Patents by Inventor Tadashi Iijima

Tadashi Iijima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10998369
    Abstract: A solid-state imaging device including: a first substrate having a pixel unit, and a first semiconductor substrate and a first wiring layer; a second substrate with a circuit, and a second semiconductor substrate and a second wiring layer; and a third substrate with a circuit, and a third semiconductor substrate and a third wiring layer. The first and second substrates are bonded together such that the first wiring layer and the second semiconductor substrate are opposed to each other. The device includes a first coupling structure for electrically coupling a circuit of the first substrate and the circuit of the second substrate. The first coupling structure includes a via in which electrically-conductive materials are embedded in a first through hole that exposes a wiring line in the first wiring layer and in a second through hole that exposes a wiring line in the second wiring layer or a film-formed structure.
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: May 4, 2021
    Assignee: Sony Semiconductor Solutions Corporation
    Inventors: Hideto Hashiguchi, Reijiroh Shohji, Hiroshi Horikoshi, Ikue Mitsuhashi, Tadashi Iijima, Takatoshi Kameshima, Minoru Ishida, Masaki Haneda
  • Publication number: 20210104571
    Abstract: There is provided a solid-state imaging device including: a first substrate including a first semiconductor substrate and a first wiring layer, the first semiconductor substrate having a pixel unit with pixels; a second substrate including a second semiconductor substrate and a second wiring layer, the second semiconductor substrate having a circuit with a predetermined function; and a third substrate including a third semiconductor substrate and a third wiring layer, the third semiconductor substrate having a circuit with a predetermined function, the first, second, and third substrates being stacked in this order, the first substrate and the second substrate being bonded together with the first wiring layer and the second wiring layer opposed to each other, a first coupling structure on bonding surfaces of the first substrate and the second substrate, and including an electrode junction structure with electrodes formed on the respective bonding surfaces in direct contact with each other.
    Type: Application
    Filed: March 23, 2018
    Publication date: April 8, 2021
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Reijiroh SHOHJI, Masaki HANEDA, Hiroshi HORIKOSHI, Minoru ISHIDA, Takatoshi KAMESHIMA, Ikue MITSUHASHI, Hideto HASHIGUCHI, Tadashi IIJIMA
  • Publication number: 20210104572
    Abstract: There is provided a solid-state imaging device including first, second, and third substrates stacked in this order. The first substrate includes a first semiconductor substrate and a first wiring layer. A pixel unit is formed on the first semiconductor substrate. The second substrate includes a second semiconductor substrate and a second wiring layer. The third substrate includes a third semiconductor substrate and a third wiring layer. A first coupling structure couples two of the first, second, and third substrates to each other includes a via. The via has a structure in which electrically-conductive materials are embedded in one through hole and another through hole, or a structure in which films including electrically-conductive materials are formed on inner walls of the through holes. The one through hole exposes a first wiring line in one of the wiring layers. The other through hole exposes a second wiring line in another wiring layer.
    Type: Application
    Filed: March 23, 2018
    Publication date: April 8, 2021
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Takatoshi KAMESHIMA, Hideto HASHIGUCHI, Ikue MITSUHASHI, Hiroshi HORIKOSHI, Reijiroh SHOHJI, Minoru ISHIDA, Tadashi IIJIMA, Masaki HANEDA
  • Publication number: 20210104570
    Abstract: [Object] To provide a solid-state imaging device and an electronic apparatus with further improved performance.
    Type: Application
    Filed: March 23, 2018
    Publication date: April 8, 2021
    Inventors: IKUE MITSUHASHI, REIJIROH SHOHJI, MINORU ISHIDA, TADASHI IIJIMA, TAKATOSHI KAMESHIMA, HIDETO HASHIGUCHI, HIROSHI HORIKOSHI, MASAKI HANEDA
  • Publication number: 20200258924
    Abstract: The present disclosure relates to a backside illumination type solid-state imaging device, a manufacturing method for a backside illumination type solid-state imaging device, an imaging apparatus, and electronic equipment by which the manufacturing cost can be reduced. A singulated memory circuit and a singulated logic circuit are laid out in a horizontal direction and are embedded by an oxide film and flattened, and then are stacked so as to be contained in a plane direction under a solid-state imaging element. The present disclosure can be applied to an imaging apparatus.
