Abstract: There is provided an electric device including a base member, a beam elastically deformable to bend upward and having an outline partially defined by a slit formed in the base member, a conductive pattern provided on a top surface of the beam, a contact electrode provided above the conductive pattern, the contact electrode coming into contact with the conductive pattern, and a bridge electrode elastically deformable, the bridge electrode connecting the conductive pattern and a portion of the base member outside the outline.

Abstract: There is provided an electric device including a base member, a beam elastically deformable to bend upward and having an outline partially defined by a slit formed in the base member, a conductive pattern provided on a top surface of the beam, a contact electrode provided above the conductive pattern, the contact electrode coming into contact with the conductive pattern, and a bridge electrode elastically deformable, the bridge electrode connecting the conductive pattern and a portion of the base member outside the outline.

Abstract: There is provided an electric device including a base member, a beam elastically deformable to bend upward and having an outline partially defined by a slit formed in the base member, a conductive pattern provided on a top surface of the beam, a contact electrode provided above the conductive pattern, the contact electrode coming into contact with the conductive pattern, and a bridge electrode elastically deformable, the bridge electrode connecting the conductive pattern and a portion of the base member outside the outline.

Abstract: An electronic device includes a substrate, a stationary electrode provided above the substrate, a movable electrode that is provided to face the stationary electrode, a wall portion that is provided on the substrate and surrounds the movable electrode and the stationary electrode, a film member that is fixed to the wall portion and seals space including the movable electrode and the stationary electrode, and a support portion that is provided, on an inner side of the wall portion on the substrate, in addition to the movable electrode and the stationary electrode to support the film member from within the space.

Abstract: A heating combustion tube 20 of the present invention is used in analysis of mercury in a heated state and includes a sample pyrolysis portion 10 in which a sample S is heated and decomposed, an oxidization portion 11 in which a fourth period metal oxide 13, which is a metal oxide in the fourth period on the periodic table, and a treating portion 12 in which an alkali metal compound and/or an alkali earth metal compound 14 is filled.

Abstract: An electronic device includes a substrate including an active layer, a signal electrode formed on a surface of the active layer, a first driving electrode that is formed on the surface of the active layer and is connected to a ground, and a second driving electrode including a first part that is formed on the surface of the active layer and a second part that is connected to the first part and is provided above the first driving electrode. The substrate is provided with a loop-like groove that penetrates through the active layer and encompasses the first part.

Abstract: There is provided an electric device including a base member, a beam elastically deformable to bend upward and having an outline partially defined by a slit formed in the base member, a conductive pattern provided on a top surface of the beam, a contact electrode provided above the conductive pattern, the contact electrode coming into contact with the conductive pattern, and a bridge electrode elastically deformable, the bridge electrode connecting the conductive pattern and a portion of the base member outside the outline.

Abstract: A method for manufacturing a MEMS device, includes: preparing a substrate provided with a first substrate in which a cavity is formed, and a second substrate that is bonded to a side of the first substrate and includes a slit to delimit a movable portion in a position corresponding to the cavity, the second substrate, including a first surface thereof facing the first substrate, being provided with a thermally-oxidized film selectively formed on the first surface in a position corresponding to the movable portion; forming a first electrode layer on a second surface opposite to the first surface; forming a sacrifice lager on the first electrode layer and the second substrate; forming a second electrode layer on the sacrifice layer; and removing the sacrifice layer and the thermally-oxidized film after the second electrode layer is formed.

Abstract: A method for manufacturing a MEMS device, includes: preparing a substrate provided with a first substrate in which a cavity is formed, and a second substrate that is bonded to a side of the first substrate on which the cavity is formed and includes a slit to delimit a movable portion in a position corresponding to the cavity, the second substrate, including a first surface thereof facing the first substrate, being provided with a thermally-oxidized film selectively formed on the first surface in a position corresponding to the movable portion; forming a first electrode layer on a second surface opposite to the first surface on which the thermally-oxidized film for the movable portion is formed; forming a sacrifice layer on the first electrode layer and the second substrate; forming a second electrode layer on the sacrifice layer; and removing the sacrifice layer and the thermally-oxidized film after the second electrode layer is formed.

Abstract: A method for manufacturing an elastic wave device includes forming a lower resist layer on the piezoelectric substrate; forming an upper resist layer on the lower resist layer; patterning the upper and lower resist layers with a developer with respect to which a solubility of the lower resist layer is higher than that of the upper resist layer to form a lower resist pattern and an upper resist pattern on the lower resist pattern so that a periphery of the lower resist pattern lies within a periphery of the upper resist pattern; depositing an electrode material over an entire surface of the piezoelectric substrate that has the upper resist pattern and the lower resist pattern formed thereon; and removing the upper resist pattern and the lower resist pattern to pattern the electrode material, thereby forming a comb-shaped electrode by lift-off.

Abstract: A switching device includes a stationary portion, a movable portion having a movable land portion, and a first beam portion and a second beam portion that couple the movable land portion and the stationary portion with each other. A first signal line extends over the movable land portion, the first beam portion, and the stationary portion, and has a movable contact portion on the movable land portion, a second signal line faces the movable contact portion, a first driving line extends over the movable land portion, the second beam portion, and the stationary portion, and has a movable driving electrode portion on the movable land portion, and a second driving line having a stationary driving electrode portion faces the movable driving electrode portion.

