Abstract: Disclosed is a method of operating a non-volatile memory device. A method of operating a non-volatile memory device according to an embodiment of the present disclosure, in a method of operating a non-volatile memory device including a log storage area, a data storage area, and an ACK generation unit, may include receiving a log and data from a cache memory, storing the received log in the log storage area, storing the received data in the data storage area, and transmitting an ACK signal to the cache memory according to a result of storing the log and the data.

Abstract: Provided are a monitoring device and method. A monitoring device includes a laser processor configured to emit a processing laser beam to perform a melting annealing process on a wafer; a laser monitor configured to emit a monitoring laser beam onto the wafer while the laser processor performs the melting annealing process, the laser monitor configured to measure reflectivity of the wafer; and a data processor configured to process data on the reflectivity measured by the laser monitor, and monitor one or more characteristics of the wafer based on the data on the reflectivity.

Abstract: Proposed is an X-ray imaging apparatus including an imaging body configured to include an X-ray generation module and an X-ray sensing module that face each other with an object in between and acquire X-ray image data, an image formation module configured to reconfigure an X-ray image of the object on the basis of the X-ray image data, a size information acquisition module configured to acquire size information on the object using the X-ray image, and a control module configured to rotate the X-ray generation module and the X-ray sensing module about a rotation axis between the X-ray generation module and the X-ray sensing module and relatively move the object along a direction of the rotation axis with respect to the X-ray generation module and the X-ray sensing module when capturing the X-ray image, wherein the control module controls a relative moving speed of the object on the basis of the size information.

Abstract: Provided are a monitoring device and method. A monitoring device includes a laser processor configured to emit a processing laser beam to perform a melting annealing process on a wafer; a laser monitor configured to emit a monitoring laser beam onto the wafer while the laser processor performs the melting annealing process, the laser monitor configured to measure reflectivity of the wafer; and a data processor configured to process data on the reflectivity measured by the laser monitor, and monitor one or more characteristics of the wafer based on the data on the reflectivity.

Abstract: A task mapping method of a NoC semiconductor device includes assigning a first task of a plurality of tasks for node control of the NoC semiconductor device to a first node of a first chip; computing tag values of second tasks of the plurality of tasks which are not assigned to the first node; and assigning the second tasks to a second node according to the tag values.

Abstract: A method of manufacturing a graphene fiber is provided. The method includes preparing a source solution including graphene oxide, supplying the source solution into a base solution containing a foreign element to form a graphene oxide fiber, separating the graphene fiber from the base solution and cleaning and drying to obtain the graphene oxide fiber containing the foreign element, and performing thermal treatment to the dried graphene oxide fiber containing the foreign element to form a graphene fiber doped with the foreign element. Elongation percentage of the graphene fiber is adjusted by concentration and spinning rate of the source solution.

Abstract: Disclosed is a simulation method and simulator for a system including a plurality of microring resonators. The simulation method according to the present disclosure may include converting the plurality of microring resonators into an equivalent model, generating a virtual system including the equivalent model, inputting an input signal to the virtual system, and outputting an output signal from the virtual system.

Abstract: Disclosed is a method of operating a non-volatile memory device. A method of operating a non-volatile memory device according to an embodiment of the present disclosure, in a method of operating a non-volatile memory device including a log storage area, a data storage area, and an ACK generation unit, may include receiving a log and data from a cache memory, storing the received log in the log storage area, storing the received data in the data storage area, and transmitting an ACK signal to the cache memory according to a result of storing the log and the data.

Abstract: There are provided a fan-out sensor package and an optical fingerprint sensor module including the same. The fan-out sensor package includes: a connection member having a 5 through-hole; an image sensor disposed in the through-hole of the connection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the connection member, the image sensor, and 10 an optical lens; and a redistribution layer disposed on the connection member, the image sensor, and the optical lens. The connection member includes a wiring layer, and the redistribution layer electrically connects the wiring layer and the connection pads to each other.

Abstract: A method of manufacturing a graphene fiber is provided. The method includes preparing a source solution including graphene oxide, supplying the source solution into a base solution containing a foreign element to form a graphene oxide fiber, separating the graphene fiber from the base solution and cleaning and drying to obtain the graphene oxide fiber containing the foreign element, and performing thermal treatment to the dried graphene oxide fiber containing the foreign element to form a graphene fiber doped with the foreign element. Elongation percentage of the graphene fiber is adjusted by concentration and spinning rate of the source solution.

