Abstract: A circuit module (100) includes: a substrate (10) including a plurality of inner conductors (2); a first electronic component arranged on one main surface (S1) of the substrate (10); a first resin layer (40) provided on the one main surface (S1) and configured to seal the first electronic component; a plurality of outer electrodes (B1) provided on another main surface (S2) of the substrate (10) and including a ground electrode; a conductor film (50) provided at least on an outer surface of the first resin layer (40) and a side surface (S3) of the substrate (10) and connected to the ground electrode with at least one of the plurality of inner conductors (2) interposed therebetween; and a resin film (60).

Abstract: A module includes: a substrate having a first surface and a second surface opposed to each other; a component mounted on the first surface; a sealing resin that covers the first surface and the component; a shield film formed to cover an upper surface and a side surface of the sealing resin and a side surface of the substrate; and a resist film formed to cover the second surface. The resist film has a plurality of protrusions.

Abstract: A module includes a substrate including a first surface, at least one first component mounted on the first surface, a shield member mounted on the first surface to cover the first component, and a first sealing resin arranged at least between the shield member and the first surface. The shield member includes a top surface portion in a form of a plate and a plurality of leg portions that extend from the top surface portion toward the first surface.

Abstract: A module includes a main board including a first surface, a submodule mounted on the first surface, a first component mounted on the first surface separately from the submodule, a first sealing resin formed so as to cover the first surface, the submodule, and the first component, and an external shield film formed so as to cover a surface and a side surface of the first sealing resin on a side far from the first surface and a side surface of the main board. The submodule includes a second component, a second sealing resin disposed so as to cover the second component, and an internal shield film formed so as to cover at least a part of a side surface of the second sealing resin. The internal shield film has at least a two-layer structure.

Abstract: There is provided a fuel cell system which can be started quickly, the configuration of which can be simplified and which enables cost reduction. The fuel cell system is a fuel cell system including a first power supply organizer, the first power supply organizer including a plurality of fuel cell stacks, an oxidant gas channel distributing and supplying oxidant gas to each of the fuel cell stacks, and an air supplier provided for each of the fuel cell stacks, wherein a battery is electrically connected to at least the air supplier of a fuel cell stack connected to the oxidant gas channel on a most upstream side among the plurality of fuel cell stacks.

Abstract: Provided is a fuel cell system including a plurality of fuel cell stacks, in which with a simple configuration, air retention is unlikely to occur in cooling water and a flow rate of the cooling water to each fuel cell stack can be uniformized. In a fuel cell system including a plurality of fuel cell stacks provided with a coolant flow path through which a coolant flows, the plurality of fuel cell stacks are juxtaposed in a horizontal direction, and include a supply pipeline that distributes and supplies the coolant to the coolant flow path, and a discharge pipeline that collects and discharges the coolant that has flowed through the coolant flow path, and the supply pipeline and the discharge pipeline are provided within a formation range where the coolant flow path is formed in the plurality of fuel cell stacks, in a direction of gravity.

Abstract: A module includes a substrate including a first surface, a first component mounted on first surface, and a first sealing resin sealing first component. First sealing resin contains a filler. An upper surface of first sealing resin includes a first region and a second region. A ratio of an area where the filler is exposed from first sealing resin in the second region is smaller than a ratio of an area where the filler is exposed from first sealing resin in the first region, at least the first region and side surfaces of the first sealing resin are covered with a shield film, and the second region is not covered with shield film.

Abstract: A module substrate, a sealing resin portion, and a shield are provided. The shield is provided to cover each of the sealing resin portion and a peripheral side surface of the module substrate. The shield is connected to a ground electrode. On the peripheral side surface, the shield is separated into a first surface side and a second surface side.

Abstract: A module includes a substrate, a first component, and a first sealing resin layer. The substrate includes a first principal surface. The first component is mounted on the first principal surface. The first sealing resin layer contains a filler containing an inorganic oxide as a main component. The first sealing resin layer is provided on the first principal surface. The first sealing resin layer seals the first component. A marking portion is provided on a surface of the first sealing resin layer on a side opposite to the substrate. In the first sealing resin layer, the content rate of the filler is smaller in a second portion on the side opposite to the substrate than in a first portion on the substrate.

Abstract: A module includes: a substrate having a main surface and a side surface; an electronic component mounted on the main surface; a sealing resin that covers the main surface and the electronic component; and a shield film that covers a surface of the sealing resin and the side surface of the substrate. The sealing resin includes: a resin component containing an organic resin as a main component; and a granular filler containing an inorganic oxide as a main component. On a surface of the sealing resin, which is in contact with the shield film, parts of some grains of the filler are exposed from the resin component, a surface of the resin component includes a nitrogen functional group, and the shield film is formed of a metal that is a passivation metal and a transition metal or an alloy containing the metal.

Abstract: A module includes a substrate including a first main surface, a first component mounted on the first main surface, a first sealing resin including a first upper surface, the first component being sealed with the first sealing resin, a first shield film that covers at least a part of the first upper surface of the first sealing resin, and a second shield film that covers a side surface of the first sealing resin and a side surface of the substrate. A step portion lower than the first upper surface of the first sealing resin is provided on an outer periphery of the first sealing resin. The first shield film and the second shield film are electrically connected to each other on a side surface below the step portion.