Abstract: A microswitching device includes a base, a fixed portion joined to the base, a movable portion extending along the base and having a fixed end fixed to the fixed portion, a movable contact electrode film provided on a side of the movable portion opposite the base, a pair of fixed contact electrodes joined to the fixed portion and having a region opposing the movable contact electrode film, a movable driving electrode film provided on a side of the movable portion opposite the base, and a fixed driving electrode having a region opposing the movable driving electrode film. The movable driving electrode film is thinner than the movable contact electrode film. The fixed driving electrode is joined to the fixed portion joined to the base.

Abstract: A method for manufacturing a MEMS device, includes: preparing a substrate provided with a first substrate in which a cavity is formed, and a second substrate that is bonded to a side of the first substrate on which the cavity is formed and includes a slit to delimit a movable portion in a position corresponding to the cavity, the second substrate, including a first surface thereof facing the first substrate, being provided with a thermally-oxidized film selectively formed on the first surface in a position corresponding to the movable portion; forming a first electrode layer on a second surface opposite to the first surface on which the thermally-oxidized film for the movable portion is formed; forming a sacrifice layer on the first electrode layer and the second substrate; forming a second electrode layer on the sacrifice layer; and removing the sacrifice layer and the thermally-oxidized film after the second electrode layer is formed.

Abstract: A micro-switching device includes a base substrate, a fixing member on the substrate, a movable part having an end fixed to the fixing member and extending along the substrate, a movable contact electrode provided on the movable part and facing away from the substrate, a pair of stationary contact electrodes bonded to the fixing member and including a region facing the movable contact electrode, a movable driver electrode between the movable contact electrode and the stationary end on the movable part at a surface facing away from the substrate, and a stationary driver electrode bonded to the fixing member and including an elevated portion having a region facing the movable driver electrode. The elevated portion is provided with steps facing the movable driver electrode, where the steps are closer to the substrate as they are farther from the movable contact electrode.

Abstract: An electronic device includes a substrate including an active layer, a signal electrode formed on a surface of the active layer, a first driving electrode that is formed on the surface of the active layer and is connected to a ground, and a second driving electrode including a first part that is formed on the surface of the active layer and a second part that is connected to the first part and is provided above the first driving electrode. The substrate is provided with a loop-like groove that penetrates through the active layer and encompasses the first part.

Abstract: A micro movable device includes a base substrate, a fixed portion bonded to the base substrate, a movable portion having a fixed end connected to the fixed portion and extending along the base substrate, and a piezoelectric drive provided on the movable portion and the fixed portion on a side opposite to the base substrate. The piezoelectric drive has a laminate structure provided by a first electrode film contacting the movable portion and the fixed portion, a second electrode film and a piezoelectric film between the first and the second electrode films. At least one of the movable portion and the fixed portion is provided with a groove extending along the piezoelectric drive.

Abstract: An electronic device includes a substrate, a stationary electrode provided above the substrate, a movable electrode that is provided to face the stationary electrode, a wall portion that is provided on the substrate and surrounds the movable electrode and the stationary electrode, a film member that is fixed to the wall portion and seals space including the movable electrode and the stationary electrode, and a support portion that is provided, on an inner side of the wall portion on the substrate, in addition to the movable electrode and the stationary electrode to support the film member from within the space.

Abstract: A switch includes a movable portion, a first electrode and a second electrode. The movable portion is provided on a substrate and moves with respect to the substrate. The first electrode is provided on the movable portion. The second electrode is able to contact with the first electrode and is fixed to the substrate. f×Ro×C?1.6×10?4 when an operation frequency is represented as “f” (Hz), a transmission impedance is represented as “Ro” (?), and a capacitance in “OFF” state between the first electrode and the second electrode is represented as “C” (F).

Abstract: A micro-switching device includes a fixing portion, a movable portion, a first electrode with first and second contacts, a second electrode with a third contact contacting the first contact, and a third electrode with a fourth contact opposing the second contact. In manufacturing the micro-switching device., the first electrode is formed on a substrate, and a sacrifice layer is formed on the substrate to cover the first electrode. Then, a first recess and a shallower second recess are formed in the sacrifice layer at a position corresponding to the first electrode. The second electrode is formed to have a portion opposing the first electrode via the sacrifice layer, and to fill the first recess. The third electrode is formed to have a portion opposing the first electrode via the sacrifice layer; and to fill the second recess. Thereafter the sacrifice layer is removed.

Abstract: A micro-switching device includes a movable electrode provided on a movable support having an end fixed to a fixing member. The switching device also includes first and second stationary electrodes. The movable electrode includes first and second contact portions. The first stationary electrode includes a third contact portion facing the first contact portion of the movable electrode. The second stationary electrode includes a fourth contact portion facing the second contact portion of the movable electrode. The distance between the first and the third contact portions is smaller than the distance between the second and the fourth contact portions. The switching device further includes a driving mechanism having a driving force generation region provided on the movable support. The center of gravity of the driving force generation region is closer to the second contact portion than to the first contact portion.