Patents by Inventor Tadashi Nakano

Tadashi Nakano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6828258
    Abstract: An insulating film which enables not only to obtain a good film quality but to achieve an excellent filling property, thick film formation and planarization simultaneously, an insulating film forming coating solution for forming the insulating film, and a method of manufacturing the insulating film are set forth. An insulating film forming coating solution containing as a main component a solution of a polymer obtained by co-hydrolysis of trialkoxysilane expressed by a general formula, SiH(OR)3—, methyltrialkoxysilane expressed by a general formula, SiCH3(OR)3—, and tetraalkoxysilane expressed by a general formula, Si(OR)4 is coated on a semiconductor substrate (1) having a step portion, and after it is heated and dried in an inert gas atmosphere, an insulating film (6) which is composed of a silane-derived compound expressed by a general formula, SiHx(CH3)yO2−(x+y)/2, where, 0<x<1, 0<y<1, x+y≦1 is formed.
    Type: Grant
    Filed: April 29, 2002
    Date of Patent: December 7, 2004
    Assignee: Kawasaki Microelectronics, Inc.
    Inventors: Tadashi Nakano, Kyoji Tokunaga
  • Publication number: 20040209455
    Abstract: An insulating film which enables not only to obtain a good film quality but to achieve an excellent filling property, thick film formation and planarization simultaneously, an insulating film forming coating solution for forming the insulating film, and a method of manufacturing the insulating film are set forth. An insulating film forming coating solution containing as a main component a solution of a polymer obtained by co-hydrolysis of trialkoxysilane expressed by a general formula, SiH(OR)3, methyltrialkoxysilane expressed by a general formula, SiCH3(OR)3, and tetraalkoxysilane expressed by a general formula, Si(OR)4 is coated on a semiconductor substrate (1) having a step portion, and after it is dried and heated in an inert gas atmosphere, an insulating film (6) which is composed of a silane-derived compound expressed by a general formula, SiHx(CH3)yO2−(x+y)/2, where, 0<x<1, 0<y<1,x+y≦1 is formed.
    Type: Application
    Filed: May 19, 2004
    Publication date: October 21, 2004
    Applicant: Kawasaki Microelectronics, Inc.
    Inventors: Tadashi Nakano, Kyoji Tokunaga
  • Publication number: 20030191275
    Abstract: Aromatic aliphatic ether solvents, such as anisole, methylanisole, and phenetole, have been found useful in formulating coating solutions of polymeric dielectric materials and as a clean up solvent in the coating process. A process for forming a dielectric film on a substrate includes depositing a coating solution of a dielectric material in a formulation solvent onto a surface of the substrate and depositing an aromatic aliphatic ether solvent onto an edge portion of the surface of the substrate. The process is used to form films of dielectric materials including arylene ether dielectric polymers, hydridosiloxane resins, organohydridosiloxane resins, spin-on-glass materials, partially hydrolyzed and partially condensed alkoxysilane compositions which are cured to form a nanoporous dielectric silica material, and poly(perhydrido)silazanes.
    Type: Application
    Filed: November 18, 2002
    Publication date: October 9, 2003
    Inventors: Oana Leonte, Tadashi Nakano, Kelly Beres, Kreisler Lau
  • Publication number: 20030176178
    Abstract: A wireless communication terminal including a wireless communication unit for receiving and transmitting voice signals between terminals connected through a voice channel and a data channel, a signal input/output unit for inputting and outputting voice signals for voice communication and a mixing unit, interposed between the wireless communication unit and signal input/output unit, for performing mixing operations to create a first mixed signal to be output to said signal input/output unit and second mixed signals each to be transmitted to the corresponding terminal. The wireless communication terminal is preferably used for wireless voice communication performed by three or more terminals without being interposed by a center apparatus (such as a server) or a repeater. Further, signal-receiving/transmitting is set for each wireless communication terminal whereupon convenience can be improved.
