Abstract: A power module includes a first substrate and a second substrate; a semiconductor chip; a resistor electrically connecting the first substrate and the second substrate while being spaced from the semiconductor chip in the horizontal direction, the resistor including a resistance value greater than a resistance value of the metal layer; a first sensing lead connected to a first end portion of the resistor; and a second sensing lead connected to a second end portion of the resistor.

Abstract: A power module includes a first board including an insulation layer, a first metal layer disposed on a first side of the insulation layer, and a second metal layer disposed on a second side of the insulation layer opposed to the first side of the insulation layer, a semiconductor chip disposed on the first metal layer, a heat dissipation plate connected to the second metal layer in a first direction, a housing connected to the heat dissipation plate to form an integral cooling channel therein, and a connecting body made of a clad metal in which a first material, which is connected to the heat dissipation plate and is disposed to face an inside of the cooling channel, and a second material, which is connected to the housing and is different from the first material, overlap each other in the first direction.

Abstract: Proposed is an electro-coagulation apparatus. The electro-coagulation apparatus includes a reactor having an internal space defined by a top surface, a bottom surface, and a side surface of the reactor; a plurality of electrode plates disposed spaced apart from each other inside the internal space of the reactor, and a pair of first conduits respectively connected to a front end and a rear end of the reactor. Furthermore, a cross-sectional area of the reactor is smaller than a cross-sectional area of each of the first conduits.

Abstract: A display device may include a first gate electrode on a substrate, a buffer layer on the first gate electrode, a first active pattern on the buffer layer, overlapping the first gate electrode, and including an oxide semiconductor, a source pattern and a drain pattern respectively on ends of the first active pattern, an insulation layer overlapping the source pattern and the drain pattern on the buffer layer, an oxygen supply pattern on the insulation layer, overlapping the first active pattern, and supplying oxygen to the first active pattern, a second active pattern on the insulation layer and spaced apart from the oxygen supply pattern, the second active pattern including a channel region, and a source region and a drain region, an insulation pattern on the channel region of the second active pattern, and a second gate electrode on the insulation pattern.

Abstract: There is provided a chemical supply device for use in a semiconductor manufacturing process, the chemical supply device including a bubbler, wherein the bubbler includes: a lower support surface including a lower concave portion; a side surface smoothly connected to the lower support surface through a corner curved portion; an upper surface extended from the side surface; an inlet extended from an outside of the upper surface to an inside of the bubbler, and configured to inject an output gas for causing a chemical solution contained in the bubbler to evaporate; and an outlet configured to transmit the chemical salutation evaporated in the bubbler, wherein a radius of curvature of the upper surface is greater than or equal to 45% and less than 58% of a diameter of the lower support surface.

Abstract: According to one embodiment, a chemical supply device includes: a bubbler configured to contain a chemical solution which is used in a semiconductor process and to receive an input gas for vaporizing the chemical solution into an output gas; a constant-temperature bath configured to contain the bubbler and to adjust a temperature of the chemical solution; a valve module fluidically connected with the bubbler and configured to provide channels for the chemical solution, the input gas, and the output gas; a level sensor configured to detect a remaining level of the chemical solution; a controller; and a memory configured to store a program for operating the controller, and the controller is configured to determine a target flow rate of the input gas to cause a flow rate of the output gas to have a designated flow rate, based on the remaining level of the chemical solution.

Abstract: According to to various embodiments, there is provided a chemical supply device for use in a semiconductor manufacturing process, the chemical supply device including: a bubbler configured to contain a chemical solution to be used in a semiconductor manufacturing process and to evaporate the chemical solution; a constant temperature bath configured to accommodate the bubbler and to adjust a temperature of the chemical solution; and a heat transferring structure configured to enhance temperature adjustment efficiency of the chemical solution, wherein the heat transferring structure includes: a constant temperature cup configured to provide an accommodation space to have the bubbler seated therein; a heat transferring member disposed between a side surface area of the bubbler.

Abstract: The present invention provides a lithium secondary battery which includes a positive electrode including a first lithium cobalt oxide and a second lithium cobalt oxide which have different average particle diameters (D50) from each other, a negative electrode including first graphite and second graphite which have different average particle diameters (D50) from each other, and an electrolyte including a a first additive as a nitrile-based compound, wherein the first lithium cobalt oxide and the second lithium cobalt oxide each independently contain aluminum in a concentration of 2,500 ppm to 4,000 ppm.

Abstract: A display device including: a substrate; a plurality of light-emitting elements on the substrate; and a touch sensing layer disposed on the plurality of light-emitting elements, wherein the touch sensing layer includes: a first touch conductive layer; a first insulating layer disposed on the first touch conductive layer; and a second touch conductive layer disposed on the first insulating layer, and wherein the first insulating layer includes a light-converting material that converts light into near-infrared light.

