Patents by Inventor Tae-Joo Hwang

Tae-Joo Hwang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080006949
    Abstract: Provided are a semiconductor package and a method of fabricating the same. The semiconductor package includes a semiconductor chip, and a plurality of conductive balls, e.g., solder balls formed on a joint surface of the semiconductor chip. A dummy board includes openings aligned with the solder balls and is bonded to the joint surface of the semiconductor chip. An adhesive material is interposed between the semiconductor chip and the dummy board to adhere the dummy board to the semiconductor chip. The adhesive material is applied on an adhesion surface of the dummy board adhered to a joint surface of the semiconductor chip. The dummy board is adhered to the joint surface of the semiconductor chip such that the solder balls are aligned with the openings. Cheap underfill materials can be selectively used, and a process time for reflow and curing of the adhesive material can be greatly reduced.
    Type: Application
    Filed: June 19, 2007
    Publication date: January 10, 2008
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jong-Gi LEE, Tae-Joo HWANG
  • Publication number: 20070290367
    Abstract: A mold for forming a conductive bump, a method of fabricating the mold, and a method of forming a bump on a wafer using the mold are provided. The bump can be formed by employing various materials, the mold can be repeatedly used several times because the mold is not damaged, and due to a high precision, the pitch of the bumps is not limited. The mold for forming a conductive bump comprises a first substrate having a groove to form a bump; a second substrate for vacuum adsorption formed below the first substrate, and having a through-hole in communication with the groove; and a mask layer formed on the first substrate, and used to form the groove.
    Type: Application
    Filed: June 14, 2007
    Publication date: December 20, 2007
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Tae-Joo Hwang