Abstract: A method of manufacturing a graphene fiber is provided. The method includes preparing a source solution including graphene oxide, supplying the source solution into a coagulation solution to form a graphene oxide fiber, reducing the graphene oxide fiber to form a primary graphene fiber, and Joule-heating the primary graphene fiber to form a secondary graphene fiber.

Abstract: There are provided a fan-out sensor package and an optical fingerprint sensor module including the same. The fan-out sensor package includes: a connection member having a 5 through-hole; an image sensor disposed in the through-hole of the connection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the connection member, the image sensor, and 10 an optical lens; and a redistribution layer disposed on the connection member, the image sensor, and the optical lens. The connection member includes a wiring layer, and the redistribution layer electrically connects the wiring layer and the connection pads to each other.

Abstract: There are provided a fan-out sensor package and an optical fingerprint sensor module including the same. The fan-out sensor package includes: a connection member having a through-hole; an image sensor disposed in the through-hole of the connection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the connection member, the image sensor, and an optical lens; and a redistribution layer disposed on the connection member, the image sensor, and the optical lens. The connection member includes a wiring layer, and the redistribution layer electrically connects the wiring layer and the connection pads to each other.

Abstract: A task mapping method of a NoC semiconductor device includes assigning a first task of a plurality of tasks for node control of the NoC semiconductor device to a first node of a first chip; computing tag values of second tasks of the plurality of tasks which are not assigned to the first node; and assigning the second tasks to a second node according to the tag values.

Abstract: Provided are a monitoring device and method. A monitoring device includes a laser processor configured to emit a processing laser beam to perform a melting annealing process on a wafer; a laser monitor configured to emit a monitoring laser beam onto the wafer while the laser processor performs the melting annealing process, the laser monitor configured to measure reflectivity of the wafer; and a data processor configured to process data on the reflectivity measured by the laser monitor, and monitor one or more characteristics of the wafer based on the data on the reflectivity.

Abstract: A task mapping method of a NoC semiconductor device includes assigning a first task of a plurality of tasks for node control of the NoC semiconductor device to a first node of a first chip; computing tag values of second tasks of the plurality of tasks which are not assigned to the first node; and assigning the second tasks to a second node according to the tag values.

Abstract: A fan-out fingerprint sensor package includes a first connection member having a through-hole, a fingerprint sensor disposed in the through-hole, an encapsulant encapsulating at least portions of the first connection member and the fingerprint sensor, and a second connection member disposed on the first connection member and an active surface of the fingerprint sensor. The first connection member includes a distribution layer. The second connection member includes a first insulating layer disposed on the distribution layer and the active surface, a redistribution layer disposed on the first insulating layer, a first via connecting the redistribution layer to a connection pad of the fingerprint sensor, and a second via connecting the redistribution layer to the distribution layer. The first via passes through the first insulating layer and at least a portion of the encapsulant, and the second via passes through the first insulating layer.

Abstract: A fan-out semiconductor package includes first and second structures. The first structure includes a first semiconductor chip, a first encapsulant, and a connection member. The second structure includes a second semiconductor chip, a second encapsulant, and conductive bumps. The first and second structures are disposed so that active surfaces of the first and second semiconductor chips face each other. The conductive bumps are electrically connected to a redistribution layer, and connection pads of the first and second semiconductor chips are connected to each other through the redistribution layer in a signal manner. Signal transmission times between one point of the redistribution layer and connection pads of each of the first and second semiconductor chips are substantially the same as each other.

Abstract: A fan-out semiconductor package includes first and second structures. The first structure includes a first semiconductor chip, a first encapsulant, and a connection member. The second structure includes a second semiconductor chip, a second encapsulant, and conductive bumps. The first and second structures are disposed so that active surfaces of the first and second semiconductor chips face each other. The conductive bumps are electrically connected to a redistribution layer, and connection pads of the first and second semiconductor chips are connected to each other through the redistribution layer in a signal manner. Signal transmission times between one point of the redistribution layer and connection pads of each of the first and second semiconductor chips are substantially the same as each other.

Abstract: An automatic cooking device standardization system is provided. The automatic cooking device standardization system includes a cold storage for storing food ingredients used for cooking, a cooking chamber capable of cooking dishes according to a cooking recipe, and a conveyor unit for conveying the food ingredients for each dish from the cold storage to cooking containers in the cooking chamber according to the cooking recipe. The automatic cooking device standardization system is capable of automatically cooking dishes without requiring user's manual work.