Patents by Inventor Tae Kwang Kim
Tae Kwang Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240147845Abstract: The present disclosure relates to an organic electroluminescent device. The organic electroluminescent device of the present disclosure shows high luminous efficiency and good lifespan by comprising a specific combination of the plural kinds of host compounds and a specific hole transport compound.Type: ApplicationFiled: December 6, 2023Publication date: May 2, 2024Inventors: Kyoung-Jin PARK, Tae-Jin LEE, Jae-Hoon SHIM, Yoo Jin DOH, Hee-Choon AHN, Young-Kwang KIM, Doo-Hyeon MOON, Jeong-Eun YANG, Su-Hyun LEE, Chi-Sik KIM, Ji-Song JUN
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Patent number: 11955625Abstract: Provided are a negative electrode active material including a three-dimensional composite. The three-dimensional composite includes secondary particles containing a silicon carbide-based (SiCx, 0<x?1) nanosheet having a bent portion and amorphous carbon. Also provided are a method of producing the same, and a negative electrode and a lithium secondary battery including the negative electrode active material.Type: GrantFiled: August 20, 2021Date of Patent: April 9, 2024Assignees: SK On Co., Ltd., UNIST (Ulsan National Institute of Science and Technology)Inventors: Eunjun Park, Joon-Sup Kim, Jaekyung Sung, Yoon Kwang Lee, Tae Yong Lee, Jae Phil Cho
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Patent number: 11917907Abstract: The present disclosure relates to an organic electroluminescent device. The organic electroluminescent device of the present disclosure shows high luminous efficiency and good lifespan by comprising a specific combination of the plural kinds of host compounds and a specific hole transport compound.Type: GrantFiled: November 22, 2021Date of Patent: February 27, 2024Assignee: Rohm and Haas Electronic Materials Korea Ltd.Inventors: Kyoung-Jin Park, Tae-Jin Lee, Jae-Hoon Shim, Yoo Jin Doh, Hee-Choon Ahn, Young-Kwang Kim, Doo-Hyeon Moon, Jeong-Eun Yang, Su-Hyun Lee, Chi-Sik Kim, Ji-Song Jun
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Publication number: 20230392262Abstract: The present invention relates to a substrate processing apparatus and a substrate processing method, and more particularly to, a substrate processing apparatus and a substrate processing method capable of performing deposition on both upper and lower surfaces of a substrate in a single apparatus or a single facility when performing deposition on the lower surface of the substrate to alleviate or eliminate a bowing phenomenon of the substrate.Type: ApplicationFiled: May 31, 2023Publication date: December 7, 2023Applicant: TES CO., LTDInventor: Tae-Kwang KIM
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Patent number: 11214583Abstract: The present invention relates to a novel compound having an alkoxysilyl group and an active ester group, a method for preparing the same, a composition comprising the same, and a use, wherein the novel compound exhibits improved low moisture absorption and/or low dielectric properties when cured as an epoxy composition, but is not accompanied by loss of thermal expansion characteristics. Disclosed are a novel compound of formulae AF to LF having an alkoxysilyl group and an active ester group, and a method for preparing the same, a composition comprising the same, and a use of same.Type: GrantFiled: June 5, 2017Date of Patent: January 4, 2022Assignee: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGYInventors: Hyun-Aee Chun, Yun-Ju Kim, Sook-Yeon Park, Su-Jin Park, Tae-Kwang Kim
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Publication number: 20200165275Abstract: The present invention relates to a novel compound having an alkoxysilyl group and an active ester group, a method for preparing the same, a composition comprising the same, and a use, wherein the novel compound exhibits improved low moisture absorption and/or low dielectric properties when cured as an epoxy composition, but is not accompanied by loss of thermal expansion characteristics. Disclosed are a novel compound of formulae AF to LF having an alkoxysilyl group and an active ester group, and a method for preparing the same, a composition comprising the same, and a use of same.Type: ApplicationFiled: June 5, 2017Publication date: May 28, 2020Inventors: Hyun-Aee CHUN, Yun-Ju KIM, Sook-Yeon PARK, Su-Jin PARK, Tae-Kwang KIM
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Patent number: 10018325Abstract: Disclosed herein is a light device of a vehicle including: a light emitting diode module emitting light; and a light guide plate having a side on which the light emitted from the light emitting diode module is incident and emitting the light incident on the side to perform surface emission upwardly, in which the light guide plate has a plane shape including at least one concave portion and the light emitting diode module is installed in the at least one concave portion. According to the exemplary embodiments of the present invention, when the light guide plate used in the light device installed at the rear of the vehicle to perform the surface emission is formed in a horseshoe shape or a ring shape, the light emitting diode module may be installed at a concave position of the horseshoe shape or the light emitting diode module may be installed along a ring-shaped inner side, thereby uniformly performing the surface emission over the whole of the light guide plate.Type: GrantFiled: August 31, 2015Date of Patent: July 10, 2018Assignee: Seoul Semiconductor Co., Ltd.Inventors: Tae Kwang Kim, Young Jun Song, Lae Hyun Kim, Yeoun Chul Shon
