Patents by Inventor Tae-hoon Jang

Tae-hoon Jang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor laser diode having ridge portion and method of manufacturing the same
    Publication number: 20060231850
    Abstract: Provided is a semiconductor laser diode having a ridge portion and a method of manufacturing the semiconductor laser diode. The semiconductor laser diode includes: a first clad layer, an active layer formed on the first clad layer, a second clad layer formed on the active layer and having a stripe shaped ridge portion; and a buried layer formed of AlGaInN and grown on the second clad layer except for a region of an upper surface of the ridge portion.
    Type: Application
    Filed: February 10, 2006
    Publication date: October 19, 2006
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Tan Sakong, Tae-hoon Jang, Joong-kon Son, Han-youl Ryu
  • Flip-chip bonding structure of light-emitting element using metal column
    Publication number: 20060138444
    Abstract: A flip-chip bonding structure of a light-emitting element is provided. The structure improves a heat emission efficiency by using a metal column having a high thermal conductivity instead of a solder bump. The structure includes a light-emitting element, a sub-mount, and a metal column. The metal column connects the light-emitting element with the sub-mount electrically and thermally.
    Type: Application
    Filed: September 8, 2005
    Publication date: June 29, 2006
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Won-kyoung Chio, Tae-hoon Jang, Su-hee Chae, Hyung-kun Kim
  • Solder for device package
    Publication number: 20060138652
    Abstract: A solder for device packaging including a plurality of cores, and a coating solder mixed with the cores. The cores are formed of a material having a higher thermal conductivity than the coating solder.
    Type: Application
    Filed: August 10, 2005
    Publication date: June 29, 2006
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae-hoon Jang, Won-kyoung Choi