    Type: Application
    Filed: October 16, 2018
    Publication date: August 13, 2020
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Taizo TAKACHI, Yuichi YAMAMOTO, Suguru SAITO, Satoru WAKIYAMA, Yoichi OOTSUKA, Naoki KOMAI, Kaori TAKIMOTO, Tadashi IIJIMA, Masaki HANEDA, Masaya NAGATA
  • Publication number: 20200243591
    Abstract: [Object] To further improve performance of a solid-state imaging device. [Solution] There is provided a solid-state imaging device including: a first substrate; a second substrate; and a third substrate that are stacked in this order. The first substrate includes a first semiconductor substrate and a first multi-layered wiring layer stacked on the first semiconductor substrate. The first semiconductor substrate has a pixel unit formed thereon. The pixel unit has pixels arranged thereon. The second substrate includes a second semiconductor substrate and a second multi-layered wiring layer stacked on the second semiconductor substrate. The second semiconductor substrate has a circuit formed thereon. The circuit has a predetermined function. The third substrate includes a third semiconductor substrate and a third multi-layered wiring layer stacked on the third semiconductor substrate. The third semiconductor substrate has a circuit formed thereon. The circuit has a predetermined function.
    Type: Application
    Filed: March 23, 2018
    Publication date: July 30, 2020
    Inventors: TADASHI IIJIMA, TAKATOSHI KAMESHIMA, IKUE MITSUHASHI, HIROSHI HORIKOSHI, HIDETO HASHIGUCHI, REIJIROH SHOHJI, MINORU ISHIDA, MASAKI HANEDA
  • Publication number: 20200105814
    Abstract: A solid-state imaging device including: a first substrate having a pixel unit, and a first semiconductor substrate and a first wiring layer; a second substrate with a circuit, and a second semiconductor substrate and a second wiring layer; and a third substrate with a circuit, and a third semiconductor substrate and a third wiring layer. The first and second substrates are bonded together such that the first wiring layer and the second semiconductor substrate are opposed to each other. The device includes a first coupling structure for electrically coupling a circuit of the first substrate and the circuit of the second substrate. The first coupling structure includes a via in which electrically-conductive materials are embedded in a first through hole that exposes a wiring line in the first wiring layer and in a second through hole that exposes a wiring line in the second wiring layer or a film-formed structure.
    Type: Application
    Filed: March 23, 2018
    Publication date: April 2, 2020
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Hideto HASHIGUCHI, Reijiroh SHOHJI, Hiroshi HORIKOSHI, Ikue MITSUHASHI, Tadashi IIJIMA, Takatoshi KAMESHIMA, Minoru ISHIDA, Masaki HANEDA
  • Publication number: 20200105813
    Abstract: [Object] To provide a solid-state imaging device and an electronic apparatus with further improved performance. [Solution] A solid-state imaging device including: a first substrate on which a pixel unit is formed, and a first semiconductor substrate and a first multi-layered wiring layer are stacked; a second substrate on which a circuit having a predetermined function is formed, and a second semiconductor substrate and a second multi-layered wiring layer are stacked; and a third substrate on which a circuit having a predetermined function is formed, and a third semiconductor substrate and a third multi-layered wiring layer are stacked. The first substrate, the second substrate, and the third substrate are stacked in this order. The pixel unit has pixels arranged thereon. The first substrate and the second substrate are bonded together in a manner that the first multi-layered wiring layer and the second semiconductor substrate are opposed to each other.
    Type: Application
    Filed: March 23, 2018
    Publication date: April 2, 2020
    Inventors: HIDETO HASHIGUCHI, REIJIROH SHOHJI, HIROSHI HORIKOSHI, IKUE MITSUHASHI, TADASHI IIJIMA, TAKATOSHI KAMESHIMA, MINORU ISHIDA, MASAKI HANEDA
  • Publication number: 20200098815
    Abstract: [Object] To further improve performance of a solid-state imaging device.