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Publication number: 20170074602Abstract: Provided is a cooling device including opening/closing holes disposed in one side thereof and a cavity. Each of the opening/closing holes is actively opened and closed according to a temperature of an external heat source, and the cavity is connected to the outside of the cooling device through the opening/closing holes.Type: ApplicationFiled: June 10, 2016Publication date: March 16, 2017Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Junsoo KIM, Seungeon MOON, Tae Kwang KIM, Solyee LIM, Won Chul CHOI
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Publication number: 20160290588Abstract: Disclosed herein is a light device of a vehicle including: a light emitting diode module emitting light; and a light guide plate having a side on which the light emitted from the light emitting diode module is incident and emitting the light incident on the side to perform surface emission upwardly, in which the light guide plate has a plane shape including at least one concave portion and the light emitting diode module is installed in the at least one concave portion. According to the exemplary embodiments of the present invention, when the light guide plate used in the light device installed at the rear of the vehicle to perform the surface emission is formed in a horseshoe shape or a ring shape, the light emitting diode module may be installed at a concave position of the horseshoe shape or the light emitting diode module may be installed along a ring-shaped inner side, thereby uniformly performing the surface emission over the whole of the light guide plate.Type: ApplicationFiled: August 31, 2015Publication date: October 6, 2016Inventors: Tae Kwang Kim, Young Jun Song, Lae Hyun Kim, Yeoun Chul Shon
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Patent number: 8723200Abstract: An LED includes a light-emitting chip, a metal member, and a housing. The light-emitting chip generates light. The light-emitting chip is arranged on the metal member. The housing is combined with the metal member to fix the metal member. The housing has an opening portion exposing at least a portion of the light-emitting chip and the metal member. The metal member includes a base metal layer, a light-reflecting layer arranged on the base metal layer, and a protection layer arranged on the light-reflecting layer and including a metal.Type: GrantFiled: July 1, 2010Date of Patent: May 13, 2014Assignee: Seoul Semiconductor Co., Ltd.Inventors: Jae-Ho Cho, Sean-Jhin Yoon, Tae-Kwang Kim, Kyung-Nam Kim
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Patent number: 8373180Abstract: A side-view type light emitting diode package for emitting light, emitted from a light emitting diode chip, toward a side surface is disclosed. The side-view type light emitting diode package comprises a package body having an opening portion for exposing the light emitting diode chip in a light emitting direction; and a light-transmittable resin covering the light emitting diode chip, wherein at least a portion of an inner wall of the opening portion is formed with a step projection for partitioning the opening portion into upper and lower sections, and the lower section of the opening portion below the step projection is filled with the light-transmittable resin. Accordingly, the light-transmittable resin with the convex lens shape may be easily formed, so that the light emission efficiency thereof can be improved.Type: GrantFiled: September 21, 2007Date of Patent: February 12, 2013Assignee: Seoul Semiconductor Co., Ltd.Inventors: Hwa Ja Kim, Nam Young Kim, Myung Hee Lee, Kyoung Bo Han, Tae Kwang Kim, Ji Seop So
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Patent number: 8360593Abstract: Disclosed is a light emitting diode (LED) package. The LED package comprises a package body having a cavity and a stepped portion positioned on a top portion of the cavity; an LED chip mounted on a bottom surface of the cavity; an encapsulant formed in the cavity to cover the LED chip; and a lens having a pattern and attached to the stepped portion on the encapsulant.Type: GrantFiled: September 19, 2008Date of Patent: January 29, 2013Assignee: Seoul Semiconductor Co., Ltd.Inventors: Tae Kwang Kim, Chung Hoon Lee, Do Hyung Kim, Seung Ryeol Ryu, Chan Sung Jeong, Woong Joon Hwang
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Patent number: 8288785Abstract: An LED includes a light-emitting chip, a metal member, and a housing. The light-emitting chip generates light. The light-emitting chip is arranged on the metal member. The housing is combined with the metal member to fix the metal member. The housing has an opening portion exposing at least a portion of the light-emitting chip and the metal member. The metal member includes a base metal layer, a light-reflecting layer arranged on the base metal layer, and a protection layer arranged on the light-reflecting layer and including a metal.Type: GrantFiled: January 9, 2009Date of Patent: October 16, 2012Assignee: Seoul Semiconductor Co., Ltd.Inventors: Jae-Ho Cho, Sean-Jhin Yoon, Tae-Kwang Kim, Kyung-Nam Kim
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Patent number: 7999280Abstract: Disclosed is a light emitting diode (LED) package employing a lead terminal with a reflecting surface. The package includes first and second lead terminals that are spaced apart from each other. The first lead terminal has a lower portion with an LED chip mounting area, and at least one reflecting surface formed by being bent from the lower portion. Meanwhile, a package body supports the first and second lead terminals and forms a cavity through which the LED chip mounting area and the reflecting surface of the first lead terminal and a part of the second lead terminal are exposed. The first and second lead terminals extend outside of the package body. Accordingly, light emitted from an LED chip can be reflected on the reflecting surface with high reflectivity, so that the optical efficiency of the package can be improved.Type: GrantFiled: July 19, 2007Date of Patent: August 16, 2011Assignee: Seoul Semiconductor Co., Ltd.Inventors: Hwa Ja Kim, Nam Young Kim, Myung Hee Lee, Kyoung Bo Han, Tae Kwang Kim, Ji Seop So
