provided on the drive-out member 35.

Abstract: The present invention is directed to a lid unit having a latching mechanism for firmly fixing the lid unit to a container body for containing semiconductor wafers and the like, which latching mechanism can be easily disassembled for cleaning and drying of its components, and to a wafer presser for retaining the semiconductor wafers in position when the container is shaken. The latching mechanism includes a locking member which, when projected, secures the lid unit to the container body; an actuator for moving the locking member between projected and retracted positions; a tip-side cam for pressing a tip portion of the locking member in one direction relative to the lid unit when the locking member is projected by the actuator; a base-end lower cam for pressing a base-end of the locking member in a second direction, opposite the one direction; and a base-end upper cam and a cam projection follower for pressing the base-end in the second direction.

Abstract: The attaching-and-detaching operation of a lid unit is automated using an existing attaching-and-detaching device. A lid unit for closing a container body of a thin-plate supporting container for use in storing semiconductor wafers therein is provided. A simplified attaching-and-detaching mechanism allows the lid unit to be attached and detached by easy locking and unlocking with respect to the container body. The simplified attaching-and-detaching mechanism includes a locking member engageable with a second receiving device of the container body, and a guiding member disposed at the extremity of the locking member, which guiding member reaches the second receiving device and guides the locking member into the second receiving device in a state in which the main body fits lightly in the container body. The guiding member includes a reaching portion that first reaches the second receiving device, and a guiding portion that guides the locking member to the second receiving device.

Abstract: The attaching-and-detaching operation of a lid unit, and the operation of taking in and out semiconductor wafers stored in a container body are facilitated. Thin-plate supporting units for supporting semiconductor wafers are provided in the container body of a thin-plate supporting container, and wafer holding units for pressing and supporting the semiconductor wafers, supported by the thin-plate supporting units, from a lid unit side are provided inside a lid unit. The area of a lower surface of a V-shaped groove of the wafer holding unit is increased. The V-shaped groove easily fits the peripheral portion of the semiconductor wafer when attaching the lid unit to the container body. The lower surface of a V-shaped groove of the thin-plate supporting portion is roughened to enhance slipping property with respect to the semiconductor wafer. The angle of inclination of a ridge is determined to be 2 to 5 degrees with respect to the horizontal direction.

Abstract: A wafer cassette comprises a case body and an adapter that supports substrates. There are adapters of various types corresponding to the size of the substrates to be supported. The case body and the adapter of any type are united in a manner such that fitting portions of the case body are fitted individually in fitting holes of the adapter.

Abstract: The present invention is directed to firmly fix a lid unit to a container body, facilitate cleaning and drying of components, and suppress rotation of semiconductor wafers caused by shake. The invention provides a lid unit for a manufacturing line for closing a container body of a thin plate supporting container. A simple attaching/detaching mechanism is provided with: a locking member which is projected and retained by the container body side; a feeding member which is connected to the locking member to make the locking member project/retract; a tip-side cam for pressing a tip side of the locking member to one side when the locking member is projected by the feeding member; a base-end lower cam for pressing a base-end side of the locking member to the other side; and a base-end upper cam and a cam pressing projection for pressing the base-end side to the other side in a manner similar to the base-end lower cam.

Abstract: The present invention is directed to realize accurate positioning of a slotted plate. Disclosed is a thin plate supporting container having a container body for housing therein semiconductor wafers, a lid unit for closing the container body, and slotted plates for supporting the semiconductor wafers from both sides. There are provided an upper fitting portion for supporting an upper portion of the slotted plate, and a lower fitting portion for supporting a lower portion of the slotted plate. An upper fitting piece of the upper fitting portion has a contact face having a flat plane shape which comes into contact with the slotted plate side to thereby position the slotted plate in the front/rear direction while suppressing swing of the slotted plate, and a supporting face. The upper receiving piece has a face to be contacted having a flat plane shape, and a face to be supported.

Abstract: The present invention provides a lid unit for closing the container body 2 that is transported with thin-plates such as semiconductor wafers or the like accommodated therein. Simplified attaching/detaching mechanisms 32 for the production line are provided at the centers of the respective sides opposing with respect to each other. The simplified attaching/detaching mechanism 32 for the production line includes a locking plate 34 for locking the second fitted portion 21 and a drive-out member 35 for allowing the drive-out member 35 to rise and set by being engaged with the locking plate 34. A locking arm 57 for fixing the drive-out member 35 is provided on the drive-out member 35 at the end in the direction of rotation. A supporting rail 56 for controlling the rising and setting movement of the locking plate 34 is provided on the drive-out member 35.

Abstract: A wafer cassette comprises a case body and an adapter that supports substrates. There are adapters of various types corresponding to the size of the substrates to be supported. The case body and the adapter of any type are united in a manner such that fitting portions of the case body are fitted individually in fitting holes of the adapter.