Abstract: A method of manufacturing a semiconductor device according to one embodiment includes: preparing a semiconductor water which is partitioned into a plurality of first semiconductor chips, the plurality of first semiconductor chips including a first group of first semiconductor chips and a second group of first semiconductor chips; providing a second semiconductor chip over at least one of first semiconductor chips of the first group; providing a sealer on the first semiconductor chips of the second group; and grinding one face of the semiconductor wafer which is on the opposite side from a face on which the second semiconductor chip and the sealer are provided.

Abstract: A method of manufacturing a semiconductor device according to one embodiment includes: preparing a semiconductor water which is partitioned into a plurality of first semiconductor chips, the plurality of first semiconductor chips including a first group of first semiconductor chips and a second group of first semiconductor chips; providing a second semiconductor chip over at least one of first semiconductor chips of the first group; providing a sealer on the first semiconductor chips of the second group; and grinding one face of the semiconductor wafer which is on the opposite side from a face on which the second semiconductor chip and the sealer are provided.

Abstract: A semiconductor device manufacturing method is provided. First and second semiconductor chips are prepared, including first and second electrodes on first and second surfaces respectively. The second semiconductor chip includes a third electrode on a third surface opposite to the second surface. The third electrode overlaps the second electrode. The second surface includes an electrode-free region that is free of any electrode. A sealing resin is applied on the first surface of the first semiconductor chip. A second surface of the first semiconductor chip is held by a bonding tool including a pressing surface and a supporting-portion projected from the pressing surface. The pressing surface is made into contact with the second electrode. The supporting-portion is arranged at a position facing the electrode-free region. The second semiconductor chip is stacked over the first semiconductor chip by the bonding tool to electrically connect the third electrode to the first electrode.

Abstract: Provided is a method for manufacturing a semiconductor device, which includes: preparing a semiconductor wafer; and peeling off an adhesive layer from the semiconductor wafer. The prepared semiconductor wafer includes at least one semiconductor chip having a bump electrode group formed by arraying bump electrodes in a matrix, and the adhesive layer formed on one surface having the bump electrodes. The bump electrode group is formed by arraying the bump electrodes so that the number of bump electrodes in a second direction can be smaller than that in a first direction. To peel off the adhesive layer from the semiconductor wafer, the adhesive layer is peeled off from the semiconductor wafer along the first direction from one end side of the semiconductor wafer.

Abstract: A semiconductor device includes a first semiconductor, a second semiconductor, and an insulating resin. The first semiconductor chip includes first and second electrodes formed on first and second surfaces thereof, respectively. The second semiconductor chip includes a third electrode formed on a third surface thereof. The insulating resin film includes a flux activator. The insulating resin film is provided a space between the first and the second semiconductor chips.

Abstract: A semiconductor device manufacturing method is provided. First and second semiconductor chips are prepared, including first and second electrodes on first and second surfaces respectively. The second semiconductor chip includes a third electrode on a third surface opposite to the second surface. The third electrode overlaps the second electrode. The second surface includes an electrode-free region that is free of any electrode. A sealing resin is applied on the first surface of the first semiconductor chip. A second surface of the first semiconductor chip is held by a bonding tool including a pressing surface and a supporting-portion projected from the pressing surface. The pressing surface is made into contact with the second electrode. The supporting-portion is arranged at a position facing the electrode-free region. The second semiconductor chip is stacked over the first semiconductor chip by the bonding tool to electrically connect the third electrode to the first electrode.

Abstract: A highly crimped conjugate fiber cheese package which is obtained by layering on a paper bobbin a conjugate fiber consisting of a plurality of single filament composed of polytrimethylene terephthalate components having different intrinsic viscosities and consisting of at least 90 mol % of a trimethylene terephthalate unit and no more than 10 mol % of another ester repeating unit and laminated to each other in a side-by-side type, the cheese package being characterized by satisfying the following conditions (1)-(4). (1) The single filament composing the conjugate fiber has cross-sectional shape which is flat cross-section with a flatness of 1.1-3 as the ratio between the long axis and short axis. (2) The developed crimp elongation of the conjugate fiber is 30-200%. (3) The relationship between the contact area (compressed net area) S (cm2) between the paper bobbin and conjugate fiber and the wound weight W (kg) satisfies the following formula (1): 2?W?0.