    Type: Application
    Filed: October 25, 2002
    Publication date: September 18, 2003
    Inventors: Syoichi Urata, Yutaka Aoki, Hiroyuki Kadosono, Shinji Kuriyama, Toshitsugu Kobayashi, Kouji Sakata, Hidefumi Takaoka, Ryoko Tamura, Tadashi Nakano, Masaki Bansho
  • Patent number: 6544666
    Abstract: A new processed steel sheet comprising of a steel base coated with a Zn or its alloy plating layer and a converted layer, which contains both of at least an insoluble or scarcely-soluble metal compound and at least a soluble metal compound. The insoluble or scarcely-soluble compound may be one or more of valve metal oxides or hydroxides, and the soluble compound may be one or more of valve metal fluorides. The converted layer may be also composed of one or more of complex compounds of Mn and Ti. The insoluble or scarcely-soluble compound acts as a barrier for insulation of a steel base from an atmosphere, while the soluble compound exhibits a self-repairing faculty to repair defective parts of the converted layer. Due to the converted layer, the processed steel sheet is remarkably improved in corrosion resistance, without the presence of chromium compounds which would put harmful influences on the environment.
    Type: Grant
    Filed: November 9, 2001
    Date of Patent: April 8, 2003
    Assignee: Nisshin Steel Co., Ltd.
    Inventors: Kouichiro Ueda, Shigeyasu Morikawa, Tadashi Nakano, Yasumi Ariyoshi, Keiji Izumi, Masanori Matsuno, Hirofumi Taketsu
  • Patent number: 6524657
    Abstract: Aromatic aliphatic ether solvents, such as anisole, methylanisole, and phenetole, have been found useful in formulating coating solutions of polymeric dielectric materials and as a clean up solvent in the coating process. A process for forming a dielectric film on a substrate includes depositing a coating solution of a dielectric material in a formulation solvent onto a surface of the substrate and depositing an aromatic aliphatic ether solvent onto an edge portion of the surface of the substrate. The process is used to form films of dielectric materials including arylene ether dielectric polymers, hydridosiloxane resins, organohydridosiloxane resins, spin-on-glass materials, partially hydrolyzed and partially condensed alkoxysilane compositions which are cured to form a nanoporous dielectric silica material, and poly(perhydrido)silazanes.
    Type: Grant
    Filed: May 7, 2002
    Date of Patent: February 25, 2003
    Assignee: Honeywell International Inc.
    Inventors: Oana M. Leonte, Tadashi Nakano, Kelly M. Beres, Kreisler Lau
  • Publication number: 20020183476
    Abstract: Aromatic aliphatic ether solvents, such as anisole, methylanisole, and phenetole, have been found useful in formulating coating solutions of polymeric dielectric materials and as a clean up solvent in the coating process. A process for forming a dielectric film on a substrate includes depositing a coating solution of a dielectric material in a formulation solvent onto a surface of the substrate and depositing an aromatic aliphatic ether solvent onto an edge portion of the surface of the substrate. The process is used to form films of dielectric materials including arylene ether dielectric polymers, hydridosiloxane resins, organohydridosiloxane resins, spin-on-glass materials, partially hydrolyzed and partially condensed alkoxysilane compositions which are cured to form a nanoporous dielectric silica material, and poly(perhydrido)silazanes.
    Type: Application
    Filed: May 7, 2002
    Publication date: December 5, 2002
    Applicant: Honeywell International Inc.
    Inventors: Oana M. Leonte, Tadashi Nakano, Kelly M. Beres, Kreisler Lau
  • Publication number: 20020158310
    Abstract: It is an object to provide an insulating film which enables not only to obtain a good film quality but to achieve an excellent filling property, thick film formation and planarization simultaneously, and to provide an insulating film forming coating solution for forming the insulating film, and to provide a method of manufacturing the insulating film.