    Type: Application
    Filed: March 23, 2018
    Publication date: March 26, 2020
    Inventors: TAKATOSHI KAMESHIMA, HIDETO HASHIGUCHI, IKUE MITSUHASHI, HIROSHI HORIKOSHI, REIJIROH SHOHJI, MINORU ISHIDA, TADASHI IIJIMA, MASAKI HANEDA
  • Publication number: 20200091217
    Abstract: [Object] To provide a solid-state imaging device and an electronic apparatus with further improved performance. [Solution] A solid-state imaging device including: a first substrate on which a pixel unit is formed, and a first semiconductor substrate and a first multi-layered wiring layer are stacked; a second substrate on which a circuit having a predetermined function is formed, and a second semiconductor substrate and a second multi-layered wiring layer are stacked; and a third substrate on which a circuit having a predetermined function is formed, and a third semiconductor substrate and a third multi-layered wiring layer are stacked. The first substrate, the second substrate, and the third substrate are stacked in this order. The pixel unit has pixels arranged thereon. The first substrate and the second substrate are bonded together with the first multi-layered wiring layer and the second semiconductor substrate opposed to each other.
    Type: Application
    Filed: March 23, 2018
    Publication date: March 19, 2020
    Inventors: HIROSHI HORIKOSHI, MINORU ISHIDA, REIJIROH SHOHJI, TADASHI IIJIMA, TAKATOSHI KAMESHIMA, HIDETO HASHIGUCHI, IKUE MITSUHASHI, MASAKI HANEDA
  • Publication number: 20200080358
    Abstract: Provided is a sliding door device which is capable of retracting a sliding door diagonally. Such a sliding door device 1 includes rails 7a and 7b for guiding the sliding door 2 to move in a retracting direction A from an open position to a closed position with respect to a main body 3 and guiding the sliding door 2 to move forward or backward in a front view of the sliding door 2 until reaching the closed position, a rod-shaped trigger 8 provided on one of the main body 3 and the sliding door 2, and a retracting device 9? provided on the other of the main body 3 and the sliding door 2 and retracting the trigger 8 while sliding in an axial direction D of the trigger 8 so that the sliding door 2 can move forward or backward.
    Type: Application
    Filed: September 4, 2019
    Publication date: March 12, 2020
    Applicant: SUGATSUNE KOGYO CO., LTD.
    Inventors: Tadashi IIJIMA, Kyosuke UCHINO
  • Patent number: 9702308
    Abstract: A diesel engine, includes: an exhaust gas recirculation device that recirculates an exhaust gas emitted from the diesel engine to an intake side of the diesel engine; an intake air amount sensor that measures an intake air amount of the diesel engine; a NOx measurement sensor that measures NOx contained in the exhaust gas emitted from the diesel engine; and a control device that obtains a correction value for correcting a measured value by the intake air amount sensor based on a difference between first information on NOx obtained based on information on a rotation speed of the diesel engine and information on a load and second information on NOx measured by the NOx measurement sensor to control the exhaust gas recirculation device based on the measured value by the intake air amount sensor corrected using the correction value.
    Type: Grant
    Filed: September 13, 2012
    Date of Patent: July 11, 2017
    Assignee: Komatsu Ltd.
    Inventors: Mitsuru Nakashima, Tadashi Iijima, Kaoru Sakurai, Kouichi Okaya, Takashi Sakasai
  • Patent number: 9539546
    Abstract: An exhaust gas processing device includes a NOx detection sensor, a first catalyst provided to a first branch pipe, a second catalyst provided to a second branch pipe, a first pressure sensor and a second pressure sensor which are arranged on the upstream side of the first catalyst and the second catalyst and which detect pressures in the first branch pipe and the second branch pipe, and a control device that obtains flow rates of exhaust gas flowing through the first branch pipe and the second branch pipe based on detection values of the first pressure sensor and the second pressure sensor and obtains amounts of reducing agent to be given to the first catalyst and the second catalyst from the obtained flow rates and a concentration of NOx of the exhaust gas.
    Type: Grant
    Filed: July 24, 2013
    Date of Patent: January 10, 2017
    Assignee: Komatsu Ltd.
    Inventors: Izumi Nishizawa, Tadashi Iijima, Takumi Sugihara
  • Patent number: 9382690
    Abstract: An engine unit mounted to a vehicle frame, the engine unit includes: an engine; an engine support mechanism to be coupled to the vehicle frame, with at least one vibration absorbing mechanism disposed on each of both sides of the engine in an orthogonal direction to a crankshaft of the engine, to support the engine; an aftertreatment device to purify exhaust gas emitted from the engine; a base bracket provided to the engine support mechanism; and an upper bracket detachably fixed and mounted to the base bracket, the upper bracket supporting the aftertreatment device.
