Patents by Inventor Tadashi Kosaka
Tadashi Kosaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8823872Abstract: An image pickup module includes a cover member, an image pickup device chip including photodiodes, a fixing member which is arranged around the image pickup device chip and which connects the cover member and the image pickup device chip together, a rewiring substrate arranged on the side opposite to the cover member of the image pickup device chip, connection members for connecting the image pickup device chip with the rewiring substrate, and a space surrounded by the cover member, the image pickup device chip, and the fixing member. The image pickup device chip includes a semiconductor substrate. The semiconductor substrate includes through-hole electrodes penetrating the substrate. When an area corresponding to the fixing member in the orthogonal projection of the image pickup module with respect to the cover module is defined as a fixed area, the through-hole electrodes and the connection members are arranged in the fixed area.Type: GrantFiled: August 18, 2011Date of Patent: September 2, 2014Assignee: Canon Kabushiki KaishaInventors: Koji Tsuduki, Shin Hasegawa, Tadashi Kosaka, Yasuhiro Matsuki, Takanori Suzuki, Akiya Nakayama
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Patent number: 8790950Abstract: A method of manufacturing an optical sensor includes providing a semiconductor wafer including a plurality of pixel areas, providing a light transmissive substrate including a light transmissive wafer with a plurality of light transmissive members attached thereto, the plurality of light transmissive members being arranged on a first main surface of the light transmissive wafer and each of plurality of light transmissive members emitting ? rays, an amount of the ? rays being smaller than or equal to 0.05 c/cm2·h, fixing the light transmissive substrate onto the semiconductor wafer together by a fixing member, and dividing the semiconductor wafer and the light transmissive substrate that are fixed together into individual pieces.Type: GrantFiled: August 16, 2011Date of Patent: July 29, 2014Assignee: Canon Kabushiki KaishaInventors: Takanori Suzuki, Tadashi Kosaka, Koji Tsuduki, Yasuhiro Matsuki, Shin Hasegawa, Akiya Nakayama
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Publication number: 20130286566Abstract: A base body includes a fiducial stage part provided with an inner terminal group, and an upper stage part located at a side of an outer edge of a package with respect to the fiducial stage part and protruding with respect to the fiducial stage part through a step part. A frame body is bonded to the upper stage part, and an inner edge of the frame body is located at the side of the outer edge of the package with respect to the step part.Type: ApplicationFiled: April 24, 2013Publication date: October 31, 2013Applicant: CANON KABUSHIKI KAISHAInventors: Koji Tsuduki, Takanori Suzuki, Tadashi Kosaka, Yasuhiro Matsuki, Shin Hasegawa, Fujio Ito, Hisatane Komori, Yasushi Kurihara
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Publication number: 20130286592Abstract: A package includes a base body to which an electronic device is fixed, a lid body that faces the electronic device, and a frame body that encloses at least one of a space between the electronic device and the lid body, and the electronic device. The frame body has a first portion located at a side of an inner edge of the frame body with respect to an outer edge of the base body, and a second portion located at a side of an outer edge of the frame body with respect to the outer edge of the base body, in an X direction from the inner edge of the frame body toward the outer edge of the frame body.Type: ApplicationFiled: April 24, 2013Publication date: October 31, 2013Applicant: CANON KABUSHIKI KAISHAInventors: Koji Tsuduki, Takanori Suzuki, Tadashi Kosaka, Yasuhiro Matsuki, Shin Hasegawa, Hisatane Komori, Yasushi Kurihara, Fujio Ito, Kazuya Notsu
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Publication number: 20130286565Abstract: A method of manufacturing an electronic component includes a first step of preparing a mounting member formed by bonding a peripheral region of a base body having an outer terminal connected with a wiring member, and a frame body, while heating the base body and the frame body; a second step of fixing the electronic device to the base body; and a third step of bonding the lid body and the frame body. A condition ?L, ?F, ?B<?C is satisfied, where ?L is a thermal expansion coefficient of the lid body, ?F is a thermal expansion coefficient of the frame body, ?B is a thermal expansion coefficient of the base body, and ?C is a thermal expansion coefficient of the wiring member.Type: ApplicationFiled: April 24, 2013Publication date: October 31, 2013Applicant: CANON KABUSHIKI KAISHAInventors: Koji Tsuduki, Takanori Suzuki, Tadashi Kosaka, Yasuhiro Matsuki, Shin Hasegawa, Fujio Ito, Hisatane Komori, Yasushi Kurihara