    Type: Application
    Filed: April 29, 2002
    Publication date: October 31, 2002
    Applicant: Kawasaki Steel Corporation
    Inventors: Tadashi Nakano, Kyoji Tokunaga
  • Patent number: 6444272
    Abstract: The present invention relates to a single-packaged epoxy resin coating composition comprising: (A) an epoxy resin having at least one epoxy group in a molecule and capable of being dissolved in the following organic solvent (D), (B) a ketimines compound having at least two primary amino groups blocked with a carbonyl compound and having no other amino groups than the above blocked amino groups, (C) a dehydrating agent and (D) an organic solvent, wherein the above organic solvent (D) comprises a hydrocarbon base solvent selected from the group consisting of an aliphatic hydrocarbon base solvent and an aromatic hydrocarbon base solvent having a boiling point of 148° C. or higher in a proportion of at least 95% by weight based on the above organic solvent (D).
    Type: Grant
    Filed: May 26, 2000
    Date of Patent: September 3, 2002
    Assignee: Kansai Paint Co., Ltd.
    Inventors: Koji Matsuda, Yoshimitsu Adachi, Tadashi Nakano, Shinji Iida
  • Patent number: 6423651
    Abstract: It is an object to provide an insulating film which enables not only to obtain a good film quality but to achieve an excellent filling property, thick film formation and planarization simultaneously, and to provide an insulating film forming coating solution for forming the insulating film, and to provide a method of manufacturing the insulating film. An insulating film forming coating solution containing as a main component a solution of a polymer obtained by co-hydrolysis of trialkoxysilane expressed by a general formula, SiH(OR)3, methyltrialkoxysilane expressed by a general formula, SiCH3(OR)3, and tetraalkoxysilane expressed by a general formula, Si(OR)4 is coated on a semiconductor substrate (1) having a step portion, and after it is heated and dried in an inert gas atmosphere, an insulating film (6) which is composed of a silane-derived compound expressed by a general formula, SiHx(CH3)yO2−(x+y)/2, where, 0<x<1, 0<y<1, x+y≦1 is formed.
    Type: Grant
    Filed: August 29, 1995
    Date of Patent: July 23, 2002
    Assignee: Kawasaki Steel Corporation
    Inventors: Tadashi Nakano, Kyoji Tokunaga
  • Publication number: 20020090529
    Abstract: A new processed steel sheet comprises a steel base coated with a Zn or its alloy plating layer and a converted layer, which contains both of at least an insoluble or scarcely-soluble metal compound and at least a soluble metal compound. The insoluble or scarcely-soluble compound may be one ore more of valve metal oxides or hydroxides, and the soluble compound may be one or more of valve metal fluorides. The converted layer may be also composed of one ore more of complex compounds of Mn and Ti. The insoluble or scarcely-soluble compound acts as a barrier for insulation of a steel base from an atmosphere, while the soluble compound exhibits a self-repairing faculty to repair defective parts of the converted layer. Due to the converted layer, the processed steel sheet is remarkably improved in corrosion resistance, without presence of chromium compounds which would put harmful influences on the environment.
    Type: Application
    Filed: November 9, 2001
    Publication date: July 11, 2002
    Applicant: Nisshin Steel Co., Ltd.
    Inventors: Kouichiro Ueda, Shigeyasu Morikawa, Tadashi Nakano, Yasumi Ariyoshi, Keiji Izumi, Masanori Matsuno, Hirofumi Taketsu
  • Patent number: 6413202
    Abstract: Aromatic aliphatic ether solvents, such as anisole, methylanisole, and phenetole, have been found useful in formulating coating solutions of polymeric dielectric materials and as a clean up solvent in the coating process. A process for forming a dielectric film on a substrate includes depositing a coating solution of a dielectric material in a formulation solvent onto a surface of the substrate and depositing an aromatic aliphatic ether solvent onto an edge portion of the surface of the substrate. The process is used to form films of dielectric materials including arylene ether dielectric polymers, hydridosiloxane resins, organohydridosiloxane resins, spin-on-glass materials, partially hydrolyzed and partially condensed alkoxysilane compositions which are cured to form a nanoporous dielectric silica material, and poly(perhydrido)silazanes.