Abstract: A display device includes a first pixel including a first emission area formed to emit light having a first color in a third direction, a second pixel including a second emission area formed to emit light having a second color different from the first color, a first partition wall in which a first opening overlapping the first emission area in a plan view is defined, a second partition wall in which a second opening overlapping the second emission area in the plan view is defined, and a first layer covering the first partition wall and the second partition wall. The first partition may be provided with a first height in the third direction. The second partition wall may be provided with a second height different from the first height.

Abstract: A display device according to an embodiment includes: a substrate; a transistor that is disposed on the substrate; a light emitting diode that is disposed on the substrate, and connected to the transistor; and a passivation layer that is disposed between the transistor and the light emitting diode, wherein a surface step of the passivation layer is within a range of and including 1 nm to 30 nm.

Abstract: A visual localization method includes generating a first feature point map by using first map data calculated on the basis of a first viewpoint; generating a second feature point map by using second map data calculated on the basis of a second viewpoint different from the first viewpoint; constructing map data for localization having the first and second feature point maps integrated with each other, by compensating for a position difference between a point of the first feature point map and a point of the second feature point map; and performing visual localization by using the map data for localization.

Abstract: The present disclosure relates to a liquid crystal polyester composition that can be injection molded into an ultra-thin film and has improved fluidity, and a manufacturing method thereof. The polyester resin composition for ultra-thin injection molding includes 60 to 85% by weight of a liquid crystal polyester resin and 15 to 40% by weight of an inorganic filler having an average cross-sectional aspect ratio of 2 to 6, based on the total weight of the composition, wherein the liquid crystal polyester resin includes 0.1 to 10 mol % of hydroxybenzoic acid (HBA), 40 to 60 mol % of hydroxynaphthoic acid, 20 to 30 mol % of biphenol, and 20 to 30 mol % of terephthalic acid. The liquid crystal polyester resin composition for ultra-thin injection molding according to the present disclosure not only has excellent mechanical strength and heat resistance, but also can exhibit very excellent fluidity in a high-speed injection process.

Abstract: A vehicle power module includes an upper substrate and a lower substrate spaced from each other in a vertical direction, a semiconductor chip connected to one of the upper substrate and the lower substrate, and a spacer formed of a metal material containing copper and connecting the semiconductor chip to the other of the upper substrate and the lower substrate or to connect the upper substrate to the lower substrate, the spacer including a plurality of penetration portions formed to penetrate an inside thereof.

Abstract: A substrate processing method is provided. The substrate processing method comprises loading a substrate onto a substrate support inside a chamber, forming a plasma inside the chamber, providing a first DC pulse signal to an electromagnet that generates a magnetic field inside the chamber and processing the substrate with the plasma, wherein the first DC pulse signal is repeated at a first period including a first section and a second section subsequent to the first section, the first DC pulse signal has a first level during the first section, and the first DC pulse signal has a second level different from the first level during the second section.

Abstract: A light source module and an air conditioner including the light source module. The light source module includes: at least one light source emitting sterilizing light in a wavelength band capable of sterilizing pollutants; a substrate on which the light source is mounted, the substrate being electrically connected to the light source; and a light guide guiding a traveling direction of the sterilizing light emitted from the light source. The light guide may guide the sterilizing light such that a beam angle of the light source module becomes narrower than a beam angle of the light source.

Abstract: A vehicle power module includes an upper substrate and a lower substrate spaced from each other in a vertical direction, a semiconductor chip connected to one of the upper substrate and the lower substrate, and a spacer formed of a metal material containing copper and connecting the semiconductor chip to the other of the upper substrate and the lower substrate or to connect the upper substrate to the lower substrate, the spacer including a plurality of penetration portions formed to penetrate an inside thereof.

Abstract: In a soldering structure, a power module having the same, and a method for manufacturing the power module configured for constantly determining a height of a power module when the power module is manufactured, the soldering structure may include a soldering target portion; a metal layer including a bonding surface having a bonding region in which the soldering target portion is bonded by solder; and at least one wire located in the solder within the bonding region.

Abstract: A direct cooling type power module comprising, an enclosure filled with an insulating fluid, a power semiconductor device disposed inside the enclosure and a bonding unit comprising a porous layer, and a thermally conductive layer to which the power semiconductor device is bonded, and allowing the power semiconductor device to exchange heat with the insulating fluid by the porous layer and the thermally conductive layer.

Abstract: In a soldering structure, a power module having the same, and a method for manufacturing the power module configured for constantly determining a height of a power module when the power module is manufactured, the soldering structure may include a soldering target portion; a metal layer including a bonding surface having a bonding region in which the soldering target portion is bonded by solder; and at least one wire located in the solder within the bonding region.