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Patent number: 8309433Abstract: A method of manufacturing an optical sensor includes the steps of providing a semiconductor wafer having a plurality of pixel areas; forming a grid-like rib enclosing each pixel area on the semiconductor wafer, the grid-like rib having a predetermined width and being formed from a fixing member; providing a light-transmissive substrate having a gap portion on a main surface thereof, the gap portion having at least one of a groove having a width smaller than the grid-like rib and a plurality of through-holes; fixing the semiconductor wafer and the light-transmissive substrate such that the grid-like rib and the gap portion face each other; and cutting the fixed semiconductor wafer and light-transmissive substrate into pieces such that each piece includes one pixel area.Type: GrantFiled: August 16, 2011Date of Patent: November 13, 2012Assignee: Canon Kabushiki KaishaInventors: Yasuhiro Matsuki, Takanori Suzuki, Koji Tsuduki, Shin Hasegawa, Tadashi Kosaka, Akiya Nakayama
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Publication number: 20120050590Abstract: A method of manufacturing an optical sensor includes providing a semiconductor wafer including a plurality of pixel areas, providing a light transmissive substrate including a light transmissive wafer with a plurality of light transmissive members attached thereto, the plurality of light transmissive members being arranged on a first main surface of the light transmissive wafer and each of plurality of light transmissive members emitting ? rays, an amount of the ? rays being smaller than or equal to 0.05 c/cm2·h, fixing the light transmissive substrate onto the semiconductor wafer together by a fixing member, and dividing the semiconductor wafer and the light transmissive substrate that are fixed together into individual pieces.Type: ApplicationFiled: August 16, 2011Publication date: March 1, 2012Applicant: CANON KABUSHIKI KAISHAInventors: Takanori Suzuki, Tadashi Kosaka, Koji Tsuduki, Yasuhiro Matsuki, Shin Hasegawa, Akiya Nakayama
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Publication number: 20120052612Abstract: A method of manufacturing an optical sensor includes the steps of providing a semiconductor wafer having a plurality of pixel areas; forming a grid-like rib enclosing each pixel area on the semiconductor wafer, the grid-like rib having a predetermined width and being formed from a fixing member; providing a light-transmissive substrate having a gap portion on a main surface thereof, the gap portion having at least one of a groove having a width smaller than the grid-like rib and a plurality of through-holes; fixing the semiconductor wafer and the light-transmissive substrate such that the grid-like rib and the gap portion face each other; and cutting the fixed semiconductor wafer and light-transmissive substrate into pieces such that each piece includes one pixel area.Type: ApplicationFiled: August 16, 2011Publication date: March 1, 2012Applicant: CANON KABUSHIKI KAISHAInventors: Yasuhiro Matsuki, Takanori Suzuki, Koji Tsuduki, Shin Hasegawa, Tadashi Kosaka, Akiya Nakayama
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Publication number: 20120044415Abstract: An image pickup module includes a cover member, an image pickup device chip including photodiodes, a fixing member which is arranged around the image pickup device chip and which connects the cover member and the image pickup device chip together, a rewiring substrate arranged on the side opposite to the cover member of the image pickup device chip, connection members for connecting the image pickup device chip with the rewiring substrate, and a space surrounded by the cover member, the image pickup device chip, and the fixing member. The image pickup device chip includes a semiconductor substrate. The semiconductor substrate includes through-hole electrodes penetrating the substrate. When an area corresponding to the fixing member in the orthogonal projection of the image pickup module with respect to the cover module is defined as a fixed area, the through-hole electrodes and the connection members are arranged in the fixed area.Type: ApplicationFiled: August 18, 2011Publication date: February 23, 2012Applicant: CANON KABUSHIKI KAISHAInventors: Koji Tsuduki, Shin Hasegawa, Tadashi Kosaka, Yasuhiro Matsuki, Takanori Suzuki, Akiya Nakayama
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Patent number: 7026654Abstract: To provide a package for an optical semiconductor having a light-emitting device and a light-receiving device in one package, in which a groove is provided between the light-emitting device and the light-receiving device to thereby avoid rays of light from the light-emitting device to directly enter the light-receiving device.Type: GrantFiled: April 3, 2003Date of Patent: April 11, 2006Assignee: Canon Kabushiki KaishaInventors: Masahiko Igaki, Makoto Ogura, Akio Atsuta, Tadashi Kosaka