    Type: Grant
    Filed: June 28, 1999
    Date of Patent: July 2, 2002
    Assignee: AlliedSignal, Inc.
    Inventors: Oana M. Leonte, Tadashi Nakano, Kelly M. Beres, Kreisler Lau
  • Patent number: 6368661
    Abstract: The present invention provides a method for repair coating characterized by applying an epoxy-polyamine resin base coating composition comprising an epoxy resin having at least one epoxy resin in a molecule and an amine base curing agent as resinous components on a deteriorated coating film which is selected from a tar epoxy resin coating film, a tar urethane resin coating film, a modified epoxy resin coating film, a modified urethane resin coating film, an epoxy-polyamine resin coating film and an epoxy urethane resin coating film and which has a water content of 0.3 to 5% by weight.
    Type: Grant
    Filed: February 15, 2001
    Date of Patent: April 9, 2002
    Assignee: Kansai Paint Co., Ltd.
    Inventor: Tadashi Nakano
  • Patent number: 6338869
    Abstract: The present invention provides a coating composition capable of forming a coating film having good performances such as an adhesive property even if coated on a deteriorated coating film surface of a high rust-preventive coating film of a tar epoxy resin coating material and the like without providing pre-treatment, and a coating method thereof. The above coating composition is a coating composition of an organic solvent type or solventless type comprising an epoxy resin having at least one epoxy group in a molecule and an amine base curing agent as resin components, wherein moisture of 1 to 30 parts by weight per 100 parts by weight of the solid matter of the coating composition is contained.
    Type: Grant
    Filed: June 16, 2000
    Date of Patent: January 15, 2002
    Assignee: Kansai Paint Co., Ltd.
    Inventors: Tadashi Nakano, Akira Saito, Shigeo Inomata
  • Publication number: 20010019736
    Abstract: The present invention provides a method for repair coating characterized by applying an epoxy-polyamine resin base coating composition comprising an epoxy resin having at least one epoxy resin in a molecule and an amine base curing agent as resinous components on a deteriorated coating film which is selected from a tar epoxy resin coating film, a tar urethane resin coating film, a modified epoxy resin coating film, a modified urethane resin coating film, an epoxy-polyamine resin coating film and an epoxy urethane resin coating film and which has a water content of 0.3 to 5% by weight.
    Type: Application
    Filed: February 15, 2001
    Publication date: September 6, 2001
    Inventor: Tadashi Nakano
  • Publication number: 20010005856
    Abstract: A system to control a plurality of server computers as a group on a single client computer. An input/output (I/O) control system controls the command input/output from a plurality of consoles to a single server. The input/output control system controls the I/O status of the commands from each console to the server, and controls the I/O of commands from the various consoles based on the respective I/O statuses. A console display receives a message from a server and displays server console information in a manner identifiable from other server console information in response to the message received from the server.
    Type: Application
    Filed: December 14, 2000
    Publication date: June 28, 2001
    Inventors: Miyuki Tomikawa, Eiichiro Sakurai, Tadashi Nakano, Jyunko Kunita, Rie Takeuchi
  • Patent number: 6063703
    Abstract: A metal interconnection is prepared by forming an underlying metal film of high melting point metal such as Ti and/or high melting point metal compound such as TiN layers above a semiconductor substrate, plasma etching the surface of the underlying metal film in a gas atmosphere containing chloride, and forming an interconnecting metal film such as Al, Cu, Au and Ag on the underlying metal film. Alternatively, a metal interconnection is prepared by forming an insulating film above a semiconductor substrate, forming connecting holes in the insulating film, forming an underlying metal film such as TiN on the insulating film and the bottom and side wall of the connection holes by a CVD process under controlled conditions, and forming an interconnecting metal film such as Al on the underlying metal film. The TiN film has (111) preferential orientation and the aluminum film has (111) preferential orientation, smooth surface and effective coverage.
