Abstract: A display device includes a substrate. A light emitting element layer is disposed on the substrate and includes a pixel defining layer defining a plurality of emission areas and a non-emission area, an encapsulation layer disposed on the light emitting element layer, a touch sensing layer disposed on the encapsulation layer, and comprising a touch connection electrode. A driving electrode and a color pattern are disposed between the touch connection electrode and the driving electrode. A color filter layer is disposed on the touch sensing layer and includes a plurality of color filters, and an overcoat layer disposed on the color filter layer. The color pattern overlaps one of the plurality of emission areas and the non-emission area, and the plurality of color filters do not overlap the emission area that overlaps the color pattern.

Abstract: The present invention relates to a novel electrolyte additive, a non-aqueous electrolyte for a lithium secondary battery comprising the novel electrolyte additive, and a lithium secondary battery comprising the non-aqueous electrolyte. More specifically, the present invention relates to a non-aqueous electrolyte for a lithium secondary battery comprising an additive capable of forming a stable film on an electrode surface. The present invention also relates to a lithium secondary battery comprising such a non-aqueous electrolyte, thereby, a high temperature lifespan of the lithium secondary battery is not deteriorated, resistance does not increase when the lithium secondary battery is stored at a high temperature, and expansion of a volume (thickness) of the lithium secondary battery is suppressed when the lithium secondary battery is stored at a high temperature.

Abstract: In a soldering structure, a power module having the same, and a method for manufacturing the power module configured for constantly determining a height of a power module when the power module is manufactured, the soldering structure may include a soldering target portion; a metal layer including a bonding surface having a bonding region in which the soldering target portion is bonded by solder; and at least one wire located in the solder within the bonding region.

Abstract: The present invention relates to squid-derived peptides and uses thereof and, more specifically, to uses of squid-derived peptides squidtocin and pro-sepiatocin for prevention or treatment of V1B receptor-related diseases. It has been confirmed that the squidtocin and pro-sepiatocin according to the present invention have an effect of inducing activation of a V1B receptor which is a type of vasopressin receptor. The V1B receptor which is a type of vasopressin receptor is present in the anterior pituitary and in the hippocampal CA2 region, and it is known that the V1B receptor increases intracellular calcium concentration and is involved in response to stress and sociality. Accordingly, the squidtocin and the pro-sepiatocin according to the present invention can be used in various ways in the field of prevention, amelioration, or treatment of V1B receptor-related diseases.

Abstract: A display device includes a light emitting element disposed on a substrate. A capping layer, an antireflection layer, and an encapsulation layer are sequentially disposed on the light emitting element. The capping layer includes a first capping layer disposed on the light emitting element, and a second capping layer disposed on the first capping layer and having a refractive index greater than a refractive index of the first capping layer. A thickness of the first capping layer is in a range of about 20 ? to about 400 ?, and a thickness of the second capping layer is in a range of about 60 ? to about 400 ?.

Abstract: A continuous preparation system of a conjugated diene-based polymer having improved rolling resistance properties is provided. By utilizing the continuous preparation system a polymerization conversion ratio at an initial stage of polymerization is easy to control, long time operation is possible and productivity is excellent.

Abstract: The present invention relates to a novel electrolyte additive, a non-aqueous electrolyte for a lithium secondary battery comprising the novel electrolyte additive, and a lithium secondary battery comprising the non-aqueous electrolyte. More specifically, the present invention relates to a non-aqueous electrolyte for a lithium secondary battery comprising an additive capable of forming a stable film on an electrode surface. The present invention also relates to a lithium secondary battery comprising such a non-aqueous electrolyte, thereby, a high temperature lifespan of the lithium secondary battery is not deteriorated, resistance does not increase when the lithium secondary battery is stored at a high temperature, and expansion of a volume (thickness) of the lithium secondary battery is suppressed when the lithium secondary battery is stored at a high temperature.

Abstract: A power module includes a first substrate and a second substrate; a semiconductor chip; a resistor electrically connecting the first substrate and the second substrate while being spaced from the semiconductor chip in the horizontal direction, the resistor including a resistance value greater than a resistance value of the metal layer; a first sensing lead connected to a first end portion of the resistor; and a second sensing lead connected to a second end portion of the resistor.

