Abstract: An electroless copper plating solution using glyoxylic acid as a reducing agent, which is small in the reacting quantity of Cannizzaro reaction, does not largely cause precipitation of the salt accumulated in the electroless copper plating solution by the plating reaction and Cannizzaro reaction, and can be used stably over a long period of time. The electroless copper plating solution comprises copper ion, a complexing agent for copper ion, a reducing agent for copper ion and a pH adjusting agent, wherein the reducing agent for copper ion is glyoxylic acid or a salt thereof, the pH adjusting agent is potassium hydroxide and the electroless copper plating solution contains at least one member selected from metasilicic acid, metasilicic acid salt, germanium dioxide, germanic acid salt, phosphoric acid, phosphoric acid salt, vanadic acid, vanadic acid salt, stannic acid and stannic acid salt in an amount of 0.0001 mol/L or more.

Abstract: An object of the present invention is to provide an elecroless copper plating solution using glyoxylic acid or a salt of glyoxylic acid as the reducing agent in which the amount of Cannizzaro reaction product is small, and the mechanical property of the obtained plated film is excellent, and to provide a supplementary solution for the electroless copper plating solution, a plating method capable of stably forming a plated film using the electroless copper plating solution, and a method of manufacturing a wiring board having an excellent connecting reliability of a through hole.

Abstract: This invention provides an electroless copper plating solution using glyoxylic acid as a reducing agent, which is small in the reacting quantity of Cannizzaro reaction, does not largely cause precipitation of the salt accumulated in the electroless copper plating solution by the plating reaction and Cannizzaro reaction, and can be used stably over a long period of time.

Abstract: Providing a multilayer wiring substrate high in connection reliability through process steps of forming more than one opening such as a via-hole in a dielectric layer laminated on a substrate and then applying uniform copper plating to a surface portion of the dielectric layer including the opening to thereby form a wiring layer.

Abstract: A wiring pattern inspecting method comprises irradiating a test object provided with wiring patterns formed in a plurality of layers with x-rays, obtaining a variable-density image signal corresponding to the thickness of the wiring patterns superposed in a plurality of layers including superposed sections of the wiring patterns, extracting a plurality of image signals, the number of which corresponding to that of the superposed wiring patterns, from the variable-density image signal, and comparing end point information or isolated point information about the wiring patterns obtained from image signal representing a larger number of superposed wiring patterns, and branch information about the end points or the isolated points on the wiring points, obtained from the extracted image signal representing a smaller number of superposed wiring patterns to inspect the wiring patterns for defects in the wiring patterns. The wiring pattern inspecting method is carried out by a wiring pattern inspecting system.

Abstract: An X-ray inspection apparatus and method in which an object to be inspected is irradiated with characteristic X-rays containing at least one wavelength which affords a high X-ray absorbance in the object to be inspected. A transmitted X-ray image which has passed through the object to be inspected is detected, and the object to be inspected is inspected on the basis of the transmitted X-ray image. The method and apparatus are utilized to fabricate a multi-layer printed circuit board.

Abstract: In order to join a first plate element such as a rear quarter panel of an automobile and a second plate element such as a roof panel together, an edge portion of the first plate element is provided with a joggled portion. The joggled portion is formed integrally with a general portion of the first plate element by way of a shoulder. The joggled portion includes an offset reinforcing portion having a band-shaped recess along the shoulder. A major portion lying closer to the terminal edge of the joggled portion than the reinforcing portion includes a joining surface to which an edge portion of the second plate element is joined in a face-to-face contact in such a manner that a gap is defined between an terminal edge of the edge portion and the shoulder. A welding material is built up into the recess of the reinforcing portion through the gap to thereby join the first and second plate elements together.

Abstract: In order to join a first plate element such as a rear quarter panel of an automobile and a second plate element such as a roof panel together, an edge portion of the first plate element is provided with a joggled portion. The joggled portion is formed integrally with a general portion of the first plate element by way of a shoulder. The joggled portion includes an offset reinforcing portion having a band-shaped recess along the shoulder. A major portion lying closer to the terminal edge of the joggled portion than the reinforcing portion includes a joining surface to which an edge portion of the second plate element is joined in a face-to-face contact in such a manner that a gap is defined between an terminal edge of the edge portion and the shoulder. A welding material is built up into the recess of the reinforcing portion through the gap to thereby join the first and second plate elements together.