    Type: Grant
    Filed: May 19, 1998
    Date of Patent: May 16, 2000
    Assignee: Kawasaki Steel Corporation
    Inventors: Hiroshi Shinriki, Takeshi Kaizuka, Nobuyuki Takeyasu, Tomohiro Ohta, Eiichi Kondoh, Hiroshi Yamamoto, Tomoharu Katagiri, Tadashi Nakano, Yumiko Kawano
  • Patent number: 6015457
    Abstract: Processes for producing poly (hydrido siloxane) copolymers and processes for producing solutions of such copolymers for coating semiconductor substrates are provided. The copolymers have the general formula: (HSiO.sub.1.5).sub.a (HSiO(OR)).sub.b (SiO.sub.2).sub.c, wherein R is a mixture of H and an alkyl group having between 1 and 4 carbon atoms; a+b+c=1; 0.5<a<0.99; 0.01<b<0.5; and 0<c<0.5. Processes for producing the copolymers use alkoxysilanes as starting materials. Processes for producing coating solutions include removal of water and alcohol. Films of such coating solutions are useful as planarizing dielectric layers.
    Type: Grant
    Filed: March 12, 1998
    Date of Patent: January 18, 2000
    Assignee: AlliedSignal Inc.
    Inventors: Roger Y. Leung, Tadashi Nakano
  • Patent number: 5998522
    Abstract: A coating solution for forming an insulating film used in production of semiconductor devices includes siloxanes represented by a general formula:[SiR.sub.3 O.sub.1/2 ].sub.k [SiR.sub.2 O.sub.2/2 ].sub.l [SiRO.sub.3/2 ].sub.m [SiO.sub.4/2 ].sub.nwhere each of k, l, m and n is an integer, R may be the same or different and represents at least one organic group, and a ratio of (3k+21+m) to (k+l+m+n) is between about 0.8 and about 1.3. The present invention further relates to a method for preparing the coating solution, and a method for forming the insulating film using the coating solution, including the steps of coating the coating solution on a surface of a substrate of the semiconductor device to form a coated film, fluidizing the coated film at a temperature between about 150.degree. C. to about 300.degree. C. to planarize the surface of the substrate, and curing the fluidized coated film to form the insulating film.
    Type: Grant
    Filed: March 17, 1998
    Date of Patent: December 7, 1999
    Assignee: Kawasaki Steel Corporation
    Inventors: Tadashi Nakano, Makoto Shimura, Tomohiro Ohta
  • Patent number: 5973402
    Abstract: A metal interconnection is prepared by forming an underlying metal film of high melting point metal such as Ti and/or high melting point metal compound such as TiN layers above a semiconductor substrate, plasma etching the surface of the underlying metal film in a gas atmosphere containing chloride, and forming an interconnecting metal film such as Al, Cu, Au and Ag on the underlying metal film. Alternatively, a metal interconnection is prepared by forming an insulating film above a semiconductor substrate, forming connection holes in the insulating film, forming an underlying metal film such as TiN on the insulating film and the bottom and side wall of the connection holes by a CVD process under controlled conditions, and forming an interconnecting metal film such as Al on the underlying metal film. The TiN film has (111) preferential orientation and the aluminum film has (111) preferential orientation, smooth surface and effective coverage.
    Type: Grant
    Filed: January 30, 1997
    Date of Patent: October 26, 1999
    Assignee: Kawasaki Steel Corporation
    Inventors: Hiroshi Shinriki, Takeshi Kaizuka, Nobuyuki Takeyasu, Tomohiro Ohta, Eiichi Kondoh, Hiroshi Yamamoto, Tomoharu Katagiri, Tadashi Nakano, Yumiko Kawano