Abstract: A high frequency module in which warpage does not easily occur is provided by adjusting linear expansion coefficient, glass transition temperature, and elastic modulus of a sealing resin layer. The high frequency module includes a wiring board, a first component mounted on a lower surface of the wiring board, a plurality of connection terminals, a first sealing resin layer that coats the first component and the connection terminal, a plurality of second components mounted on an upper surface of the wiring board, a second sealing resin layer coating the second components, and a shield film. The first sealing resin layer is formed thinner than the second sealing resin layer, and the first sealing resin layer has the linear expansion coefficient of the resin smaller than the linear expansion coefficient of the resin of the second sealing resin layer.

Abstract: A module comprises: a wiring board; a first component, a second component and a third component mounted on a first main surface; a shield structure mounted on the first main surface; a first sealing resin that seals the first component and the like; and a shield film that covers an upper surface of the first sealing resin and the like, the shield structure including a top side portion and at least one sidewall portion bent from the top side portion and thus extending therefrom, the top side portion including the top side portion's conductive layer and a magnetic layer therein, the sidewall portion including the sidewall portion's conductive layer therein, the top side portion's conductive layer and the sidewall portion's conductive layer being electrically connected to a ground conductor, the magnetic layer in the top side portion being located over the first component.

Abstract: A high frequency module having a groove for shielding formed in a sealing resin layer achieves downsizing without damaging wiring electrodes formed on a wiring board or mounting components. A manufacturing method of a high frequency module includes mounting components on an upper surface of a wiring board, and then forming a sacrificial layer for forming a groove. The method further includes forming a sealing resin layer for sealing the components and the sacrificial layer, and dissolving and removing the sacrificial layer to form the groove for shielding. Finally, the method includes forming a shield film coating the surface of the sealing resin layer, and the high frequency module is manufactured. With this method, even when the groove is formed at a position overlapping with the component or a surface layer wiring electrode, the high frequency module can be downsized without damaging the component or the surface layer wiring electrode.

Abstract: A radio-frequency module 1a includes a wiring board 2, a first component 3a mounted on a lower surface 2a of the wiring board 2, a plurality of connection terminals 4, a first sealing resin layer 5 that covers the first component 3a and the connection terminals 4, a plurality of second components 3b mounted on an upper surface 2b of the wiring board 2, a second sealing resin layer 6 that covers the second components 3b, and a shield film 7. By adjusting surface roughness of a lower surface 5a of the first sealing resin layer 5, surface roughness of a lower surface 30a of the first component 3a, and surface roughness of a lower surface 4a of the connection terminal 4, it is possible to prevent abnormal deposition of plating and a crack in the first component 3a, and to prevent malfunction of the radio-frequency module 1a.

Abstract: A module is provided that includes a substrate having a first main surface, a first component mounted on the first main surface, a first sealing resin disposed so as to cover the first main surface and the first component, and a shield film covering at least an upper surface of the first sealing resin. The shield film includes a conductive layer, a first protective layer covering the conductive layer, and a second protective layer. The first protective layer is locally formed with a marking section. The second protective layer includes a first region covering the first protective layer and a second region covering the marking section.

Abstract: A module is disclosed that includes a substrate having a first main surface, a first component mounted on the first main surface, a first sealing resin disposed so as to cover the first main surface and the first component, a marking film covering at least an upper surface of the first sealing resin, and a shield film covering the marking film. An upper surface of the marking film is locally formed with a first recess.

Abstract: A module is provided that includes a substrate having a first main surface, a component mounted on the first main surface, a first sealing resin disposed so as to cover the first main surface and the component, and a shield film covering at least an upper surface of the first sealing resin. The shield film includes a protective layer exposed to the outside and a conductive layer covered by the protective layer. The color of a surface of the conductive layer closer to the protective layer is different from the color of the protective layer. Moreover, the laser absorption coefficient of a material of the protective layer is higher than the laser absorption coefficient of a material forming the surface of the conductive layer closer to the protective layer. The module includes a marking section that is not covered by the protective layer and from which the conductive layer is exposed.

Abstract: An electronic component module that includes a substrate, an inductor element, a single-sided functional component, a sealing resin, and an electromagnetic shield. The inductor element is mounted on the substrate. The single-sided functional component is mounted on a base ground conductor and a base signal conductor that are disposed on a side of the inductor element opposite to the substrate. The sealing resin has an insulating property and covers the inductor element, the base ground conductor, the base signal conductor, and the single-sided functional component. The electromagnetic shield covers the sealing resin, and a ground surface of the single-sided functional component.

Abstract: A module is provided that includes a wiring substrate having a major surface, a plurality of components mounted on the major surface, and a conductor incorporated resin body mounted on the major surface. Moreover, the conductor incorporated resin body is disposed between the plurality of components and includes a conductor pattern therein that is grounded.