Abstract: The present invention provides a method for selecting a cancer patient for whom a combination therapy with a retinoid and a cancer treatment agent is effective, which comprises a step of selecting a cancer patient having a malignant tumor with the infiltration of cancer-associated fibroblasts in the stroma. In addition, the present invention provides a medicament which comprises a cancer patient having a malignant tumor with the infiltration of cancer-associated fibroblasts in the stroma is a subject and is administered in combination of a retinoid and a cancer therapeutic agent.

Abstract: At least one caulking group (13) that includes a plurality of caulking parts (14, 15) with different directions is formed on a plurality of thin plates (10) placed in a stacked state to fix the position of the stacked thin plates (10), and then a preset punching process is performed with respect to the thin plates (10) that have been positioned with pilot holes (12). This makes it possible to perform a high-accuracy punching process when punching the plurality of thin plates (10) placed in a stacked state, since positional deviations between the thin plates (10) are avoided and pilot pins (11) are prevented from deforming the periphery of the pilot holes (12).

Abstract: At least one caulking group (13) that includes a plurality of caulking parts (14, 15) with different directions is formed on a plurality of thin plates (10) placed in a stacked state to fix the position of the stacked thin plates (10), and then a preset punching process is performed with respect to the thin plates (10) that have been positioned with pilot holes (12). This makes it possible to perform a high-accuracy punching process when punching the plurality of thin plates (10) placed in a stacked state, since positional deviations between the thin plates (10) are avoided and pilot pins (11) are prevented from deforming the periphery of the pilot holes (12).

Abstract: In a method for manufacturing a laminated iron core from a thin sheet, the method includes coining the thin sheet from below to form a thinned bridge portion on an outer peripheral portion of an iron core piece, blanking the iron core piece from the thin sheet from above or below after forming the bridge portion, and laminating the iron core piece on another iron core piece to manufacture the laminated iron core.

Abstract: In a method for manufacturing a laminated iron core from a thin sheet, the method includes coining the thin sheet from above to form a thinned bridge portion on an outer peripheral portion of an iron core piece, blanking the iron core piece downwardly from the thin sheet using a set of an outer-shape blanking punch and a die after forming the bridge portion, wherein the outer-shape blanking punch includes a projection portion fitted into the bridge portion when blanking, and laminating the iron core piece on another iron core piece to manufacture the laminated iron core.

Abstract: In a method for manufacturing a laminated iron core from a thin sheet, the method includes coining the thin sheet from above to form a thinned bridge portion on an outer peripheral portion of an iron core piece, blanking the iron core piece downwardly from the thin sheet using a set of an outer-shape blanking punch and a die after forming the bridge portion, wherein the outer-shape blanking punch includes a projection portion fitted into the bridge portion when blanking, and laminating the iron core piece on another iron core piece to manufacture the laminated iron core.

Abstract: In a method for manufacturing a laminated iron core from a thin sheet, the method includes coining the thin sheet from below to form a thinned bridge portion on an outer peripheral portion of an iron core piece, blanking the iron core piece from the thin sheet from above or below after forming the bridge portion, and laminating the iron core piece on another iron core piece to manufacture the laminated iron core.

Abstract: This invention provides a method for forming multilayer coating film excelling in smoothness and distinctness of image, by 3-coat-1-bake system in which a step of applying onto a coating object a water-based intermediate paint (X) to form an intermediate coating film; a step of adjusting the solid content of the intermediate coating film to 70-100 mass %; a step of applying onto the intermediate coating film a water-based base coating paint (Y) containing 30-55 mass parts of alcoholic solvent having a boiling point of 170-250° C., to form a base coating film; a step of adjusting the solid content of the base coating film to 70-100 mass %; a step of applying a clear paint (Z) comprising 40-60 mass parts of carboxyl-containing compound and 60-40 mass parts of polyepoxide onto the base coating film to form a clear coating film; and heating the intermediate coating film, base coating film and clear coating film at 100-120° C. for 3-10 minutes and thereafter further heating them at 130-160° C.