Abstract: A power module includes a first board including an insulation layer, a first metal layer disposed on a first side of the insulation layer, and a second metal layer disposed on a second side of the insulation layer opposed to the first side of the insulation layer, a semiconductor chip disposed on the first metal layer, a heat dissipation plate connected to the second metal layer in a first direction, a housing connected to the heat dissipation plate to form an integral cooling channel therein, and a connecting body made of a clad metal in which a first material, which is connected to the heat dissipation plate and is disposed to face an inside of the cooling channel, and a second material, which is connected to the housing and is different from the first material, overlap each other in the first direction.

Abstract: A vehicle power module includes an upper substrate and a lower substrate spaced from each other in a vertical direction, a semiconductor chip connected to one of the upper substrate and the lower substrate, and a spacer formed of a metal material containing copper and connecting the semiconductor chip to the other of the upper substrate and the lower substrate or to connect the upper substrate to the lower substrate, the spacer including a plurality of penetration portions formed to penetrate an inside thereof.

Abstract: A substrate processing method is provided. The substrate processing method comprises loading a substrate onto a substrate support inside a chamber, forming a plasma inside the chamber, providing a first DC pulse signal to an electromagnet that generates a magnetic field inside the chamber and processing the substrate with the plasma, wherein the first DC pulse signal is repeated at a first period including a first section and a second section subsequent to the first section, the first DC pulse signal has a first level during the first section, and the first DC pulse signal has a second level different from the first level during the second section.

Abstract: A light source module and an air conditioner including the light source module. The light source module includes: at least one light source emitting sterilizing light in a wavelength band capable of sterilizing pollutants; a substrate on which the light source is mounted, the substrate being electrically connected to the light source; and a light guide guiding a traveling direction of the sterilizing light emitted from the light source. The light guide may guide the sterilizing light such that a beam angle of the light source module becomes narrower than a beam angle of the light source.

Abstract: A vehicle power module includes an upper substrate and a lower substrate spaced from each other in a vertical direction, a semiconductor chip connected to one of the upper substrate and the lower substrate, and a spacer formed of a metal material containing copper and connecting the semiconductor chip to the other of the upper substrate and the lower substrate or to connect the upper substrate to the lower substrate, the spacer including a plurality of penetration portions formed to penetrate an inside thereof.

Abstract: In a soldering structure, a power module having the same, and a method for manufacturing the power module configured for constantly determining a height of a power module when the power module is manufactured, the soldering structure may include a soldering target portion; a metal layer including a bonding surface having a bonding region in which the soldering target portion is bonded by solder; and at least one wire located in the solder within the bonding region.

Abstract: A direct cooling type power module comprising, an enclosure filled with an insulating fluid, a power semiconductor device disposed inside the enclosure and a bonding unit comprising a porous layer, and a thermally conductive layer to which the power semiconductor device is bonded, and allowing the power semiconductor device to exchange heat with the insulating fluid by the porous layer and the thermally conductive layer.

Abstract: In a soldering structure, a power module having the same, and a method for manufacturing the power module configured for constantly determining a height of a power module when the power module is manufactured, the soldering structure may include a soldering target portion; a metal layer including a bonding surface having a bonding region in which the soldering target portion is bonded by solder; and at least one wire located in the solder within the bonding region.

Abstract: A power module for a vehicle includes: a circuit board including a circuit pattern; a semiconductor chip connected to a first side of the circuit board; a lead frame disposed on the circuit board as being spaced apart from the semiconductor chip, and electrically connected to the semiconductor chip; and a cooling channel coupled to a second side of the circuit board and inserted in and jointed to a coolant flow channel of a cooler.

Abstract: A power module includes a power semiconductor device, a first power lead electrically connected to a first power terminal of the power semiconductor device, a second power lead disposed in parallel to the first power lead near the first power lead and electrically connected to a second power terminal of the power semiconductor device, and a conductive plate disposed to be spaced apart from the first power lead or the second power lead by a predetermined distance such that a region overlapping with the first power lead or the second power lead is formed.

Abstract: A power module includes a power semiconductor device, a first power lead electrically connected to a first power terminal of the power semiconductor device, a second power lead disposed in parallel to the first power lead near the first power lead and electrically connected to a second power terminal of the power semiconductor device, and a conductive plate disposed to be spaced apart from the first power lead or the second power lead by a predetermined distance such that a region overlapping with the first power lead or the second power lead is formed.