    Type: Grant
    Filed: November 19, 2012
    Date of Patent: July 5, 2016
    Assignee: Komatsu Ltd.
    Inventors: Kozo Okuda, Tadashi Iijima, Godo Ozawa, Muneo Harada, Naoto Ikeda
  • Publication number: 20160027840
    Abstract: According to one embodiment, a solid-state imaging device includes a first light-receiving portion and a first light guide layer. The first light-receiving portion is formed in the surface of a semiconductor substrate. The first light guide layer is formed to correspond to a portion above the first light-receiving portion, and has an inverse tapered shape in which the width becomes larger from an upper surface a lower surface. The inverse tapered shape ranges from the upper surface the lower surface.
    Type: Application
    Filed: October 8, 2015
    Publication date: January 28, 2016
    Applicant: Kabushiki Kaisha Toshiba
    Inventor: Tadashi IIJIMA
  • Publication number: 20150224447
    Abstract: An exhaust gas processing device includes a NOx detection sensor, a first catalyst provided to a first branch pipe, a second catalyst provided to a second branch pipe, a first pressure sensor and a second pressure sensor which are arranged on the upstream side of the first catalyst and the second catalyst and which detect pressures in the first branch pipe and the second branch pipe, and a control device that obtains flow rates of exhaust gas flowing through the first branch pipe and the second branch pipe based on detection values of the first pressure sensor and the second pressure sensor and obtains amounts of reducing agent to be given to the first catalyst and the second catalyst from the obtained flow rates and a concentration of NOx of the exhaust gas.
    Type: Application
    Filed: July 24, 2013
    Publication date: August 13, 2015
    Applicant: KOMATSU LTD.
    Inventors: Izumi Nishizawa, Tadashi Iijima, Takumi Sugihara
  • Publication number: 20150219029
    Abstract: A diesel engine, includes: an exhaust gas recirculation device that recirculates an exhaust gas emitted from the diesel engine to an intake side of the diesel engine; an intake air amount sensor that measures an intake air amount of the diesel engine; a NOx measurement sensor that measures NOx contained in the exhaust gas emitted from the diesel engine; and a control device that obtains a correction value for correcting a measured value by the intake air amount sensor based on a difference between first information on NOx obtained based on information on a rotation speed of the diesel engine and information on a load and second information on NOx measured by the NOx measurement sensor to control the exhaust gas recirculation device based on the measured value by the intake air amount sensor corrected using the correction value.
    Type: Application
    Filed: September 13, 2012
    Publication date: August 6, 2015
    Applicant: Komatsu Ltd.
    Inventors: Mitsuru Nakashima, Tadashi Iijima, Kaoru Sakurai, Kouichi Okaya, Takashi Sakasai
  • Publication number: 20150211209
    Abstract: An engine unit mounted to a vehicle frame, the engine unit includes: an engine; an engine support mechanism to be coupled to the vehicle frame, with at least one vibration absorbing mechanism disposed on each of both sides of the engine in an orthogonal direction to a crankshaft of the engine, to support the engine; an aftertreatment device to purify exhaust gas emitted from the engine; a base bracket provided to the engine support mechanism; and an upper bracket detachably fixed and mounted to the base bracket, the upper bracket supporting the aftertreatment device.
    Type: Application
    Filed: November 19, 2012
    Publication date: July 30, 2015
    Applicant: KOMATSU LTD.
    Inventors: Kozo Okuda, Tadashi Iijima, Godo Ozawa, Muneo Harada, Naoto Ikeda
  • Publication number: 20150048468
    Abstract: According to one embodiment, a solid-state imaging device includes a first light-receiving portion and a first light guide layer. The first light-receiving portion is formed in the surface of a semiconductor substrate. The first light guide layer is formed to correspond to a portion above the first light-receiving portion, and has an inverse tapered shape in which the width becomes larger from an upper surface a lower surface. The inverse tapered shape ranges from the upper surface the lower surface.
    Type: Application
    Filed: March 6, 2014
    Publication date: February 19, 2015
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventor: Tadashi IIJIMA
  • Patent number: D776520
    Type: Grant
    Filed: October 23, 2015
    Date of Patent: January 17, 2017
    Assignee: SUGATSUNE KOGYO CO., LTD.
    Inventors: Tadashi Iijima, Mitsuru Sugiura