Abstract: A polytrimethylene terephthalate preoriented package, formed of wound layers and weighing 2 kilograms or more, of a poly (trimethylene terephthalate), in which the yarn package satisfies the following conditions (1), (2) and (3): (1) a difference in diameters between the edge portions and middle portion of the package is in a range from 0 to 5 mm; (2) a difference in dry thermal shrinking stress values between the yarn laid at the end portions and the yarn at the middle portion of the package is 0.01 cN/dtex or less; and (3) a yarn size evenness variation value U % is 1.5% or less, and a coefficient of variance of periodicity of yarn size variation is 0.4 or less, both as measured when the wound preoriented yarn is being unwound from the package.

Abstract: A polytrimethylene terephthalate preoriented package, formed of wound layers and weighing 2 kilograms or more, of a poly (trimethylene terephthalate), in which the yarn package satisfies the following conditions (1), (2) and (3): (1) a difference in diameters between the edge portions and middle portion of the package is in a range from 0 to 5 mm; (2) a difference in dry thermal shrinking stress values between the yarn laid at the end portions and the yarn at the middle portion of the package is 0.01 cN/dtex or less; and (3) a yarn size evenness variation value U% is 1.5% or less, and a coefficient of variance of periodicity of yarn size variation is 0.4 or less, both as measured when the wound preoriented yarn is being unwound from the package.

Abstract: A package of polyester type conjugate fiber of either a side-by-side type or an eccentric sheath/core type in which two kinds of polyester components are adhered to each other to form a single filament, wherein at least one of the components consisting of the single filament is polytrimethylene terephthalate containing repeating units of trimethylene terephthalate of 90 mol % or more, which package is formed of 2 kg or more of the conjugate fiber and satisfies the following items (1) to (3): (1) the difference in diameter between a selvage portion and a central portion of the package is 10 mm or less, (2) a winding width of the package is in a range from 60 to 250 mm and a diameter of the package is in a range from 100 to 400 mm, and (3) the difference in dry-heat shrinkage stress value between the conjugate fibers layered in the selvage portion and the central portion of the package is 0.05 cN/dtex or less.

Abstract: The present invention provides a polytrimethylene terephthalate composite fiber characterized in that the composite fiber is a plurality of single filament which comprises two kinds of polyester components laminated to each other in a side-by-side manner or an eccentric sheath-core manner, at least one polyester component is polytrimethylene terephthalate and the composite fiber satisfies the following conditions: the content of trimethylene terephthalate cyclic dimer in polytrimethylene terephthalate is 2.5 wt % or less, the fiber-fiber dynamic friction coefficient is from 0.2 to 0.4, the degree of intermingling is from 2 to 60 point/m and/or the number of twists is from 2 to 60 T/m and the fiber size fluctuation U % is 1.5% or less.

Abstract: A package of polyester type conjugate fiber of either a side-by-side type or an eccentric sheath/core type in which two kinds of polyester components are adhered to each other to form a single filament, wherein at least one of the components consisting of the single filament is polytrimethylene terephthalate containing repeating units of trimethylene terephthalate of 90 mol % or more, which package is formed of 2 kg or more of the conjugate fiber and satisfies the following items (1) to (3): (1) the difference in diameter between a selvage portion and a central portion of the package is 10 mm or less, (2) a winding width of the package is in a range from 60 to 250 mm and a diameter of the package is in a range from 100 to 400 mm, and (3) the difference in dry-heat shrinkage stress value between the conjugate fibers layered in the selvage portion and the central portion of the package is 0.05 cN/dtex or less.

Abstract: A poly(trimethylene terephthalate)-based conjugate fiber characterized in that the fiber is composed of single filaments which are combined with two polyester components in a side-by-side manner or an eccentric sheath-core manner, that at least one of the two polyester components forming the single filaments is a poly(trimethylene terephthalate), and that the fiber satisfies the following conditions: (1) the stretch elongation of crimp manifested prior to boiling water treatment is 20% or less; (2) the breaking elongation is from 25 to 100%; and (3) the maximum stress value of a dry heat shrinkage stress is from 0.01 to 0.24 cN/dtex.