Abstract: This invention provides an automobile water-based paint capable of forming coating film of little metallic mottling and excellent flip-flop property and smoothness, which comprises hydroxyl-containing resin, viscosity-regulating agent and hydrophobic solvent, the viscosity-regulating agent being a copolymer obtained by copolymerizing a monomeric mixture containing a (meth)acrylic acid (salt), monomer represented by the following formula (1) [in which R1 stands for hydrogen or methyl, R2 and R3 stand for hydrogen, methyl or ethyl, R4 stands for C8-24 hydrocarbon group, and n is an integer of 3-60], alkyl (meth)acrylate of which alkyl moiety has 1-4 carbons and a monomer having at least two polymerizable unsaturated groups per molecule, at specific ratios.

Abstract: An inspection system is disclosed, which inspects a wiring pattern on a high multilayer printed wiring board while determining a calibration position with a smaller number of error reports, and predicts the verification work time by evaluating the inspection property. Based on the CAD data of each layer of the printed wiring board to be inspected and the layer structure information, an intensity composition map viewed through the inspection surface is generated. A plurality of sets of the intensity components of the inspection surface are determined, and after determining at least one intensity evaluation region covering all the sets, the intensity evaluation region is imaged by an inspection unit and the statistical intensity value corresponding to each intensity component is determined and substituted into the intensity composition map. The inspection is conducted by determining the optimal calibration position for determining an inspection threshold value in this way.

Abstract: This invention provides a method for forming multilayer coating film excelling in smoothness and distinctness of image, by 3-coat-1-bake system in which a step of applying onto a coating object a water-based intermediate paint (X) to form an intermediate coating film; a step of adjusting the solid content of the intermediate coating film to 70-100 mass %; a step of applying onto the intermediate coating film a water-based base coating paint (Y) containing 30-55 mass parts of alcoholic solvent having a boiling point of 170-250° C., to form a base coating film; a step of adjusting the solid content of the base coating film to 70-100 mass %; a step of applying a clear paint (Z) comprising 40-60 mass parts of carboxyl-containing compound and 60-40 mass parts of polyepoxide onto the base coating film to form a clear coating film; and heating the intermediate coating film, base coating film and clear coating film at 100-120° C. for 3-10 minutes and thereafter further heating them at 130-160° C.

Abstract: This invention provides an automobile water-based paint capable of forming coating film of little metallic mottling and excellent flip-flop property and smoothness, which comprises hydroxyl-containing resin, viscosity-regulating agent and hydrophobic solvent, the viscosity-regulating agent being a copolymer obtained by copolymerizing a monomeric mixture containing a (meth)acrylic acid (salt), monomer represented by the following formula (1) [in which R1 stands for hydrogen or methyl, R2 and R3 stand for hydrogen, methyl or ethyl, R4 stands for C8-24 hydrocarbon group, and n is an integer of 3-60], alkyl (meth)acrylate of which alkyl moiety has 1-4 carbons and a monomer having at least two polymerizable unsaturated groups per molecule, at specific ratios.

Abstract: This invention provides an electroless copper plating solution using glyoxylic acid as a reducing agent, which is small in the reacting quantity of Cannizzaro reaction, does not largely cause precipitation of the salt accumulated in the electroless copper plating solution by the plating reaction and Cannizzaro reaction, and can be used stably over a long period of time. The electroless copper plating solution comprises copper ion, a complexing agent for copper ion, a reducing agent for copper ion and a pH adjusting agent, wherein said reducing agent for copper ion is glyoxylic acid or a salt thereof, said pH adjusting agent is potassium hydroxide and said electroless copper plating solution contains at least one member selected from metasilicic acid, metasilicic acid salt, germanium dioxide, germanic acid salt, phosphoric acid, phosphoric acid salt, vanadic acid, vanadic acid salt, stannic acid and stannic acid salt in an amount of 0.0001 mol/L or more.

