Patents by Inventor Tae Kwang Kim

Tae Kwang Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100202131
    Abstract: Disclosed is a light emitting diode (LED) package. The LED package comprises a package body having a cavity and a stepped portion positioned on a top portion of the cavity; an LED chip mounted on a bottom surface of the cavity; an encapsulant formed in the cavity to cover the LED chip; and a lens having a pattern and attached to the stepped portion on the encapsulant.
    Type: Application
    Filed: September 19, 2008
    Publication date: August 12, 2010
    Applicant: Seoul Semiconductor Co., Ltd.
    Inventors: Tae Kwang Kim, Chung Hoon Lee, Do Hyung Kim, Seung Ryeol Ryu, Chan Sung Jeong, Woong Joon Hwang
  • Publication number: 20100133565
    Abstract: An LED includes a light-emitting chip, a metal member, and a housing. The light-emitting chip generates light. The light-emitting chip is arranged on the metal member. The housing is combined with the metal member to fix the metal member. The housing has an opening portion exposing at least a portion of the light-emitting chip and the metal member. The metal member includes a base metal layer, a light-reflecting layer arranged on the base metal layer, and a protection layer arranged on the light-reflecting layer and including a metal.
    Type: Application
    Filed: January 9, 2009
    Publication date: June 3, 2010
    Applicant: Seoul Semiconductor Co., Ltd.
    Inventors: Jae-Ho CHO, Sean-Jhin YOON, Tae-Kwang KIM, Kyung-Nam KIM
  • Publication number: 20100096653
    Abstract: A side-view type light emitting diode package for emitting light, emitted from a light emitting diode chip, toward a side surface is disclosed. The side-view type light emitting diode package comprises a package body having an opening portion for exposing the light emitting diode chip in a light emitting direction; and a light-transmittable resin covering the light emitting diode chip, wherein at least a portion of an inner wall of the opening portion is formed with a step projection for partitioning the opening portion into upper and lower sections, and the lower section of the opening portion below the step projection is filled with the light-transmittable resin. Accordingly, the light-transmittable resin with the convex lens shape may be easily formed, so that the light emission efficiency thereof can be improved.
    Type: Application
    Filed: September 21, 2007
    Publication date: April 22, 2010
    Applicant: Seoul Semiconductor Co. Ltd.
    Inventors: Hwa Ja Kim, Nam Young Kim, Myung Hee Lee, Kyoung Bo Han, Tae Kwang Kim, Ji Seop So
  • Publication number: 20090179219
    Abstract: In a side view type light emitting diode (LED) package, a lead frame portion and lead frame electrical contact portions are exposed outside a package body to serve as an additional heat dissipation path. The side view type LED package includes an LED chip, a package body having a side surface with an opening for receiving the LED chip, and lead frames for applying a current to the LED chip. The lead frames include inner leads electrically connected to the LED chip within the package body; electrical contact lower legs extending from the inner leads to a lower portion of the package body and exposed outside the package body in the vicinity of a lower surface of the package body perpendicular to the side surface; and a heat dissipation means extending, separately from the electrical contact lower legs, from at least one of the inner leads outside the package body.
    Type: Application
    Filed: June 27, 2007
    Publication date: July 16, 2009
    Applicant: Seoul Semiconductor Co., Ltd.
    Inventors: Nam Young Kim, Tae Kwang Kim, Kyoung Bo Han, Myung Hee Lee
  • Publication number: 20080048201
    Abstract: Disclosed is a light emitting diode (LED) package employing a lead terminal with a reflecting surface. The package includes first and second lead terminals that are spaced apart from each other. The first lead terminal has a lower portion with an LED chip mounting area, and at least one reflecting surface formed by being bent from the lower portion. Meanwhile, a package body supports the first and second lead terminals and forms a cavity through which the LED chip mounting area and the reflecting surface of the first lead terminal and a part of the second lead terminal are exposed. The first and second lead terminals extend outside of the package body. Accordingly, light emitted from an LED chip can be reflected on the reflecting surface with high reflectivity, so that the optical efficiency of the package can be improved.
    Type: Application
    Filed: July 19, 2007
    Publication date: February 28, 2008
    Applicant: SEOUL SEMICONDUCTOR CO., LTD.
    Inventors: Hwa Ja KIM, Nam Young KIM, Myung Hee LEE, Kyoung Bo HAN, Tae Kwang KIM, Ji Seop SO
  • Publication number: 20080030519
    Abstract: An apparatus for displaying an advertisement image having a plurality of image elements includes a display panel for displaying the advertisement image thereon. The display panel includes a plurality of clusters which are serially connected with one another and are arranged in a pattern same as that of the advertisement image. Each of the clusters has at least one LED cell corresponding to one image element in the advertisement image, respectively, and a driving unit for driving the LED cell to represent the corresponding image element on the LED cell. An image editor performs an editing of the advertisement image by way of changing color and/or brightness of the respective image elements cells. And a control module controls the driving of the clusters in synchronization with an editing period for the advertisement image.
    Type: Application
    Filed: May 10, 2007
    Publication date: February 7, 2008
    Applicant: ART WARE CO., LTD.
    Inventors: Heung Soo Shon, Tae Kwang Kim, Chang Keun Lee, Hyun Sang Cho
  • Patent number: D535037
    Type: Grant
    Filed: July 27, 2005
    Date of Patent: January 9, 2007
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Tae Kwang Kim, Kwang Il Park