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Publication number: 20040264748Abstract: A fingerprint input apparatus which is smaller than the conventional one and in which a stable and fine image can be obtained is provided at a reasonable price. The fingerprint input apparatus has: solid state image pickup devices on which a finger of a fingerprint input target person is put; LED chips for emitting light into the finger; a solid state image pickup device substrate on which the solid state image pickup devices are arranged; and a wiring substrate on which the solid state image pickup device substrate and the LED chips are arranged, wherein while relatively moving positions of a fingertip of the finger and the solid state image pickup devices, the light emitted from the LED chip and scattered from the inside of the fingertip is received by the solid state image pickup devices, thereby reading a fingerprint image of the finger. A frame-shaped member is arranged between the LED chip and the solid state image pickup device substrate on the wiring substrate.Type: ApplicationFiled: June 23, 2004Publication date: December 30, 2004Applicant: Canon Kabushiki KaishaInventors: Makoto Ogura, Tadashi Kosaka
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Publication number: 20030189213Abstract: To provide a package for an optical semiconductor having a light-emitting device and a light-receiving device in one package, in which a groove is provided between the light-emitting device and the light-receiving device to thereby avoid rays of light from the light-emitting device to directly enter the light-receiving device.Type: ApplicationFiled: April 3, 2003Publication date: October 9, 2003Inventors: Masahiko Igaki, Makoto Ogura, Akio Atsuta, Tadashi Kosaka
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Publication number: 20020053742Abstract: An IC package has a substrate having recesses formed on the side wall thereof, an insulating film for covering an opening of each recess on the side of a principal surface of the substrate, and an IC chip mounted on a mount surface side of the film on the substrate, wherein a conductive portion formed on each recess is used as an external connection terminal for the IC chip. A method of assembling an IC package has the steps of forming a substrate having a plurality of through holes each having an insulating film covering one of the openings of each through hole, mounting one or more IC chips on a principal surface of the substrate on the insulating film side, and electrically connecting the IC chip and the through holes, sealing the substrate with the IC chip mounted thereon with insulating resin, and cut the substrate with the IC chip mounted thereon to expose the side wall of each through hole.Type: ApplicationFiled: December 5, 2001Publication date: May 9, 2002Inventors: Fumio Hata, Tadashi Kosaka, Hisatane Komori
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Patent number: 6383835Abstract: An IC package has a substrate having recesses formed on the side wall thereof, an insulating film for covering an opening of each recess on the side of a principal surface of the substrate, and an IC chip mounted on a mount surface side of the film on the substrate, wherein a conductive portion formed on each recess is used as an external connection terminal for the IC chip. A method of assembling an IC package has the steps of forming a substrate having a plurality of through holes each having an insulating film covering one of the openings of each through hole, mounting one or more IC chips on a principal surface of the substrate on the insulating film side, and electrically connecting the IC chip and the through holes, sealing the substrate with the IC chip mounted thereon with insulating resin, and cut the substrate with the IC chip mounted thereon to expose the side wall of each through hole.Type: GrantFiled: August 30, 1996Date of Patent: May 7, 2002Assignee: Canon Kabushiki KaishaInventors: Fumio Hata, Tadashi Kosaka, Hisatane Komori
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Patent number: 5209978Abstract: A soft capsule composed of a plurality of cells coalesced to each other and filling substances encapsulated in the individual cells, the wall of at least one of the cells being formed of a material different from a material forming the wall of at least one of the other cells, and said capsule being seamless.Type: GrantFiled: October 10, 1991Date of Patent: May 11, 1993Assignee: Taisho Pharmaceutical Co., Ltd.Inventors: Tadashi Kosaka, Kazuki Omata, Tatsuo Hashimoto, Teruaki Yamazaki, Kazuo Hayashi, Tomiya Hosoi, Kenichi Ikuta