Abstract: An electroless copper plating solution using glyoxylic acid as a reducing agent, which is small in the reacting quantity of Cannizzaro reaction, does not largely cause precipitation of the salt accumulated in the electroless copper plating solution by the plating reaction and Cannizzaro reaction, and can be used stably over a long period of time. The electroless copper plating solution comprises copper ion, a complexing agent for copper ion, a reducing agent for copper ion and a pH adjusting agent, wherein the reducing agent for copper ion is glyoxylic acid or a salt thereof, the pH adjusting agent is potassium hydroxide and the electroless copper plating solution contains at least one member selected from metasilicic acid, metasilicic acid salt, germanium dioxide, germanic acid salt, phosphoric acid, phosphoric acid salt, vanadic acid, vanadic acid salt, stannic acid and stannic acid salt in an amount of 0.0001 mol/L or more.

Abstract: A multilayer wiring substrate which is high in connection reliability is provided through process steps of forming more than one opening, such as a via-hole in a dielectric layer laminated on a substrate, and then applying uniform copper plating to a surface portion of the dielectric layer including the opening to thereby form a wiring layer. An electroless copper plating solution with at least one of mandelonitrile and triethyltetramine mixed therein is used to perform the intended electroless copper plating.

Abstract: A method is provided for removing plating blocking ions, such as anions, in pairs with copper ions and oxidant ions of a copper ion reducing agent from an electroless copper plating solution and keeping a constant salt concentration in the electroless copper plating solution during plating. The electroless copper plating method uses a plating solution containing copper sulfate as copper ion sources, and a copper ion complexing agent as copper ion sources, glyoxylic acid as a copper ion reducing agent, and a pH conditioner. The method is characterized by precipitating and removing sulfuric and oxalic ions in said electroless copper plating solution and keeping an optimum concentration of at least one of sulfuric and oxalic ions in said electroless copper plating solution during plating.

Abstract: A method is provided for removing plating blocking ions, such as anions, in pairs with copper ions and oxidant ions of a copper ion reducing agent from an electroless copper plating solution and keeping a constant salt concentration in the electroless copper plating solution during plating. The electroless copper plating method uses a plating solution containing copper sulfate as copper ion sources, and a copper ion complexing agent as copper ion sources, glyoxylic acid as a copper ion reducing agent, and a pH conditioner. The method is characterized by precipitating and removing sulfuric and oxalic ions in said electroless copper plating solution and keeping an optimum concentration of at least one of sulfuric and oxalic ions in said electroless copper plating solution during plating.

Abstract: An electroless copper plating solution using glyoxylic acid as a reducing agent, which is small in the reacting quantity of Cannizzaro reaction, does not largely cause precipitation of the salt accumulated in the electroless copper plating solution by the plating reaction and Cannizzaro reaction, and can be used stably over a long period of time. The electroless copper plating solution comprises copper ion, a complexing agent for copper ion, a reducing agent for copper ion and a pH adjusting agent, wherein the reducing agent for copper ion is glyoxylic acid or a salt thereof, the pH adjusting agent is potassium hydroxide and the electroless copper plating solution contains at least one member selected from metasilicic acid, metasilicic acid salt, germanium dioxide, germanic acid salt, phosphoric acid, phosphoric acid salt, vanadic acid, vanadic acid salt, stannic acid and stannic acid salt in an amount of 0.0001 mol/L or more.

Abstract: A multilayer wiring substrate which is high in connection reliability is provided through process steps of forming more than one opening, such as a via-hole in a dielectric layer laminated on a substrate, and then applying uniform copper plating to a surface portion of the dielectric layer including the opening to thereby form a wiring layer. An electroless copper plating solution with at least one of mandelonitrile and triethyltetramine mixed therein is used to perform the intended electroless copper plating.

Abstract: A multilayer wiring substrate which is high in connection reliability is provided through process steps of forming more than one opening, such as a via-hole in a dielectric layer laminated on a substrate, and then applying uniform copper plating to a surface portion of the dielectric layer including the opening to thereby form a wiring layer. An electroless copper plating solution with at least one of mandelonitrile and triethyltetramine mixed therein is used to perform the intended electroless copper plating. An alternative process makes use of a electroless copper plating solution with chosen additive agents or “admixtures” containing at least one of mandelonitrile and triethyltetramine plus eriochrome black T along with at least one of 2,2′-bipyridyl, 1,10-phenanthroline, and 2,9-dimethyl-1,10-phenanthroline.