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Patent number: 7935982Abstract: In a side view type light emitting diode (LED) package, a lead frame portion and lead frame electrical contact portions are exposed outside a package body to serve as an additional heat dissipation path. The side view type LED package includes an LED chip, a package body having a side surface with an opening for receiving the LED chip, and lead frames for applying a current to the LED chip. The lead frames include inner leads electrically connected to the LED chip within the package body; electrical contact lower legs extending from the inner leads to a lower portion of the package body and exposed outside the package body in the vicinity of a lower surface of the package body perpendicular to the side surface; and a heat dissipation means extending, separately from the electrical contact lower legs, from at least one of the inner leads outside the package body.Type: GrantFiled: August 5, 2010Date of Patent: May 3, 2011Assignee: Seoul Semiconductor Co., Ltd.Inventors: Nam Young Kim, Tae Kwang Kim, Kyoung Bo Han, Myung Hee Lee
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Patent number: 7928968Abstract: An apparatus for displaying an advertisement image having a plurality of image elements includes a display panel for displaying the advertisement image thereon. The display panel includes a plurality of clusters which are serially connected with one another and are arranged in a pattern same as that of the advertisement image. Each of the clusters has at least one LED cell corresponding to one image element in the advertisement image, respectively, and a driving unit for driving the LED cell to represent the corresponding image element on the LED cell. An image editor performs an editing of the advertisement image by way of changing color and/or brightness of the respective image elements cells. And a control module controls the driving of the clusters in synchronization with an editing period for the advertisement image.Type: GrantFiled: May 10, 2007Date of Patent: April 19, 2011Assignee: Art Ware Co., Ltd.Inventors: Heung Soo Shon, Tae Kwang Kim, Chang Keun Lee, Hyun Sang Cho
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Publication number: 20100315835Abstract: An LED includes a light-emitting chip, a metal member, and a housing. The light-emitting chip generates light. The light-emitting chip is arranged on the metal member. The housing is combined with the metal member to fix the metal member. The housing has an opening portion exposing at least a portion of the light-emitting chip and the metal member. The metal member includes a base metal layer, a light-reflecting layer arranged on the base metal layer, and a protection layer arranged on the light-reflecting layer and including a metal.Type: ApplicationFiled: July 1, 2010Publication date: December 16, 2010Applicant: Seoul Semiconductor Co., Ltd.Inventors: Jae-Ho Cho, Sean-Jhin Yoon, Tae-Kwang Kim, Kyung-Nam Kim
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Publication number: 20100301376Abstract: In a side view type light emitting diode (LED) package, a lead frame portion and lead frame electrical contact portions are exposed outside a package body to serve as an additional heat dissipation path. The side view type LED package includes an LED chip, a package body having a side surface with an opening for receiving the LED chip, and lead frames for applying a current to the LED chip. The lead frames include inner leads electrically connected to the LED chip within the package body; electrical contact lower legs extending from the inner leads to a lower portion of the package body and exposed outside the package body in the vicinity of a lower surface of the package body perpendicular to the side surface; and a heat dissipation means extending, separately from the electrical contact lower legs, from at least one of the inner leads outside the package body.Type: ApplicationFiled: August 5, 2010Publication date: December 2, 2010Applicant: SEOUL SEMICONDUCTOR CO., LTD.Inventors: Nam Young KIM, Tae Kwang Kim, Kyoung Bo Han, Myung Hee Lee
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Patent number: 7804105Abstract: In a side view type light emitting diode (LED) package, a lead frame portion and lead frame electrical contact portions are exposed outside a package body to serve as an additional heat dissipation path. The side view type LED package includes an LED chip, a package body having a side surface with an opening for receiving the LED chip, and lead frames for applying a current to the LED chip. The lead frames include inner leads electrically connected to the LED chip within the package body; electrical contact lower legs extending from the inner leads to a lower portion of the package body and exposed outside the package body in the vicinity of a lower surface of the package body perpendicular to the side surface; and a heat dissipation means extending, separately from the electrical contact lower legs, from at least one of the inner leads outside the package body.Type: GrantFiled: June 27, 2007Date of Patent: September 28, 2010Assignee: Seoul Semiconductor Co., Ltd.Inventors: Nam Young Kim, Tae Kwang Kim, Kyoung Bo Han, Myung Hee Lee
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Patent number: D830655Type: GrantFiled: February 22, 2017Date of Patent: October 9, 2018Assignee: Samsung Electronics Co., Ltd.Inventors: Tae-Kwang Kim, Dong-Hyun Lee, Won-Kyu Lim