Abstract: A package of polyester type conjugate fiber of either a side-by-side type or an eccentric sheath/core type in which two kinds of polyester components are adhered to each other to form a single filament, wherein at least one of the components consisting of the single filament is polytrimethylene terephthalate containing repeating units of trimethylene terephthalate of 90 mol % or more, which package is formed of 2 kg or more of the conjugate fiber and satisfies the following items (1) to (3): (1) the difference in diameter between a selvage portion and a central portion of the package is 10 mm or less, (2) a winding width of the package is in a range from 60 to 250 mm and a diameter of the package is in a range from 100 to 400 mm, and (3) the difference in dry-heat shrinkage stress value between the conjugate fibers layered in the selvage portion and the central portion of the package is 0.05 cN/dtex or less.

Abstract: The present invention provides a package of poly(trimethylene terephthalate) drawn yarn obtained by a direct spin-draw process of poly(trimethylene terephthalate), having an industrially practical winding amount and excellent in unwindability during high speed unwinding after storage over a long period of time, and a method for producing the same. A fabric obtained by weaving or knitting using a package of poly(trimethylene terephthalate) drawn yarn of the invention has good quality without defects such as streaky defects and a tight yarn.

Abstract: A poly(trimethylene terephthalate)-based conjugate fiber characterized in that the fiber is composed of single filaments which are combined with two polyester components in a side-by-side manner or an eccentric sheath-core manner, that at least one of the two polyester components forming the single filaments is a poly(trimethylene terephthalate), and that the fiber satisfies the following conditions:

Abstract: The invention provides false twisted yarn of a polyester composite fiber characterized in that the fiber is composed of single-filaments which are laminated with two types of polyester components in a side-by-side or eccentrical core/sheath fashion, at least one of the two polyester components is poly(trimethylene terephthalate), the difference in intrinsic viscosity between the two polyester components is 0.05-0.9 (dl/g), and the false twisted yarn has latent crimpability and has at least 50% stretching elongation of developed crimps prior to boiling water treatment.

Abstract: The invention provides a poly(trimethylene terephthalate) drawn yarn pirn. The drawn yarn pirn of the invention comprises poly(trimethylene terephthalate) drawn yarn having an intrinsic viscosity of 0.7-1.3 dl/g, a heat shrinkage stress-exhibiting initial temperature of 55° C. or higher, a heat shrinkage stress extreme temperature of 150-190° C. and a breaking elongation of 36-60%, wound at a wound hardness of 80-90. The drawn yarn pirn of the invention exhibits satisfactory reelability even with high-speed false twisting, as well as minimal yarn breakage and fluff generation, thereby giving a textured yarn with satisfactory quality.

Abstract: The present invention provides a polyester-based conjugate fiber pirn that is formed by winding, in a pirn shape, a conjugate fiber wherein the fiber is formed from a single filament prepared by combining two types of polyester components in a side-by-side manner or in an eccentric sheath-core manner, and at least one polyester component forming the single filament is a poly(trimethylene terephthalate) containing 90% by mole or more of trimethylene terephthalate repeating units, the winding amount of the conjugate fiber pirn being 1 kg or more, the winding angle in a taper portion thereof being from 15 to 21°, the winding hardness in the cylinder portion thereof being from 75 to 92, and the starting temperature of thermal shrinkage stress manifestation of the conjugate fiber being from 50 to 80° C.

Abstract: The present invention provides a polytrimethylene terephthalate monofilament yarn excellent in softness, bending recovery or durability against a long term use. The inventive polytrimethylene terephthalate monofilament yarn is constituted by trimethylene terephthalate composed of 90 mol % or more of trymethylene terephthalate repeating units and 10 mol % or less of other ester repeating units, wherein the yarn has a single-fiber size of 50 dtex or more, an intrinsic viscosity in a range from 0.8 to 1.3 dl/g, and a boiling water shrinkage of 2% or less.